Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > through-silicon vias

through-silicon vias Search results

?
?
total search135 articles
2013-11-08 Samsung, SK Hynix set to unveil next-gen memory chips
Samsung will demo low-power DDR4 SDRAMs for smartphones while SK Hynix will unveil its High-Bandwidth Memory, a stack of four memory chips fueling next-gen comms, graphics and server chips.
2014-10-10 Rising costs drive chip companies to alternate routes
The low cost of capital is fuelling M&A across all industries, and the rising cost and complexity of making chips is pouring gas on the fire in semiconductors.
2007-11-28 Rambus shows alternative way to terabyte memory
Rambus has developed technologies that could enable links to memory chips delivering up to a terabyte per second and could provide a lower-cost alternative to 3D chip stacking.
2009-09-10 R&D consortia help drive IC equipment growth
Semiconductor equipment R&D spending is set to be slashed, with an $8 billion decline seen over the next five years, according to market tracker Gartner.
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solutionwhich most assumed would be EUVMoore's Law scaling would slow and the secular growth rate of the IC industry would decline.
2011-12-06 Production begins for 128GB/s hybrid memory cube
IBM's 3D chip-making process, the 32nm TSV technology, will create Micron's Hybrid Memory Cube.
2010-12-01 Optical inspection system targets 2mµ wafer defects
Altatech Semiconductor S.A. launches high-throughput AltaSight EyeEdge inspection system
2012-12-20 Opinion: Apple-Nvidia chip stack venture makes sense
EE Times' Rick Merritt speculates on rumours surrounding Apple's supposed partnership with Nvidia to for chip stacks that will power its flagship products.
2014-03-28 On-chip interconnect costs head for further study
With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes.
2013-04-02 Nvidia will push for 2.5D stacks on organic substrates
Organic substrates with new I/O techniques could pave the road to a 2.5D chip stack for Nvidia, said R&D VP William Dally.
2013-03-21 Nvidia takes on Intel, ventures into business apps
Nvidia unveiled a roadmap that will focus on merging graphics, ARM cores and memory using FinFETs and 3D ICs at it goes head to head with Intel and AMD.
2010-08-11 Naysayers, optimists clash on DRAM forecasts
Industry players and watchers have conflicting outlooks when it comes to forecasting DRAM supply and demand.
2010-05-20 Mobile image sensors support parallel, MIPI interfaces
Aptina Inc. has launched a line of CMOS image sensors, based on a 1.4? pixel scheme and its third-generation frontside illumination (FSI) technology.
2015-09-30 MEMS devices come in 300mm-diameter wafers
CEA-Leti manufactured accelerometer MEMS devices on 300mm-diameter wafers using its piezo-resistive silicon nanowire technology.
2015-04-16 Leading technologists talk about Moore's law
It has been 50 years since Moore's law came to light, and now three top technologists share their thoughts pertaining to Moore's law as well as their take on its proponent, Gordon E. Moore.
2012-03-20 Japan's TEL buys deposition vendor
Nexx's advantages in electronmechanical deposition will help TEL's strategy to advance wafer level packaging.
2014-10-23 Is there life after CMOS?
Moore's Law is not dead, but it has clearly reached old age, and no fundamental technology has emerged to replace it. Whatever comes next is likely to challenge old assumptions both for technologists and society at large.
2013-02-14 Is the demise of high-speed I/O near?
High-speed serial interfaces featuring equalisation may be the norm in the future, and high levels of SoC integration may no longer be the best solution.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2012-03-07 Introduction to 2.5D
We need evolutionary, instead of revolutionary, adjustments to current design flows and the supply chain to successfully leverage 2.5D.
2013-04-23 Interposers to dictate the future of 3D chip stacks
The market for silicon interposers will grow by 88 per cent annually through 2017 with all the big semiconductor makers looking to grow their 3D integration capabilities.
2015-02-25 Intel's 14nm process churns out world's smallest SRAM
The company will describe a 0.0500 ?mm2 SRAM bitcell capable of storing 14.5Mb per mm2, which is part of a memory array that will be widely used in Intel's future SoCs such as cellular modems.
2013-06-20 Intel touts eDRAM as forerunner to 3D ICs
Intel's eDRAM technology is expected to challenge discrete graphics sockets in high-end notebooks and servers.
2014-09-12 Intel plans to extend Moore's Law to 7nm
Chipmakers generally don't expect the much-delayed extreme ultraviolet lithography in time for 10nm chips, but many still hold out hopes it could be ready for a 7nm generation.
2012-08-09 Improve SoC yields with diagnostic and repair tools for embedded memory
Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities.
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2013-08-02 Imec, Cascade probe 25?m-diameter micro-bumps
The organisations revealed breakthroughs in probing stacked ICs (3D-SICs) on a wide I/O test wafer with its fully-automated CM300 probe solution using an advanced version of Pyramid Probe technology.
2009-10-06 IMEC pushes 3D integration of DRAM on logic
IMEC and its 3D integration partners have prototyped a DRAM chip integrated on top of a logic IC.
2009-12-15 IC equipment market growth to climb up
Worldwide IC equipment spending will drop by 42.6 percent in 2009, but will grow 45.3 percent in 2010.
2012-12-14 IBM showcases 3D server chip stacks
IBM has showcased its techniques for stacking 45nm processors at IEDM. The company's techniques could give the processors significant performance and power gains.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top