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2010-10-29 Fraunhofer CNT selects anneal system for 3xnm
Mattson Technology Inc. reports that its Millios anneal system has been chosen for joint projects with the nanoelectronics R&D center's IC partners.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine.
2007-10-19 Flat-panel audio design: Only the screen is flat, not the audio
Designing audio amplifiers for flat-panel TVs involves several challenging and juxtaposed issues. Engineering is usually fraught with making trade-offs and there�s no better example than in flat-panel design.
2013-11-20 Five MEMS devices unveiled at MEMS Exec Congress
Bosch released two MEMS chips geared for the connected Internet of Things (IoT) applications while Merit Sensor's temperature-compensated pressure sensors are aimed at medical and industrial markets.
2013-06-11 Fast-charge tech squeezes more juice out of Li-ion cell
TI's bq27530 and bq27531 touts the firm's patented MaxLife fast-charge technology that claims to allows consumers to charge single-cell Li-ion batteries faster and experience longer battery life.
2004-02-25 Fairchild power device saves board space
Fairchild Semiconductor has announced that Daikin Ind. Ltd has selected its 600Vac, 10A Mini-SPM to power Daikin's 3-phase air conditioner inverter systems.
2010-08-06 Facility provides customized precision testing for LED design
OPTEK Technology’s LED test facility provides OEMs 100 percent color temperature/intensity binning.
2000-11-01 Extraction critical for RF design
Current CMOS technology is a viable candidate for portable communications devices. Modern deep-submicron MOS transistors have more than enough speed to handle high-frequency or RF signals.
2013-05-16 Exploring the gallium nitride technology
Discover why GaN technology is touted to displace silicon MOSFET devices.
2013-09-30 Exploring light sources for all projector sizes
Powerful compact light sources are necessary to ensure that image quality keeps pace with this process of miniaturisation.
2013-07-03 EVG unveils room-temperature debonding platform
The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding systems in addition to the company's ZoneBOND technology.
2016-02-18 Energy harvesting calls for full-spectrum MCU efficiency
Energy harvesting is becoming a practical option for an increasingly wide range of sensor-oriented designs for the internet of things. Find out why.
2009-06-19 Eighth-brick DC/DC converter delivers up to 240W
Ericsson Power Modules has introduced BMR454, a DC/DC converter that delivers double the power of most conventional eighth-brick modules.
2009-03-13 Ease real-time solder joint fault detection in FPGAs
Without early detection, electrical anomalies caused by solder joint faults can result in the catastrophic failure of mission-critical equipment.
2015-07-30 Diamond substrate unleashes GaN potential
Diamond substrates and heat spreaders enable GaN devices to operate near its peak power output without degradation in lifetime.
2013-01-16 Developing a liquid level control/delivery system
Here's a cost-effective, low-power, liquid-level control and delivery system based on data acquisition systems that use a compensated silicon pressure sensor and a high-precision delta-sigma ADC.
2008-08-01 Developing a green product development strategy
One of the most difficult steps in the initiation of a green product development strategy is where to get started. The green knowledge base for product development is widely distributed and not readily available within the organization, in the design or process teams.
2008-03-27 Designing RF with op amps (Part 1)
Operational amplifiers were not originally thought of as candidates for RF design, but the advent of newer, faster devices has made them an attractive option for some applications.
2007-10-18 Design Class D audio amps into portable applications (Part 2)
To maximize the benefits of using Class D amps, it is important to understand the fundamental difference in operation between Class D and Class AB amplifiers, since each amplifier technology requires different considerations when designing systems that incorporate audio.
2007-09-05 Design Class D audio amps into portable applications (Part 1)
To maximize the benefits of using Class D amps, it is important to understand the fundamental difference in operation between Class D and Class AB amplifiers, since each amplifier technology requires different considerations when designing systems that incorporate audio.
2006-08-28 Current sensing resistor in 2512 casing runs at 275C
Vishay Intertechnology has announced a new high-temperature 1W surface-mount Power Metal Strip resistor, said to be the industry's first current sensing resistor in the 2512 case size to operate in the -65C to 275C temperature range.
2016-01-07 Cost-effectively transition to brushless DC motors
Brush-type DC motor solutions can be replaced 1:1 by a BLDC motor system, that on the outside, look like a conventional motor but inside pro- vide all advantages needed to realise intelligent motion control.
2008-11-03 Compact power supplies are PICMG 2.11 compliant
Murata Power Solutions has introduced three new PICMG 2.11 compliant CompactPCITM high reliability power supplies.
2008-04-16 Class D amps liven up audio in flat-panels
The latest developments in audio power amplifier echnology are increasing the sound quality in flat-panel displays to match the superb image quality.
2012-09-12 Choosing the best resistor technology for particular apps
An effective price-cost-benefit-risk analysis must be conducted for each application to ensure selection of the appropriate resistor.
2011-04-20 Chip resistors offer 0.0025% stability
Vishay Precision Group introduces a series of ultra-high-precision Z1-Foil wrap-around chip resistors with exceptional load-life stability of 0.0025 percent (25ppm) at 70C and rated power for 2,000 hours.
2006-07-31 Chassis targets apps requiring multiple PXI/cPCI modules
Adlink has released a compact 3U chassis with 14 PXI/Compact PCI slots pitched for PXI-based applications requiring multiple PXI/cPCI modules in an instrument chassis.
2006-04-28 Charge pump delivers 150mA from 1.8-5.5V input range
Linear Tech announced a regulated buck-boost charge pump in 2-by-2mm DFN package touted to be capable of up to 150mA in output current from an input range of 1.8V to 5.5V.
2008-02-18 Capacitive sensing makes a splash
Exploring the use of capacitive sensing in a water cooler illustrates not only how capacitive sensing can make devices more reliable, but also how the controller managing capacitive sensing can take on additional functions to add further value to customers and reduce maintenance costs.
2003-12-16 C-MEMS filter aims at monitoring
C-MEMS is an alternative approach to optical monitoring.
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