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2002-03-22 SUSS flip-chip bonder has up to 200kgf handling force
The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processes.
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput
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