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2008-03-04 Nokia Siemens, TCS tie up for R&D
An R&D agreement has been forged between Nokia Siemens Networks and Tata Consultancy Services. Nokia Siemens Networks will transfer some product engineering and R&D services and parts of its operations and business software business unit to TCS.
2006-11-29 Microsoft buys equity stake in TCS China
Microsoft Corp. has acquired a 10 percent equity stake in TCS China, a joint venture IT services firm working with software services giant TCS and three companies owned by the Chinese government.
2005-03-08 Mentor Graphics offers TCS with design-for-test tools
Mentor Graphics Corp. announced that Tata Consultancy Services (TCS), an information technology consulting and service provider, has selected Mentor Graphics design-for-test (DFT) tools.
2005-10-04 India's TCS launches R&D lab for emerging technologies
India's largest software services company, Tata Consultancy Services (TCS), has opened
2005-07-04 India's TCS inked for Chinese software venture
India Tata Consultancy Services (TCS), one of India's leading software export services companies, has announced a joint venture with the Chinese government and Microsoft Corp. to set up a new entity to address Chinese software and global market needs.
2004-07-02 TI, ARM team to secure wireless transactions
Texas Instruments Inc. and ARM Ltd are combining their respective Omap and TrustZone technologies to develop a silicon-based system for secure wireless transactions.
2003-01-21 Teradyne to supply Kaparel with PCBs
Teradyne Inc.'s Connection Systems Division and Kaparel Corp. have formed a supply agreement for high-performance circuits.
2003-01-23 Teradyne signs Molex as second-source GbX manufacturer
Teradyne Inc.'s Connection Systems Division and Molex Inc. have entered a second-source licensing agreement.
2005-02-08 Teradyne releases 2-pair GbX connector
Boosting bandwidth with increased flexibility are two key advantages of Teradyne Inc. Connection Systems Division's new GbX 2-pair connector.
2005-01-31 Teradyne launches new connector platform for tight spaces
Teradyne Connection Systems Division launched its new Aptera connector platform that offers a low-profile solution for server, storage and networking apps.
2002-02-07 Teradyne GbX connector features <2 percent crosstalk
Featuring a high density level and <2 percent crosstalk, the GbX connector offers an upgrade path beyond existing 2mm platforms, and provides ease of routing and reduced capacitance for 10Gbps Ethernet interconnect.
2005-04-08 Software upgrade doubles test capacity for memory devices
An enhanced version of TCS for MOSAID's MS4205 family of memory test systems doubles the test capacity for memory chips to 8Gb.
2002-12-09 Comsys EDGE IP powers TI wireless chips
Comsys Communications and Signal Processing and Texas Instruments Inc. (TI) have announced that Comsys will deliver EDGE baseband IP to TI to be used in its TCS family of wireless chipset solutions.
2008-02-04 High-speed connector platform comes in stacking version
Amphenol TCS has introduced a stacking version of its 20+ Gbit/s XCede backplane connector platform, providing performance headroom for mezzanine card applications.
2008-01-28 Connector moves data at 10Gbit/s+ rates
Amphenol TCS has launched its eHSD connector as an upgrade to the VHDM-HSD platform, with significantly less crosstalk and scalable data rates greater than 10Gbit/s.
2003-06-03 ART speech recognition solution available on TI GSM platform
Advanced Recognition Technologies announced the porting of its smARTspeak XG speech recognition solution to TI's TCS family of "antenna-to-applications" chipset solutions.
2003-11-04 TI, Sun Micro partner on wireless solutions
Texas Instruments Inc. (TI) and Sun Microsystems Inc. have collaborated to jointly deliver optimized end-to-end wireless solutions for 2.5G and 3G networks in the second quarter of 2004.
2004-11-24 TI Bluetooth solution uses 90nm technology
TI released what is touted to be the industry's first single-chip Bluetooth wireless networking solution using advanced 90nm process technology.
2005-09-26 Teradyne's single-ended connector touts highest density, speed
Teradyne has unveiled its new Ventura high-speed, high-density connector, which the company claims to be the fastest single-ended interconnect with the most signal pins per inch of any connector available today.
2004-01-08 Teradyne facility receives ISO 14001 certification
Teradyne Inc. has announced that the Nashua, New Hampshire PCB manufacturing facility of its Connection Systems Division has been recently certified to the ISO 14001 Environmental Management Standard.
2004-03-25 Teradyne connector offers 151 signals per linear inch
Teradyne has launched its GbX L-series connector that enables designers to create custom connector configurations.
2007-03-16 Signal-integrity issues plague multigigahertz era
Engineers want a new bag of tricks to manage signal integrity as data rates soar into multigigahertz territory.
2006-02-13 Resistor networks provide voltage monitoring in power apps
Caddock Electronics has introduced its Type VMN transient tolerant voltage monitoring resistor networks for voltage measurement circuits in industrial and commercial power metering applications.
2006-05-08 Precision film resistors boast low temperature coefficient
Caddock Electronics has introduced the USF300 series of precision film resistors with tight stability and low temperature coefficient values for high-accuracy, precision analog designs.
2005-12-26 Outsourcing market to restructure
Trends in the global outsourcing industry point to a market ripe for restructuring, according to a report by market researcher Everest Group.
2006-03-16 One MIPS core, not many, does the trick
MIPS Technologies has unveiled a next-generation core with a 'virtual CPU' architecture.
2006-02-13 Multithreading CPU suits embedded applications
MIPS Technologies introduced its MIPS32 34K family of cores, a multithreading solution for embedded applications.
2002-07-30 Indian software giant to offer chip design services
Tata Consultancy Services said recently that it will enter the chip design business.
2008-04-04 Indian firms eye tie-ups to drive business
A number of Indian electronics companies are embracing the philosophy that they must find partners to help conceive and design new products as quickly as possible.
2005-02-02 India, China look to collaborate on software
Potential rivals for the world's software outsourcing business, India and China, are taking steps to increase the level of mutual business activity in this industry.
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