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2006-07-07 SDRAM-DDR memory unit touts multichip plastic packaging
Austin Semiconductor has launched its 1.2Gbit, SDRAM-DDR memory family in a 219-pin BGA.
2000-12-01 Mounting guidelines for the SUPER-220
This application note is intended to outline the thermal options of the SUPER-220 package available to designers relative to interface materials, clip types and the contact forces required for excellent thermal contact
2004-06-15 GE Toshiba Silicones opens materials center in Shizuoka
GE Toshiba Silicones has launched its new electronic materials technology center in Oyama-cho, Shizuoka, Japan.
2006-07-25 CardBus connector includes heat sink
Tyco's standard CardBus connector technology, based on PCMCIA standards, integrates a heat sink to address thermal concerns in a variety of applications, including STBs and flat screen TVs
2013-09-24 Researchers create densest array of carbon nanotubes
A team from Cambridge University in Englan said the recently developed material can help improve thermal interface materials, battery electrodes and supercapacitors.
2013-08-16 SACM drastically improves drop-shock performance
The SACM solder alloy from Indium Technology offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling
2008-08-07 Researchers confirm lithium batteries can be used in cars
French researchers claim they can explain why lithium iron phosphate, to be used in future lithium batteries, conducts electricity despite being an insulating material
2012-04-25 Molex looks into 25Gb/s interconnect
The Molex ZXP Modular I/O Interconnect System is a small form-factor pluggable interface supporting data transmission at speeds beyond SFP+ and protocols such as 100 Gigabit Ethernet
2006-08-18 Solution enables high-speed 25m backside wafer coating
DEK announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25m in thickness.
2003-11-20 JMC CPU coolers suit Intel processor
JMC Products has launched a new line of low-cost Tiger CPU coolers that are compatible with the Intel Pentium 4 processor.
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2013-11-15 Bergquist uncloaks thermally conductive gap filling
The Gap Pad 1450 features a permanent polyester (PEN) liner that allows reworking and enhances mechanical compliance in low-stress applications.
2013-10-23 3-phase MOSFET bridge APM handles 2kW load
A three-phase bridge MOSFET automotive power module can be used to improve the system design for electrified automotive accessories.
2015-03-20 Power module packaging eases power electronics issues
The power packaging market is on the rise, pulled by the interconnection and substrate segments, respectively 14 per cent and 13 per cent between 2014 and 2020, revealed Yole.
2015-07-23 What will drive 5G to the next level?
NYU Wireless has spent years creating mmW channel modes. Nevertheless, detailed system designs and improved architectures must be developed before mmW products can enter the market in a real way.
2014-09-26 Vision in wearables: Broader applications, functions
Vision processing can now take place right on your wrist or your face at price points that enable adoption by the masses. This article tackles a key factor in this burgeoning technology success story.
2008-05-12 TFT LCD modules feature replaceable LED backlights
TAEC has rolled out a new color active-matrix TFT-LCD module product lineup for industrial applications that incorporates long-life, replaceable LED backlighting systems.
2006-06-15 Temperature, voltage sensors use fast SST bus
Analog Devices' ADT748x family of digital temperature and voltage sensors employ the fast Simple Serial Transport bus for high-performance applications.
2015-06-11 Smart glass taps AR to take on consumer, industrial apps
Emerging technologies like AR comes with a series of challenges and opportunities. Still, as additional use cases develop the possibilities are endless.
2011-03-08 Silver, diamond make cooling composite for defense systems
Georgia Tech Research Institute researchers have developed a composite of silver and diamond for cooling microelectronics used in defense systems such as phased array radars.
2013-03-14 Sensor makers need scalable product lines to compete globally
Honeywell's James McKenna talks about several technology trends in the medical device market and how those affect sensor manufacturers.
2014-04-01 Selecting housing materials for DDR4 memory module
The design and type of connector determines the set of materials that can be considered for the housing.
2013-01-29 Save power in LCD TVs with LED driving techniques
New design techniques in LED driver circuits promise to deliver significant energy savings that will go a long way to helping TV manufacturers meet the tough requirements for power consumption.
2007-08-30 Process makes leaded devices Pb-free
A study presented a process by which leaded devices are converted to Pb-free for use in consumer-grade electronics.
2012-01-12 Precisely measure signals in weigh scale
Here's how to measure this signal levels accurately to meet the requirements of precision measurement for weighing scales.
2007-10-18 Physical sensors drive MEMS consumerization wave (Part 1)
Benedetto Vigna notes that we are living today in the commercial era of MEMS Consumerization where microphones, motion and pressure sensors are the main actors. He believes this trend will continue for the next five years.
2005-03-21 Philips claims phase-change memory low-voltage progress
A team from Philips Research (Eindhoven, The Netherlands) is due to publish details of a chalcogenide non-volatile phase-change memory cell made from doped antimony-telluride which has a low threshold voltage and which should therefore scale with future integrated circuit manufacturing processes.
2014-03-10 Perform electrical characterisation of biosensors
Proper testing of the electrical portions of these sensors is essential to support their development.
2012-05-28 PCM progress report no. 7: A look at Samsung's 8-Gb array
Here's a discussion on the features of Samsung's 8-Gb array.
2012-03-15 PCM progress report no. 6: Recent advances in phase change memory (Part 2)
The second installment of this two-part series tackles other recent developments in PCM, including fabrication of a 1 Gb PCM array with a 4F2 cell size.
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