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2011-03-14	Hynix supports Sematech 3D interconnect program By joining the 3D Interconnect program, Hynix hopes to help accelerate the commercialization of wide I/O DRAM and realize 3D's potential as an affordable path to IC production growth.
2013-04-04	Hybrid Memory Cube Consortium to focus on faster DRAM Micron, Samsung, Hynix are among over 100 companies releasing a specification for a 3D DRAM and logic module known as the Hybrid Memory Cube.
2015-07-29	How PC slump affects memory chipmakers Semiconductor sales are in a two-year slump due to weak demand for PCs and smartphones, according to Gartner. The research firm said chip growth will return to 4-5 per cent from 2017-2019.
2011-09-01	GlobalFoundries ships more chips, prepares for 14nm GlobalFoundries is claiming it is shipping thousands of 32nm wafers per week and is planning its strategies for the company's 14nm node.
2012-05-02	Globalfoundries preps for 20nm TSVs If all goes well, the company hopes to take production orders in the second half of 2013 for 3D chip stacks using 20nm and 28nm process technology.
2012-10-04	Globalfoundries partners up with timing product specialist Sand 9's micro-electromechanical systems (MEMS) timing devices provide an alternative with performance and quality improvements over legacy quartz crystal solutions.
2014-11-25	Global inertial sensor market to hit $1.4B in 2019 Yole Developpement reported that in the overall inertial consumer sensor market, discrete and combo, ST is the leader with 40 per cent market share, going ahead of Bosch.
2014-09-23	Future memory devices: 10 technologies to keep in mind While current memory types are smarter and built with higher density, the succeeding memory technologies will integrate new types of materials, as well as smarter algorithms that make storage a hierarchy off-chip in a way that cache memory is hierarchical on-chip.
2009-02-12	Five ways to beat IC scaling roadblocks Intel senior fellow and director of process architecture Mark Bohr listed five major stumbling blocks—or challenges—for the 32nm node and beyond.
2011-06-16	FEI ion beam cuts imaging time for MEMs, 3D chips The Vion PFIB tool can cut the time to image MEMS and 3D chip features by 20x, from more than 10hrs to under 40mins for TSVs, revealing in minutes chip features ranging in size from 30nm to 1mm.
2015-06-17	Fairchild brings 'smart' IMUs to MEMS market The company describes the offering as a "smart" technology more sophisticated than SUMMiT, namely a six-axis inertial measurement unit (IMU) with nine-axis sensor fusion algorithms.
2009-07-22	Fab tool collaboration: Mission impossible? Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projects—just to help the industry keep pace on Moore's Law?
2007-10-25	EDA's big three unready for 3D chip packaging Without design tools to allow exploration and tradeoffs to be made in 3D layouts, engineers are restricted to design in two dimensions and occasionally stack chips crudely. But without a clear market for 3D design EDA vendors are unlikely to offer tools.
2014-04-21	DRAM interfaces see favourable future Wide-IO promises to provide a wider, faster bus for communication, while reducing interface power consumption to a fraction of today's level.
2016-03-08	Developments in MEMS integration Learn about the advances in MEMS industry aimed at tackling the integration challenges head on at the package, wafer and die levels.
2011-06-15	DAC highlights diversity, innovation The DAC event is a venue for the research community to distribute the most recent results from design automation tool developments.
2013-05-15	CTO: TSMC prepared to push beyond IC limits TSMC technology chief Jack Sun discusses the future of semiconductors-such as super-systems that move beyond SoCs-and the path the microchip foundry aims to take.
2014-01-29	Cost-efficient 3D IC wafer processing without adhesives AML showcased a unique solution to get rid of the adhesive and to allow for a vacuum to be created between the carrier and the wafer to be processed in 3D IC production.
2015-08-05	CoolCube 3D interconnect targets FinFET process The research institute demonstrated the feasibility of CoolCube used to stack FinFET layers on its 300mm production line as well as with fully-depleted silicon-on-insulator manufacturing processes.
2011-10-12	Consortium to develop hybrid memory standard Micron and Samsung aim to develop a memory standard that combines DRAM and logic processes in a single unit.
2010-12-14	Chipmakers keep secrets at IEDM Few papers provided clues on vendors' plans at the 2010 International Electron Device Meeting (IEDM). In place of clear presentations on plans for 22-/20nm plans, rumors abounded, with many believing the leading-edge foundries will extend bulk CMOS.
2014-03-20	Chip stacks feature near-zero TSV keep-out zones GlobalFoundries describes a middle-of-line layer stack technique that uses nitride, PMD oxide, and a contact protection layer with a high coefficient of thermal expansion.
2014-07-01	Chip industry to face hurdles brought by 20nm tech Executives from two capital equipment firms said chip vendors face the challenges brought by higher costs and complexities due to tighter margins, new processes and materials at 20nm and beyond.
2011-12-14	Carbon nanotube beats copper in 3D integration A research team at Chalmers is working with carbon nanotubes as conductive material for TSVs, citing its thermal qualities as crucial to the application.
2011-04-05	Cadence introduces wide I/O IP Cadence claims to be the first to market a licensable, wide I/O memory controller core.
2012-10-18	ARM's V8 to be used for TSMC's 16nm FinFET Taiwanese foundry plans to use ARM's first 64bit processor, the V8, as a test vehicle for the 16nm FinFET process.
2015-07-09	ARM chief unveils IoT wish list Simon Segars shared an IoT wish list at the recent Imec Technology Forum that advised semiconductor designers to focus on ultra-low power everything and designs that slash costs and area.
2013-04-24	Applied Materials reclaims top spot in chip equipment market In 2012, Applied Materials reclaimed the No. 1 spot based on its relative strength in deposition and process control, Gartner said.
2010-12-30	AMD cedes more control of GlobalFoundries to Abu Dhabi AMD has reduced its share of GlobalFoundries from 30 percent to 14 percent, turning over 16 percent to Abu Dhabi's Advanced Technology Investment Co. (ATIC). As a result, the US-based foundry is now 86-percent owned by ATIC, whose sole shareholder is the Government of the Emirate of Abu Dhabi.
2012-11-16	Altera, Huawei incorporate FPGA, memory in 2.5-D tech The new device will significantly reduce board space while increasing performance.