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2012-11-21 Wireless power receiver pushes mobile charging
TI's bq51050B claims to give smartphone users a simpler, stress-free charging experience and help designers implement wireless power technology in places such as car consoles, charging pads and office furniture.
2002-03-04 TI's communications devices to power Legend handsets, IADs
Legend Holdings Ltd has formed a strategic alliance with Texas Instruments Inc. to make use of TI's communications devices
2014-01-24 TI wireless charging controller touts foreign object detection
TI's bq500412 controller, a wireless power transfer circuit with foreign object detection, allows designers to bring to market 3-coil, 5-V, and 12-V A6 charging stations compliant with the Wireless Power Consortium 1.1 specification.
2003-09-24 TI to establish wireless apps center in Taiwan
Texas Instruments Inc. has announced plans to open a new wireless application center in Taipei later this year
2013-09-06 TI rolls USB+CAN dev kit for ARM Cortex-M4
The Tiva C Series TM4C123G USB+CAN development kit includes host and device USB cables, on-board debug interface, and a coin cell battery for low-power hibernation mode.
2006-04-04 TI opens research center in Korea, says report
Texas Instruments Inc. opened a wireless technology research center aimed at multimedia mobile communications in Seoul, Korea, on March 28
2004-07-29 TI OMAP bring wireless connectivity to HP iPAQ pocket PCs
Texas Instruments Inc. has announced that a range of TI wireless solutions, including Bluetooth wireless technology, OMAP processors and 802.11 WLAN technologies will be included in two new converged mobile devices from the HP iPAQ Pocket PC series.
2006-04-12 TI joins industry leaders in thinking beyond wireless borders
Leaders from Context-Based Research, Eastman Kodak Company, Mobile ESPN, Modeo and Texas Instruments exchanged ideas on how industries must think beyond traditional business borders as the mobile phone becomes an increasingly personalized tool.
2002-06-21 TI eyeing Asia for next wireless glory
With three design wins in Japan, Texas Instruments is aiming its OMAP chips at mainland China and Taiwan to strengthen its foothold in mobile devices for 2.5G and 3G networks.
2005-01-24 TI announces new WLAN solution
Texas Instruments announced the latest in its family of application specific system level WLAN solutions.
2006-03-13 TI adopts multidisciplinary approach for 4G design
Texas Instruments is using vertically oriented engineering teams to ensure the success of its fourth-generation wireless design and development efforts
2002-12-04 Symbian, TI extend wireless partnership
Symbian Inc. and Texas Instruments Inc. have extended their strategic cooperation to further optimize the performance of the Symbian OS on TI's wireless OMAP platform.
2002-12-09 Comsys EDGE IP powers TI wireless chips
Comsys Communications and Signal Processing and Texas Instruments Inc. (TI) have announced that Comsys will deliver EDGE baseband IP to TI to be used in its TCS family of wireless chipset solutions.
2005-07-01 Z-Com opts for TI voice solutions
Texas Instruments Inc. (TI) said that its WLAN and VoIP products were selected by Z-Com, a wireless broadband ODM, for USB adapter and residential gateway module product lines.
2009-04-06 Wireless, MEMS advancements boost energy harvesting
What has really changed energy harvesting in the last two decades? The answer, in sum, is a confluence of the development of wireless and lower power electronics, along with advancements in sensors and MEMS
2007-05-14 Wireless sensor network node features Zigbee support
Moteiv Corp. has taken the wraps off the latest in its Tmote product family, with the introduction of its latest wireless network node that supports Zigbee
2004-04-22 Wireless security tops U.S.-China trade talks
China and the United States will square off in Washington on Wednesday (April 21, 2004) for the annual U.S.-China Joint Commission on Commerce and Trade, a forum where officials haggle over trade disputes and promote commercial agendas.
2011-08-22 Wireless power transmitter IC cuts size by half
TI has launched the bq500210 that offers a complete Qi-compliant wireless power solution and reduces design costs.
2013-09-13 Wireless power chip eases dev't of Qi charging stations
The bq500212A transmitter from TI allows designers to quickly take to market Qi-compliant wireless charge pads or stations that can operate from a USB port or 5V power adapter.
2010-01-20 Wireless network system boosts learning experience
The wireless network gives teachers a way to gauge student understanding and foster student engagement
2010-09-23 Wireless kits expedite 13.56MHz, 2.4GHz, ZigBee design
TI launched three wireless kits integrating the Stellaris MCU, promising to speed up design of wireless network apps.
2003-01-02 Wireless ICs call on integration
Makers of ICs for Bluetooth and 802.11, or Wi-Fi, WLAN connectivity are readying a new generation of chips for volume delivery in Q1 of 2003.
2004-09-24 Wintegra rolls wireless infrastructure software; lands TI platform win
Wintegra released an upgraded version of its datapath software for wireless infrastructure apps
2009-03-30 Will TI bid for rival analog IC firm
Texas Instruments Inc. is aiming to increase its analog IC market share, but achieving that goal would require the company to again gamble on a significant acquisition.
2012-09-10 Will a TI-like firm ever come out of China
Local fabless CEOs debate on whether China will ever see the rise of a company that can rival the size and success of Texas Instruments.
2008-08-20 Wi-LAN to drop TI in patent suit
Wi-LAN Inc. has announced that Texas Instruments Inc. will be dismissed from Wi-LAN's legal action No. 2:07-cv-474 in the U.S. District Court for the Eastern District of Texas.
2010-07-08 Vendors push wireless tech boundaries
Wireless tech vendors are exploring completely new markets in the consuming and entertainment arenas for Bluetooth V4.0 and Wi-Fi with 4x4 MIMO
2007-09-26 USB stick tool eases wireless MCU development
Texas Instruments Inc. has announced a new tool for designing embedded systems that combines ultralow-power MSP430 MCU with wireless communications
2007-05-10 UMC scores Sparc deal in new TI fab scheme
In TI's new fab scheme, UMC appears to have scored a major victory, as that company will make Sparc processors on a foundry basis at the 45nm node for Sun Microsystems Inc
2009-10-19 UHF devices enable low-cost wireless car apps
The new device family includes UHF transmitters, receivers and transceivers for wireless and car access systems
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