Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > thermal system

thermal system Search results

?
?
total search1277 articles
2007-05-31 Temp sensor simplifies thermal diode monitoring
TI has developed a temperature sensor that features programmable series resistance cancellation and diode non-ideality correction, which eliminates the need for individual processor resistance calibration.
2014-12-26 UV curable system touts up to 7,000psi tensile strength
The Master Bond UV15X-2 combines a high performance physical profile with very low shrinkage upon curing, and targets fibre optic, optical, electronic, microelectronic and laser applications.
2011-02-02 Using thermal calculation tools for analog components
Here's a general guide on the use of tools and calculations for thermal estimates of component operating temperatures for analog devices
2013-04-23 Understand thermal management for power supplies
Know the basics of dissipating heat in power supplies while keeping the noise down.
2009-08-04 Understand thermal derating aspects of PWM ICs to ensure the best system performance
This article describes how to construct and calibrate a thermal-derating box for evaluating the thermal performance of PWM controllers
2007-02-20 UMTS transmit system rolls for multiregion 3G handsets
RFMD has released its RF628x family of products that provides a UMTS transmit system for the implementation of multiregion, multimode 3G handset platforms
2002-02-18 Tyco power system holds up to five rectifiers
The Yukon 650 can hold up to five 650W constant power rectifiers and is temperature hardened to withstand a wide temperature range, from -40C to 75C, making it suitable for addressing the power requirements of the DSL and outdoor wireless systems.
2013-04-01 Transceiver system ready for next-gen Ethernet standard
FCI's single on-board transceiver system has a small footprint to save precious PCB real estate and offers different transceiver heat sink options to meet thermal application requirements.
2007-07-23 Toshiba forms thermal power JV with China firm
Toshiba has formed a JV with China-based Xian Xingyi Group covering control and instrumentation systems for thermal power plants
2007-06-26 Tiny buck regulator ups system thermal performance
Fairchild Semiconductor's FAN2106 is the first product in a new family of TinyBuck DC/DC buck regulators that integrate an advanced analog IC, MOSFETs and a boot diode into an ultracompact MLP housing.
2001-09-13 ThermoMap: A breakthrough in IC thermal mapping with 15m, 0.1C resolution
This application note describes a measurement system that enables semiconductor manufacturers to locate thermal hot spots on operating devices quickly and easily and to provide them with high-resolution thermal maps of the device if needed.
2006-09-08 Thermal sensor delivers 1C accuracy
Maxim Integrated Products has introduced a 1.0C accurate thermal sensor for next-generation notebooks with upgradeable graphics systems
2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems
2006-06-27 Thermal management ICs generate market heat
Databeans Inc. thinks thermal management ICs are hot. With revenue hitting $674 million in 2005, the firm believes this market could reach just under $2 billion in 5 years
2012-11-29 Thermal lock-in analysis drives 3D package dev't
The ELITE thermal lock-in analysis system from DCG Systems claims to provide the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy.
2010-08-06 Thermal implications for die stacks
This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling
2005-01-11 Thermal IC addresses reliability and time-to-market issues
Standard Microsystems has expanded its line of environmental monitoring and control solutions.
2014-11-05 Thermal evaluation method for TLV62065
Here's a look at an accurate evaluation method of junction temperature. This method is proven to be easy to use and have good accuracy and relevance to real applications.
2006-07-28 Thermal effects not an immediate concern, says TI exec
Contrary to popular belief, the impact of high temperature on a chip design is not among the most immediate concerns for advanced IC design, according to Texas Instruments' Robert Pitts.
2011-10-31 Thermal cutoff designed for automotive apps
The RTP200R060SA device offers high-voltage capacity at 32VDC and high-current DC-interrupt ratings of 200A at 16VDC.
2005-05-04 System monitor measures own temp
Maxim unveiled a 1C system monitor that can accurately measure its own die temperature, the temperatures of two external, diode-connected transistors, and report the temperature data using a 2-wire serial interface
2007-08-13 System management tool starts at $1.20
Actel has introduced a new reference design for embedded applications that enables intelligent system and power management implementations starting at $1.20
2005-06-24 System Integrators gain access to serial attached SCSI
Bell Microproducts will deliver small form factor (SFF) serial connectivity to early system integrator and reseller adopters in partnership with Fujitsu Computer Products of America Inc., LSI Logic and Supermicro Computer
2007-01-05 Switch IC simplifies Hall-effect sensor system
Allegro MicroSystems has released a dual-channel switch interface IC designed to simplify the implementation of a two-wire Hall-effect sensor system
2010-11-15 Surface-mount RTP device helps protect against thermal events damage
Tyco Electronics introduced has a technology that enables manufacturers to incorporate surface-mountable thermal protection in their standard RoHS-compliant reflow assembly process
2012-04-27 Stepper motor driver reduces board space, improves thermal efficiency
Texas Instruments' new driver is designed for industrial, medical and consumer applications.
2007-08-31 Step-down converters simplify system designs
Advanced Analogic Technologies Inc. has introduced the AAT1112 and AAT1145 current mode step-down converters that require no external compensation components and offer designers highly compact and easy-to-implement solutions.
2008-10-01 Stacked microprocessor system promises better performance
Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors.
2010-12-16 Solvent-free PV coating system allows contactless application
Plasmadust technology from Reinhausen Plasma allows solvent-free, dry and non-contacting deposition of busbars for back-contacting directly onto the aluminium layer of photovoltaics.
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top