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2005-05-02 Science and art of telecom thermal design
Good thermal design is equal parts science and artan iterative process requiring constant adjustments based on real-world feedback
2003-07-11 Sanmina-SCI, Delphi team for thermal solutions development
Sanmina-SCI Enclosure Systems and Delphi Harrison Thermal Systems have formed a comprehensive business alliance to accelerate the development of thermal solutions for large-scale electronic computer equipment
2006-10-09 RTP system eases shift to single-wafer processing
Mattson Tech's new 300mm rapid thermal processing (RTP) system is designed to address the industry's transition to single-wafer processing for applications currently predominantly run on furnaces.
2002-06-24 RTI SensorView system features parvus embedded hardware
SensorView, an advanced chemical-biological point detection system infrastructure developed by Ricciardi Technologies Inc., utilizes embedded PC/104 hardware components from parvus Corp
2007-09-17 Recognize high-power LED thermal problems
Designers attempting to create high-power LED systems are well served by understanding the thermal problems associated with LEDs. Smart thermal management will increase the operating temperature range, and thermal monitoring will maintain the accuracy of LED products
2006-02-03 PWM controllers with 0.5% system accuracy
Intersil has introduced a new family of VR11 pulse width modulation controllers with the industry's highest accuracy.
2011-04-27 Powercast boasts batteryless, RF-powered wireless sensor system
Powercast Corp. debuts a batteryless, RF-powered energy harvesting wireless sensor system for building and industrial automation
2007-05-29 Power switches improve system reliability
The Green FPS e-Series, a new family of Fairchild Power Switch products provide high energy efficiency and system reliability in DVD player, STB, LCD monitor and other 25W and lower power supply designs
2007-03-26 Power manager allows system operation while charging
AnalogicTech claims its power-management IC and intelligent battery charger continuously monitors system power needs during operation and automatically adjusts charge current accordingly, enabling it to deliver the highest possible charge current to the battery
1999-06-29 Power conversion and management methodologies in a portable system
This paper presents an overview of why thermal management is critical to the success of a product, the power conversion process, and power management techniques for portable products from the dc supply and battery pack to the CPU and system consumption of power.
2008-12-01 Power connectors boost system airflow
Connector makers are developing new power connector designs--they now consider frontal density, comprised not just of the connector but of the space on the power supply the connector takes up.
2013-05-30 PMICs cut thermal stress in phone, tablet processors
The AS3721 from ams claims to enable a compact remote feedback path from the processor to the IC's integrated DC-DC controllers.
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors
2008-01-17 Perform thermal tests on Class D amps
There are two kinds of amplifiers used to generate the output power, class AB and class D amplifiers. The shift to class D was mainly the result of the introduction of flat-screen LCD and plasma TVs, in which space was limited and heat dissipation became an issue. Since the thermal test standards were developed when only class output power AB was used, we want to investigate if they are still appropriate for class D
2011-06-07 PCBs boast improved LED thermal management
SinkPAD has rolled out its thermally enhanced SinkPAD aluminum PCB technology, which offers a solution to the challenges in the solid state lighting industry.
2010-12-22 PCB thermal management tech gets US patent
Viasystems' thermal management system for PCBs utilizes a copper heatsink as an integral part of the board rather than as an attachment. It holds US patent no. 7,741,566 B2.
2014-10-02 Optimise power designs with IGBT thermal calculations
Evaluating the temperature of the semiconductor dice in a multi-die package requires additional analytical techniques compared to those applicable for single die. This article shows how to do it properly.
2011-02-10 Optical filter enables thermal spot curing
IRphotonics has made available a Visible Optical Filter for the iCure AS200 Thermal Spot Curing System.
2014-12-10 Next-gen 12V motor drivers boost system reliability
TI's DRV8846 automatically tunes motor performance for precise, smooth and quiet motion, while the DRV8848 eases designs by using a PWM control interface and minimal external components.
2005-10-10 New memory modules improve thermal management
With nearly 15 years experience in the stacked, high-capacity memory market, Staktek realized that it needed to come up with a process that would improve thermal and electrical issues. At the same time, it strived to sustain its manufacturing processes so that when other companies are manufacturing its devices, they don't have to invest a huge amount of capital equipment to license its technology
2014-07-11 Nanotubes: Pocket-sized 80TFLOPS system is the way to go
A carbon nanotube-based 'club sandwich' design that stacks memory and logic technologies could provide a thousand-fold power reduction for a system packing 2,880 IBM Power 7 cores running at 3.5GHz
2007-01-24 MOSFETs offer better thermal performance
Vishay is adding new n-channel 20V, 30V and 40V devices to its PolarPAK family of power MOSFETs with double-sided cooling, giving designers a new way to reduce system size and cost through better MOSFET thermal performance.
2003-05-26 Modeling Thermal Effects in RF LDMOS Transistors
This application note illustrates the different results obtained from a simulation using Motorola's MRF19125 root model and the Motorola Electro Thermal model
2016-04-20 Mobile devices, PCs, data centres pose rising thermal issues
The fact that physical limits on the size of transistors may be detrimental to Moore's Law, the challenge of removing heat from ever-smaller transistors also threatens continued efficiency improvements.
2008-04-10 MicroTCA system comes in 1U form factor
In the battle among ATCA form factors, Performance Technology has been solidly behind MicroTCA; indeed, Marketing VP Ed Bizari has called full-size ATCA primarily a backplane form factor for Tier 1 carriers.
2007-09-18 MicroTCA power modules rolls for TEMs, system integrators
Ericsson Power Modules has introduced an evaluative level MicroTCA power module, part number ROA 117 5078/1, designed for telecom equipment manufacturers and system integrators
2015-11-16 Microsoft Surface Pro 4 flaunts better thermal performance
One of the biggest criticisms of the Surface Pro 3 was its tendency for overheating, with many complaints that the top right-hand corner of the device where the CPU is found would hit high temperatures.
2004-09-24 Microchip controllers with 0.5 percent system accuracy
Microchip released a single-cell and a dual-cell, fully-integrated, charge-management controllers that feature a charge-safety timer and a temperature monitor.
2011-12-20 Metallization firing system touts 200C/s ramp rate
The three-belt, three-speed machine boasts more than 99.99 percent yield that claims to exceed industry standard for metallization firing.
2012-05-03 Measure multiple temp in battery mgmt system
Read about a low-power circuit that measures the temperature of up to 12 thermistors.
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