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2011-06-07 Partnership aims hi-tech MEMS production process
EV Group announced that it is partnering with the Industrial Technology Research Institute to deliver advanced manufacturing techniques for next-generation MEMS devices.
2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production.
2009-10-01 SUSS MicroTec joins ITRI 3D consortium
The Advanced Stacked-System Technology and Application Consortium will implement SUSS MicroTec's 300mm technology.
2014-05-14 Sensor chipsets mfg costs same across various vendors
ST, Bosch Sensortec and InvenSense are taking very different routes yet spending roughly the same amount to produce nine-axis inertial measurement units, according to System Plus Consulting.
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2013-06-24 Tresky rolls out versatile die bonder product line
Tresky's die bonder integrates "True Vertical Technology", making it possible to bond in deep cavities.
2010-06-21 Sematech welcomes Qualcomm as first fabless member
Qualcomm Inc. has joined chip-making consortium Sematech to gain an edge in next-generation technology, reportedly including 3D chips.
2003-04-22 AVX capacitor features new dielectric material
AVX Corp. has announced the availability of a new series of SLCs that is capable of operating over the -55C to 125C temperature range.
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