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2004-08-17 ADI ADC packs power in 3-by-3mm TSOT package
ADI introduced ten serial ADCs that promise to bring ultra-compact packaging technology to data acquisition equipment and automotive systems.
2004-07-26 Microsemi boost converter comes in thin 5-pin package
Microsemi released a miniature LED driver for powering LEDs in handheld display apps such as wireless phones, pagers, digital cameras, GPS receivers and PDAs.
2004-10-04 Regulators combine optimal performance, small package
National released a family of switching buck regulators that combine small-outline packaging with one of the industry's best performance for the highest power density
2006-12-14 UTAC, SMIC joint fab to break-even next year
The joint venture of United Test and Assembly Center and Semiconductor Manufacturing International Corp. in Chengdu, China is projected to register a break-even next year.
2002-07-26 Kingston develops CSP technology for memory modules
Kingston Technology Co. Inc. has introduced the Elevated Package Over CSP (EPOC) 3D memory module technology
2007-05-31 Small IGBT for flash control handles up to 200A
Renesas Technology Corp. introduces the RJP4004ANS, an IGBT designed for electronic flash (strobe) control in cameras built into cellphone and digital still cameras, which can handle up to 200A.
2004-06-18 Fairchild launches several devices in DQFN form factor
Fairchild launched several 4-, 6- and 8-bit LCX and VCX series of low-voltage logic functions in the DQFN form factor.
2008-05-07 Simtek boosts nvSRAM portfolio with 8Mbit family
Simtek continues to push nvSRAM densities higher with its 8Mbit family of nvSRAM products.
2005-08-26 Micron delivers high-density NAND flash memory in mobile market
Micron Technology Inc. is shipping 8Gb and 4Gb qualified NAND flash memory products.
2008-11-26 Intel, Micron roll 34nm NAND flash
Intel Corp. and Micron Technology Inc. have mass produced their jointly developed 34nm, 32Gbit multi-level cell (MLC) NAND flash memory device.
2007-03-14 Intel enters solid-state storage market, unveils NAND-based device
Intel Corp. announced its entry into the solid-state drive business with a new NAND-based device.
2008-11-18 Everspin delivers first MRAM device
Everspin, the MRAM spin-off of Freescale, has launched its first devices under its new corporate identity.
2003-01-03 DRAM makers prep multichip cell phone memories
Eyeing the growing market for cellular phones, DRAM vendors are seeking ways to fold more non-volatile memory and advanced packaging techniques into their game plans.
2007-03-01 Boost ECC, solve NAND flash issues
Toshiba Corp. is rolling out four enabling technologies in a multipronged drive into the booming embedded NAND flash-memory market.
2004-05-18 AboUnion launches SD module line
AboUnion Technology Corp. launched a new secure digital (SD) module line early last month. With this new line, the company's monthly capacity for memory cards has doubled from 200,000 to 400,000 units since last month.
2005-08-19 TI technology eases implementation of Ethernet-powered devices
Texas Instruments announced its third generation Power-over-Ethernet controller technology that promises to ease the implementation of Ethernet-powered devices such as WLAN access points, IP phones, security and RFID scanners.
2005-06-03 TI power amplifier matches sound quality with high-quality image
The new digital-input Class-D audio power amplifier for flat panel displays from TI enables designers to develop products with sound quality that matches the display's high-quality image, while minimizing cost and component count
2005-10-25 TI clock multiplier integrates three on-chip PLL components
TI announced that they have developed a clock multiplier that integrates three on-chip phase locked loop components to provide "industry-leading" flexibility and performance.
2005-12-21 Three new high-performance video amps from TI
Texas Instruments' new video amplifiers are touted to be the first to offer full I?C programmability of all functions independently for each channel.
2011-12-02 Serial flash boasts 80% less PCB space
Winbond's USON and WLBGA devices target mobile computing devices with densities from 512Kb to 16Mb.
2008-10-01 LDO regulators ready for noise-sensitive portable apps
ADI introduces a family of high-performance LDO regulators that generates the low noise, low voltage supply rails and extended battery life required for mobile handsets and other battery-powered devices.
2003-09-01 Infineon SDRAM offers high-density unbuffered modules
Infineon Technologies AG has released its 1Gb DDR SDRAM that is fabricated using the company's 110nm CMOS process.
2008-04-14 Industrial muxes tout 'lowest' on-resistance
Available in space-saving packages, the ADG1406 and ADG1407 muxes from ADI operate with 5V, 12V or 15V supplies, delivering the industry's lowest on resistance.
2005-12-14 Clock multiplier features 60ps jitter
TI's new programmable clock multiplier features a low jitter of 60ps and in-system spread spectrum adjustment that improves performance, simplifies development and saves cost in consumer applications.
2006-08-29 Capacitive sensor takes buttons off camera phone
In Samsung's SPH-V6800 Wi-Fi-enabled GSM camera phone, Synaptics has replaced a set of mechanical buttons with a capacitive sensor that controls the functions.
2005-04-04 1Mb FRAM replacement for SRAM
Ramtron finally offered a non-volatile FRAM that is designed to be a drop-in replacement for standard asynchronous SRAMs.
2003-01-27 TT Electronics tightens up resistor tolerances
TT Electronics plc's IRC Advanced Film Division has introduced a UPN series of high-precision resistor networks for process control apps.
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