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2011-01-20 Tokyo University designs NVM architecture using Docea's Aceplorer
By using Docea Power's Aceplorer software to model power consumption at the ESL, University of Tokyo's Takeuchi Laboratory hopes to evaluate the optimum NVL architecture design and share power consumption data with system architects
2003-10-08 KDDI, Tokyo FM jointly conduct networking field trials
KDDI and Tokyo FM Broadcasting have agreed to jointly develop a new service integrating programming to be broadcast over digital terrestrial audio networks
2007-04-27 IMI opens subsidiary in Tokyo
Philippine-based EMS company Integrated Microelectronics Inc. (IMI) announced it recently opened its Japan subsidiaryIMI Japan Inc.located in Kandaogawamachi, Chiyoda-ku.
2006-08-04 Fujitsu, Tokyo university co-develop new FeRAM material
Tokyo Institute of Technology, Fujitsu Laboratories and Fujitsu have jointly developed a new material for a new generation of non-volatile FeRAM
2003-09-29 TELI, Coreco ink supply, joint development pact
Tokyo Electronic Ind. Co. Ltd (TELI) has signed a multi-year strategic agreement with Coreco Inc., in which the latter will supply its smart camera technology to TELI.
2002-02-15 Toshiba lays off 12 percent of U.S. workforce
Blaming the continued weakness in the electronics industry, Toshiba America Electronic Components Inc. confirmed Wednesday that it has laid off 60 of its employees, or 12 percent of its workforce, working at various U.S. branches
2015-06-30 Conductive ink on textiles yields stretchable electronics
University of Tokyo researchers said the discovery will enable electronic apparel such as sportswear incorporating sensing devices for measuring biological indicators such as heart rate and muscle contraction.
2014-08-20 Burst-mode camera allows movie shooting at 1 trillion fps
A group of researchers claimed to have developed the world's fastest burst-mode camera that obtains continuous, single-shot, burst-type images without the need for repetitive measurements.
2008-12-18 ADI touts 'first' HDMI transmitter with CEC, Deep Color
Analog Devices Inc. introduced what the company claims is the industry's first Deep Color HDMI transmitter to integrate a consumer electronic control (CEC) controller and buffer for high-definition (HD) audio/video devices
2007-04-02 Next-gen chips bridge design, process
Morris Chang of TSMC cites two strategies foundries need to develop to remain profitable in the CE era.
2009-01-09 Tough '09 awaits fab-tool, materials sector
Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009. And don't expect the market to improve, prompting the possible acceleration of a shake-out in the sector
2007-05-15 TFT LCD modules match industry-use requirements
Toshiba Matsushita Display Technology Co. Ltd (TMD) and Toshiba America Electronic Components Inc. (TAEC) have developed six new modules of industrial-use thin-film transistor (TFT) liquid crystal display (LCD) panels
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute
2014-08-11 Freescale builds bridges with Japan carmakers, enters IoT
Towards meeting performance targets, Freescale Japan's David Uze says that it is forging relationships built on trust with local automotive firms and looking to establish an IoT city in Tokyo
2009-01-06 Foreign components distributors still woo Japan
Breaking into any Japanese economic sector has always been difficult but the world's second-biggest economy is proving especially difficult for foreign electronic component distributors
2010-03-11 Long road still to e-beam direct-write litho
While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away.
2002-05-24 WSC details policy recommendations at annual meeting
The World Semiconductor Council ended its sixth annual meeting in Newport Beach, California, with the issuance of a joint statement by the five member associations.
2014-09-08 Will innovation drive displays into post-touchscreen era?
At the Touch Taiwan event, a Nikkei BP executive predicted the future of display technology to be ambient, free-form and wearablewith images that can be projected on any surface or in the air.
2010-01-04 What's the next big application?
Here's a list of the 10 technology applications to watch for in 2010, examining examine the features that make them so compelling as well unresolved issues that might keep them from breaking out.
2004-12-07 Transmeta licenses power-saving technology to foundry
Loss-making fabless processor company Transmeta Corp. has licensed its LongRun2 technologies for power management and transistor leakage current control to its foundry manufacturing partner, Fujitsu Ltd, Transmeta said Thursday (Dec. 2).
2005-05-16 Trailblazing trends in manufacturing services
Finding the company's niche of expertise will push business to a higher level.
2003-11-25 Toshiba designer takes path of upward mobility
Delving into 'new transistor technology' is all in a day's work for Toshiba's Shinichi Takagi.
2013-11-20 Taking a look at the embedded vision market
As the market shifts to "vision" processing, the industry has focused over how fast and how accurately a processor can capture, dissect and interpret data that is comprehensible to an embedded system.
2001-06-01 Stimulating entrepreneurial spirit in Japan
JASVA has assembled semiconductor and display startups on a common platform in its bid to support companies in a country that has long been a desert of new ventures.
2007-10-10 Sony, Samsung push OLED to consumer segment
OLEDs will soon break into the consumer market as Sony and Samsung SDI are making moves to bring the displays to a larger commercial audience.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2013-08-05 Semimetals show heat to electrical conversion efficiency
Researchers in Japan found a layered semimetal compound that offers unprecedented efficiency of heat to electric current conversion, outlining its potential to be used as a thermoelectric material.
2008-07-17 Samsung 'downturn' rumors surface
Rumors that Samsung Electronics Co. Ltd this week pushed out its fab-tool orders sent shockwaves at the Semicon West Trade Show, putting vendors in a somber and gloomy mood.
2013-11-11 Researchers develop cost-efficient inkjet-based circuits
A Georgia Tech team created a novel method to rapidly and cheaply make electrical circuits by printing them with commodity inkjet printers and off-the-shelf materials.
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