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2012-03-01 PCM progress report no. 6: Recent advances in phase change memory (Part 1)
This series looks at some of the most recent phase change memory developments. Part 1 reviews structural and materials advances, focusing on both benefits and challenges.
2012-02-23 PCM progress report no. 5: Scaling issues
Learn about the possible approaches to achieve the scaling necessary to make PCM a commercial success.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2004-04-01 Optical switch benefits from off-chip drive
As more electrostatic MEMS-based optical-switch products penetrate the market, scalability, reliability and tilt precision take on increased significance.
2013-03-14 Numerical model to aid in nanophotonic designs
The numerical model developed by A*STAR researchers could be an invaluable tool for designers in nanophotonics as it can simulate the performance of circuits that rely on light.
2015-09-01 Mystery in memory: Why 3D XPoint is not PCM
By keeping secret the technology behind 3D XPoint memory, Micron and Intel gave the engineering community a challenge by using phrases such as "new recipe," "bulk switching," "fundamental and new."
2014-02-28 Moisture sensitivity levels for plastic-encapsulated ICs
Learn about the use of acoustic microscopy to find internal defects during the assigning of the sensitivity levels.
2005-09-13 Metrology tool offers atomic layer measurement accuracy
A manual, benchtop non-destructive R&D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.
2008-03-03 MEMS gear up for medical mission
Microelectromechanical-system-based inertial and motion sensors are finding slots in medical applications, with demand fueled by implantable devices that must be highly reliable and very small, as well as by handheld devices for home monitoring and diagnostics.
2002-06-19 Materials transitions stalk CMOS scaling
With the transition to copper and low-k interconnects showing just how difficult changes in materials can be, technologists gathered at the Symposium on VLSI Technology to consider a brace of materials challenges?ranging from new gate oxides to SOI and strained-silicon channels.
2013-07-29 Making 3D NAND flash practical
Learn about the key features and benefits of SMArT scheme which is touted to open the 3D NAND flash era.
2014-04-02 Issues in embedding components within PCB substrates
Embedding components within a PCB substrate provides a host of benefits, but this alternative approach demands support from the entire supply chain.
2012-01-16 Integrate power mgmt functions for energy harvesting
Learn about the functional blocks needed for this role in a harvesting design.
2012-11-20 Impact of crystal electrodes on PCM (Part 1)
Part 1 tackles the seeded-bridge model that allows the novel use of elevated-temperature data-retention results to explore the set parameters of PCM devices.
2014-12-19 IBM claims PCM non-volatility not necessary
Ron Neale gets down to the nitty-gritty of IBM's invited paper at IEDM 2014. IBM has stated that for PCM, non-volatility/data-retention is no longer needed.
2014-02-14 How much power can you derive from a brick?
Find out how much power may be extracted from a power brick.
2012-11-27 Georgia Tech researchers advance graphitic nanojoints
A team of researchers from the Georgia Institute of Technology used a technique based on electron beam-induced deposition to develop the graphitic nanojoints.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine.
2007-11-19 Enhance system safety with battery management electronics
Ensure total battery monitoring and prevent catastrophic battery events with battery management electronics.
2008-07-16 Door zone devices improve car comfort, convenience
In modern vehicle doors, the control of various loads and functions is realized increasingly by using smart power semiconductor devices. The quantity of the functions to be controlled has been constantly increasing during the last few years, and different loads have been integrated inside the electronics.
2015-10-29 Digi-Key COO talks about industry consolidation, evolution
Although the company logged relatively flat growth this year, Dave Doherty predicts continued growth as a result of new design and manufacturing trends in the semiconductor space.
2016-01-07 Cost-effectively transition to brushless DC motors
Brush-type DC motor solutions can be replaced 1:1 by a BLDC motor system, that on the outside, look like a conventional motor but inside pro- vide all advantages needed to realise intelligent motion control.
2005-08-22 Constructing the next transistor
The planar metal-oxide-semiconductor field-effect transistor appears to be approaching the end of its useful life
2012-04-25 Compliant-pin tech targets automotive apps
Molex's EON1.0, EON1.45 and EON1.80 connectors can be used on both the soldered and component sides of the PCB, allowing double-sided PCB assembly.
2011-08-08 Circuit protection units ease transition to new automotive technologies
Learn how circuit protection devices can address the challenges brought about by the demand for increased number of power components and high-data-rate connections in automotive designs.
2011-08-11 Circuit protection solutions target new vehicle trends
With electric vehicles and hybrid electric vehicles also addressing the world's energy and emissions crises, automakers and battery manufacturers are rapidly developing new materials and solutions to advance those technologies.
2014-05-14 Assessing correlated electron memory claims by 4DS
4DS Inc. now claims that the operation of its memory is based on strongly correlated electron-effect Mott-like transition.
2013-05-28 Annular electrodes as PCM solution (Part 2)
Learn about the possible advantages and limitations offered by nanotechnology and self-assembly techniques.
2013-05-24 Annular electrodes as PCM solution (Part 1)
Fine-tuning parameters such as electrode diameter and edge thickness help reduce current density.
2015-09-01 Acoustic surface mapping detects IC package warpage
Plastic IC packages like BGAs and PQFPs sometimes have potentially lethal construction defects, such as non-bonds, voids and cracks. You can acoustically map surface flatness to locate package warpage.
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