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2007-12-04 Universal GPS, Galileo RFIC comes in tested die
Maxim Integrated Products has introduced the MAX2769E/W, claimed to be the industry's first universal GNSS receiver for GPS, WAAS, Egnos, Galileo and Glonass navigation satellite systems in a single tested die.
2003-06-18 Silicon Wave Bluetooth die provides high-density integration
Silicon Wave's UltimateBlue 3000 radio processor and the SiW1712 radio modem are available as standalone bare die products
2008-09-08 KGD Assembly
This application note is relevant for any die product not packaged and at risk of exposure to UV light, plasma clean or X-ray during module assembly. In addition to KGD, Known Tested Die (KTD) and Non-Singulated Wafers are available for commercial and industrial applications.
2015-04-15 SRC to standardise 3D chip testing
Duke University lays down the plan to designing-for-test the TSVs, so that large inexpensive probes can touch many TSV microbumps simultaneously to take measurements that ensure defect-free stacked die
2004-12-01 Getting inside the SiP
Design teams are taking a harder look at the SiP alternative to conventional SoC design as the advantages of combining multiple dice into one package have been well-documented.
2008-10-01 Chip package options abound
When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer.
2011-02-22 ST-Ericsson NovaThor platforms eye smartphones, tablets
The NovaThor platforms combine application engines, modems and connectivity chips into integrated and tested chipsets that can be used in smartphones and tablets
2011-12-16 ST develops contactless testing wafer
STMicroelectronics has produced what it claims as the world's first semiconductor wafer whose dice were fully tested without contact probes
2002-04-22 Ismeca tape-and-reel machine system determines KGD via single test
The MP 630 tape-and-reel machine from Ismeca Europe SA is claimed to be first integrated testing, marking, and handling system capable of determining known good die (KDG) packages through a single test
2006-05-16 Embedded experts: Fix code bugs or cost lives
The Therac 25 was supposed to save lives by zapping tumors with targeted blasts of radiation. Instead, the device delivered massive overdoses that killed three patients and injured several others because of software glitches by a lone programmer whose code was never properly inspected and tested
2015-07-28 A closer look inside SK Hynix's 1st high bandwidth memory
SK Hynix's HBM has a 1,024-wide bus. It employs a base logic die as an interface between the four DRAM die stack and an interposer that supports both the HBM modules and the AMD GPU
2007-07-02 GNSS receiver achieves cascaded NF of 1.4dB
Maxim Integrated Products introduces the MAX2769, the industry's first universal, single-chip global navigation satellite system receiver for GPS with total cascaded NF of 1.4dB.
2005-06-14 Aehr Test rolls out new wafer tester
Aehr Test's new FOX-1 full wafer contact test and burn-in system is focused on testing an entire wafer of devices with a single touchdown or for short-duration burn-in and test.
2013-04-30 Why flash storage is important to MEMS
Solid state drives operate at higher temperatures, and MEMS devices can withstand that environment because they regulate themselves.
2004-03-04 Vishay expands CTN line with new devices
Vishay Intertechnology has added new devices with low absolute TCR to its CTN series of 30mil center-tapped nichrome resistor chips.
2002-10-23 Virage to license logic IP
Virage Logic Corp. is making a full frontal assault into logic IP.
2014-07-28 Utilising ARM Cortex-M based SoCs (Part 2)
The second instalment compares the capabilities of a standard microcontroller approach to the design of an embedded application to that of a system on chip approach.
2008-05-07 TSMC, Intel, Samsung join hands on 450mm shift
Intel, Samsung and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node.
2007-08-23 TSMC begins 0.13? embedded flash production
Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has qualified its 0.13? embedded flash process and has entered production.
2015-03-06 Touchdowns are for football, not semiconductors
Executive David Park ponders the threat of expensive product recalls to semiconductor and device manufacturers, as they try to balance high product yield levels and good product quality.
2006-07-03 Tokyo Electron unveils probe mark analyzer
Tokyo Electron has released a new probing accuracy diagnosis system that is integrated with the company's 300mm fully automatic wafer prober.
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies.
2004-01-16 Tackling test for next-gen WLAN RF ICs
The emerging generation of WLAN chips would accelerate the demand for more differentiated WLAN RFICs.
2012-05-24 Synchronous step-down switching regulator offers 96% efficiency
Synchronous rectification by Linear Technology's LT8610 synchronous step-down switching regulator enables the DC/DC converter to deliver 96 percent efficiency from a 2.5A, 42V input.
2007-10-29 Switching regulator handles cold-crank in cars
A switching regulator and a linear controller suitable for load dump and cold-crank conditions found in automotive applications has been launched by Linear Technology.
2016-04-21 Switching regulator flaunts 3V to 42V input voltage range
The LT8608 from Linear Tech flaunts a unique synchronous rectification topology that promises 93 per cent efficiency while switching at 2MHz to target automotive and industrial applications.
2008-12-19 Switching regulator boasts 60V transient protection
Linear Technology Corp. has released the LT3682, a 1A, 36V input step-down switching regulator with input transient protection up to 60V.
2009-11-27 Switching regulator boasts 2.8?A quiescent current
Linear Technology Corp. debuts the LT3991, a 1.2A, 55V step-down switching regulator with an integrated boost diode.
2005-11-11 Structured ASIC devices embed PCI Express physical layer
ChipX has introduced a new structured ASIC family that it claims is a low-risk alternative to traditional ASIC and FPGA devices
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