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2012-11-30 2D thin-film magnetic cores feature WLM tech
Enpirion claimed to extend micro-fabrication and materials technology with what it touts as the world's first 2D thin-film magnetic cores with new wafer level magnetics technology
2007-11-22 TFFC LED shines 200 lumens in cool-white
Philips Lumileds announced its cool-white Luxeon K2 LED with thin-film flip-chip technology.
2002-04-24 RVSI rolls out gold bump wafer inspection system
Designed specifically to inspect wafers that employ gold bump technology, the WS-2510 from Robotic Vision Systems Inc. contains a sensor that can inspect micron-sized gold bumps at production speeds
2006-01-30 BMZF resistors deliver 'outstanding' power to size ratio
Vishay announced its VFCP series of ultra-high-precision, surface-mount BMZF resistors in a flip chip configuration that promises to deliver an outstanding power to size ratio
2004-07-26 Amkor to take hold of Unitive
Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina (Unitive), and to obtain a majority interest of about 60 percent in Taiwan-based Unitive Semiconductor Taiwan Corp. (UST), a joint venture between Unitive and various Taiwanese investors
2009-09-16 Automobile LED delivers more than 850 lumens
Philips Lumileds releases Luxeon Altilon power LEDs that are suited for vehicle forward lighting.
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
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