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2008-03-04 Intel packs power in sub-25mm 'Atom' chip
Intel's Atom processor includes support for multiple threads for better performance and increased system responsiveness, all on a chip that measures less than 25mm?.
2011-05-25 APUs offer 39% power reduction
AMD unveils the AMD Embedded G-Series APUs with thermal design power ratings of 5.5W and 6.4W, which boasts up to 39 percent power savings compared to its earlier versions.
2012-06-28 AMD APU cuts embedded apps' power use, footprint
AMD's embedded G-T16R accelerated processing unit delivers thrice the performance of the company's Geode LX processor.
2008-12-03 Vista-compliant audio chips are space-, power-savers
Maxim Integrated Products introduces the MAX9791/MAX9792, the industry's first Windows Vista-compliant, audio subsystem ICs for notebook computers.
2010-04-16 Verify your PCB/IC thermal modeling
Shown here is a relatively easy way to determine if the design is the best it can be, thermally speaking, without cumbersome or time-consuming methods or expensive software analysis
2005-09-12 Streamlining power delivery systems for servers
The need for more efficient systems has become paramount especially in servers and main frames.
2010-11-26 Single-chip PROFIBUS solution cuts a third off power use and cost
TI has just announced its AM1810 Sitara ARM microprocessor, a single-chip ARM9 solution with an integrated PROFIBUS interface. This low-power chip does away with an external PROFIBUS, ASIC or FPGA, saving development time while enhancing system performance
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution
2005-05-02 Science and art of telecom thermal design
Good thermal design is equal parts science and artan iterative process requiring constant adjustments based on real-world feedback
2013-01-29 Save power in LCD TVs with LED driving techniques
New design techniques in LED driver circuits promise to deliver significant energy savings that will go a long way to helping TV manufacturers meet the tough requirements for power consumption
2007-07-30 Resistor in high-power package offers low thermal resistance
TT electronics IRC Advanced Film Division's MHP20S Series TO-126 resistor features a non-inductive thermal resistant design and is rated up to 20W
2012-07-17 Optimizing FPGAs for low power apps
Know the low-power design techniques for the families of 7 series FPGAs
2015-11-16 Microsoft Surface Pro 4 flaunts better thermal performance
One of the biggest criticisms of the Surface Pro 3 was its tendency for overheating, with many complaints that the top right-hand corner of the device where the CPU is found would hit high temperatures.
2015-07-09 Manage thermal optimisation during PCB design
Learn about the development in computational fluid dynamics technology, which allows modifications to the thermal model, and thus frees up valuable engineering time for higher value activities
2010-03-15 LED submounts deliver 3K/W thermal resistance
Vishay Intertechnology Inc. is offering a series of ceramic LED submounts that offer ultralow thermal resistance down to 3K/W
2012-05-29 JEDEC releases LED thermal testing standards
The JESD51-5x series is in compliance with the International Commission on Illumination's existing LED measurement recommendations.
2005-04-06 IBM offers design services for Cell integration
IBM Corp. will offer new design services to help companies integrate Cell microprocessor technology into electronics products, the company said
2009-01-15 High-efficiency AC/DC power supply carries 2800W
Murata Power Solutions has introduced the D1U-H-2800-52-Hx, a 2800W power-factor-corrected AC/DC front-end power supply that offers power density of 27.7W per cubic inch
2004-12-16 Flomerics upgrades thermal/electrical PCB tool
Flomerics released a new version of its FLO/PCB electronic and thermal PCB design collaboration software
2001-08-27 Direct RDRAM thermal design methodology: Determining plate temperature based on die test temperature and device power
This application note establishes a methodology that a module vendor can follow to define the maximum allowable plate temperature, based on the following options they have in designing their module: device power; thermal interface material; module cover (or heat spreader); and maximum allowable device temperature
2007-10-18 Design Class D audio amps into portable applications (Part 2
To maximize the benefits of using Class D amps, it is important to understand the fundamental difference in operation between Class D and Class AB amplifiers, since each amplifier technology requires different considerations when designing systems that incorporate audio.
2007-09-05 Design Class D audio amps into portable applications (Part 1
To maximize the benefits of using Class D amps, it is important to understand the fundamental difference in operation between Class D and Class AB amplifiers, since each amplifier technology requires different considerations when designing systems that incorporate audio.
2013-08-20 Dealing with SMPS efficiency, thermal behaviour
Find out how to tackle the efficiency and thermal behaviour of SMPS with SPICE technology
2009-04-30 DC/DC converters fit power-hungry apps
TDK-Lambda has broadened its DC/DC converter line-up with the introduction of the new iQG Series, providing high true useable power in an industry standard quarter-brick footprint
2008-07-03 Confab stresses potential thermal crisis in IC design
At the Design Automation Conference in Anaheim, California, an educational panel addressed the thermal issue in IC design. Two key questions raised were when will this issue be emerging as a crucial concern? What are the solutions to solve this potential crisis
2012-04-30 Boost PMIC performance by optimizing package devt during design
Know the advantages of using a QFN device as opposed to BGA, from both a performance and cost viewpoint.
2015-06-01 Advantages of LED power supply
In this article, we consider the advantages of an LED power supply compared with standard ITE power supplies
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2002-03-25 ADI thermal controller lowers PC noise
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