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2013-01-17 Thick plated copper process for monolithic PMIC apps
UMC's TPC solution provides thick plated copper layers to achieve higher current flow and better thermal dissipation to cut chip resistance, extending battery life.
2002-01-04 Molex SFP connector system supports 2Gbps data rates
The company's high-speed, high-density small form-factor pluggable (SFP) connector and cages are employed to interface copper or fiber-optic pluggable transceivers and cable assemblies to host equipment
2010-09-09 Silicon solar cells show 19.4% conversion
Copper-based front-side metallization makes the cells cheaper for future industrial production
2004-05-26 Unitive boosts chip performance with latest tech app
Unitive Inc. has developed a novel process of applying a new spun-on polymer coating technology that permits further reductions in the size of ICs while improving performance and enables dramatic increases in WLCSP reliability.
2006-09-06 Wirewound resistors housed in TO-220 package
The RoHS-compliant heatsinkable wirewound resistor series from Ohmite Manufacturing Company is housed in a TO-220 style package.
2002-05-10 EPCT RJ-45 modular jacks rated at 1A
The EJ series of RJ-445 shielded modular jacks from Express Power and Communictions Technology Corp. are rated at 1A, 150Vac and are offered in single-row, multiport, and dual-row, multiport, as well as single-port, versions.
2013-08-19 Auger chemical state analysis for leadframe issues
Read about the use of Auger Electron Spectroscopy chemical state analysis to evaluate the wirebond non-stick on leadframe issue.
2005-08-18 Trompeter's mini BNC connector delivers 40% greater density
Trompeter Electronics has developed a new 90, miniature BNC connector that is said to deliver 40 percent greater density.
2006-11-30 Termination resistor network targets high-speed apps
TT electronics BI Technologies Electronic Components Division has released a RoHS-compliant SCSI termination resistor network, providing design engineers with a network device designed for the termination of high-speed applications.
2006-11-23 Resistor network reduces stray capacitance
The BB1020DTLF, an LVD network from TT electronics BI Technologies Electronic Components Division, features minimum stray capacitance and high-frequency performance.
2006-06-14 Press-fit connectors suit high-reliability, high-cycle apps
Sullins has added pin-compliant solderless press-fit terminations to its edgecard connector family for high-reliability and high-cycle applications.
2015-02-02 Optimising BGA signal routing in PCB designs
BGA packaging technology for embedded designs is steadily advancing, but signal escape routing is difficult. Know the strategies to ensure that a product is correct in terms of form, fit and function.
2003-10-02 Hosiden connectors have 1.8N contact pressure
Hosiden has developed 2-pin connectors for connection between a microphone or a speaker and a PCB.
2015-06-22 Grasping semi-additive fabrication
Printed circuit board trace width and spacing as fine as 1.25 mils can be maintained over distance within extremely tight tolerance.
2008-10-01 Chip package options abound
When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer.
2005-01-28 Adapter supports board upgrades without rework
Aries offers a new adapter that enables designers to replace a 132-pin PQFP package IC with the newer 144-pin TQFP without the need for a board redesign or rework.
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