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2013-01-24 Imec, Cadence team up for DFT solution for 3D memory
Cadence's and imec's solution includes generation of DRAM test control signals in the logic die and inclusion of the DRAM boundary scan registers test access mechanisms of the 3D test architecture
2009-09-02 Silicon circuit board trumps ASICs
Startup siXis Inc. has selected foundry SVTC Technologies to fabricate its embedded silicon board computing modules, which claims to bridge the gap between PCB prototypes and ASIC-based designs.
2015-07-29 Extending Moore's Law: Progress underscores SiGE, nm-ICs
Looking closer at the industry, much attention has been devoted to silicon-germanium (SiGe) heterojunction technology as the next step in building silicon-based ICs down below 10nm.
2012-12-20 A*STAR offers 2.5D through-silicon-interposer MPW service
The service is aimed at providing a cost-effective platform to do research and development prototyping and proof-of-concept in 2.5D TSI technology.
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