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2004-11-10 TransDimension, SMSC to achieve USB-IF certification
TransDimension Inc. and SMSC have announced the completion of high-speed USB compliance testing of the industry's first controller/transceiver solution utilizing the new UTMI+ Low Pin Interface (ULPI).
2002-02-04 TransDimension USB controllers geared for industrial, mobile apps
The UHC124 embedded USB-host controller chip processes up to 16 USB-transactions, achieves transfer rates of 1.5Mbps and 12Mbps, and supports all four types of USB-transfers.
2004-10-05 TransDimension unveils single-chip USB OTG controller
TransDimension released what it claims as the industry's first single-chip USB OTG controller that supports high-speed peripheral and full-speed host functionality.
2002-04-12 TransDimension to offer Agere PCI-based chip
TransDimension, a developer of embedded and mobile connectivity solutions, will market and resell Agere System's PCI-based chip known as the Agere USS312TC, using the TransDimension brand name.
2004-12-29 SMSC, TransDimension achieve USB-IF OTG certification
Standard Microsystems Corp. (SMSC) and TransDimension, a provider of USB connectivity solutions have completed the USB-IF On-The-Go (OTG) compliance testing for a hi-speed USB solution utilizing a stand-alone transceiver.
2002-11-14 Qualcomm licenses TransDimension USB technology
Qualcomm Inc. has licensed TransDimension Inc.'s USB OTG technology.
2004-01-21 NEC licenses USB OTG tech from TransDimension
TransDimension, a provider of USB connectivity solutions for embedded applications, announced that NEC Electronics Corp. has licensed its USB On-The-Go (OTG) technology to integrate into their next-generation LSI chip for 3G mobile phones.
2003-02-20 Motorola licenses Transdimension's USB technology
Motorola Inc.'s Semiconductor Products Sector has licensed USB OTG technology from TransDimension Inc., in order to advance its connectivity roadmap for next-generation applications processors for portable information and wireless devices.
2003-07-11 ARM to co-market TransDimension USB technology
ARM Ltd and USB connectivity solutions provider TransDimension have formed an alliance to jointly market the TransDimension USB OTG core to ARM partners.
2002-07-16 Chip vendors rally behind USB on-the-go spec
USB is gaining support from different chip vendors.
2004-07-06 ARC sells USB business for $6.5 million
ARC International plc, a developer of user-customizable processors and development tools, has sold its "peripheral connectivity" assets to TransDimension Inc. for ?3.6 million (about $6.5 million), the company said Thursday (July 1, 2004).
2005-08-10 ULPI interface specs support hi-speed USB transceivers
The ULPI Working Group announced the first public availability of the UTMI+ low-pin interface (ULPI) industry specification for hi-speed universal serial bus (USB) and USB on-the-go (OTG) transceiver chips.
2007-07-17 Rise of mixed-signal SoCs hints at changing analog market
Despite such well-reasoned doubts, market statistics show an analog IP market on the rise. The analog and mixed-signal IP market grew 34 percent in 2006, accounting for 16 percent of the overall design IP market, says Gartner.
2008-05-09 PC cards reveal cost impact of spec revision in handsets
Portelligent's teardowns of two PC cards reveal the impact of higher-speed network found in the latest CDMA2000 1xEV-DO Rev. A phones.
2005-02-16 Comms, consumer electronics lead tech trends
Mainland manufacturers eye on developing new products and solutions targeting communications and consumer devices.
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