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2004-11-05 TDK unveils three smart card interface circuits
TDK debuted its 73S8023C, 73S8024C and 73S8010C smart card interface circuits that possess an efficiency of 85 percent and a small size step-up/step-down converter
2003-01-28 TDK ships SoC for EMV smart card terminals
The company is sampling the 73S1121F smart card terminal controller, which is claimed to be the first complete SoC for smart card terminals.
2003-06-11 TDK Semiconductor extends Ethernet transceiver line
TDK Semiconductor Corp. announced that it has extended the availability of its 78Q2120 Ethernet transceiver line and customer designs which allows the porting of new semiconductor processes.
2004-11-09 TDK rolls out SoCs for low-cost smart card readers
During the Cartes 2004, TDK unveiled its new TDK 73S12xx family of 8bit SoCs dedicated to low-cost smart card readers
2004-12-13 TDK rolls out smart card reader software stack
TDK released a smart card reader software stack that will facilitate the design of its controller-based smart card reader ICs into ready-to-use smart card reader modules
2002-01-07 TDK modem IC packs functions needed for V.22bis
The 73M2901CL is a 3.3V single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem.
2002-12-09 TDK modem front-end supports V.22bis, V.92
TDK Semiconductor has unveiled the 73M1901 soft modem analog front-end that supports V.22bis and V.92.
2002-06-26 TDK LIUs integrate programmable jitter attenuator
TDK Semiconductor Corp.'s family of single-chip, multichannel DS3/E3/STS-1 LIUs integrates a programmable jitter attenuator that enables the devices to meet E3/T3 jitter standards.
2002-04-18 TDK LIU hits 155.52Mbps
A SONET/SDH LIU from TDK Semiconductor Corp. operates at 155.52 Mbps (STS-3 or STM-1) and provides a synchronized clock that can be used for backplanes running at 311MHz.
2003-11-14 TDK interface chips suit identification environments
TDK Semiconductor Corp. has released three low-cost smart card interface ICs that are designed for use in payment and identification environments.
2004-05-05 TDK embedded modem offers cost, footprint reduction
TDK's latest embedded modem solution offers a 25 percent cost and 35 percent footprint reduction compared to other transformer or silicon DAA solutions
2005-08-23 TDK changes corporate name to Teridian Semiconductor
Mixed-signal IC provider TDK Semiconductor Corp. has changed its name to Teridian Semiconductor Corp., which is effective immediately.
2005-04-05 TDK AFE supports software selectable PSTN terminations
TDK's 73M1903C is targeted at the emerging MFP/Fax architectures and features worldwide PSTN compliance with programmable line terminations
2015-12-21 TDK to expand magnetic sensor biz with Micronas buy
The acquisition will boost TDK's sensor business by combining its magnetic sensor business, with strengths in magnetic materials, and Mironas' products, technologies and expertise in hall sensors
2002-05-28 TDK optical sensors use amorphous silicon semiconductor
TDK Corp.'s BCS3216G1 and BCS5030G1 optical sensors for visible light incorporate the use of an amorphous silicon semiconductor, making them highly receptive to visible light and unreceptive to infrared light.
2001-04-10 Replacing the TDK 78P7200/2241 with the DS3150
This application note illustrates how to replace the TDK devices with Dallas Semiconductor's DS3150 in an existing design and how to set up a design to use either the TDK78P2241 or the DS3150.
2003-06-28 Replacing the TDK 78P7200/2241 with the DS3150
This application note discusses the procedure to replace the TDK devices with the DS3150 in existing designs
2015-12-02 Renesas inks deal to transfer wafer fab to TDK
TDK is intensely focused on efforts to expand its businesses and their profitability through a concentration on the electronic components business targeted at its core markets
2016-05-02 Renesas confirms transfer of Tsuruoka Factory to TDK
An agreement between Renesas Electronics and TDK saw the transferr of Renesas Semiconductor Manufacturing's Tsuruoka Factory to TDK on April 28, 2016.
2004-12-03 Power meter SoC includes digital temperature compensation
TDK Semiconductor rolled out a new member of its power meter SoC product line.
2004-06-09 Hengdian magnetic material meets global standards
Hengdian Group DMEGC Co. Ltd announced that the technology of its soft magnetic materials DMR4KDC, DMR4KBQ and DMR2KP is at par with those of its foreign counterparts.
2003-03-25 Embedded modem eliminates dedicated crystal oscillator
The 73M1903 embedded modem analog front-end from TDK Semiconductor Corp. eliminates the need for a dedicated crystal oscillator.
2005-04-15 Cheapest card electrical interface?
TDK's new smart card interface IC utilizes the same LDO voltage regulator architecture as the existing 73S80xxR family, bringing outstanding electrical performance such as low noise, high card current, low current consumption and very low power dissipation at the lowest possible cost
2000-02-25 AVPro 5001 Quad A/V Drivers
This application note describes the AVPro 5001 device, an audio/video driver IC that supports four video inputs and two audio inputs for multimedia applications. This application note describes the AVPro 5001 device, an audio/video driver IC that supports four video inputs and two audio inputs for multimedia applications.
2016-01-04 Top 15 deals that influenced analogue, sensors in 2015
Here are some of the biggest and most important business deals and synergies in 2015 that had a huge impact on analogue, MEMS, sensors and the semiconductor industry as a whole
2013-11-11 Multilayer varistors tout 0.47 x 0.47mm footprint
TDK released a series of EPCOS multi-layer varistors of the CeraDiode family that the company said includes the most compact, flattest and most rugged varistor for the ESD protection of mobile devices
2004-05-04 Mentor Graphics, X-Fab roll out three TDKs
Mentor Graphics and X-Fab have announced the first three in a series of technology design kits supporting X-Fab's CMOS process technologies.
2009-04-29 Dialog Semi goes beyond power management
Dialog Semiconductor CEO Jalal Bagherli said system power management will remain the company's main area of expertise but disclosed they are also working on low-power display controllers for PMOLEDS as well drivers for MEMS and E-Ink based displays
2009-02-04 Analysis: What's in store for IBM's chip unit?
IBM Corp.'s recent move to implement job cuts within its semiconductor unit follows a dramatic slump in sales, product setbacks and numerous false starts in the sector
2016-03-15 The endless pursuit of smaller packages
In this article, we explore the creativity in semiconductor package integration, while anticipating the release of the Samsung's Galaxy S7 and the iPhone 7
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