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| 2004-11-10 | TransDimension, SMSC to achieve USB-IF certification TransDimension Inc. and SMSC have announced the completion of high-speed USB compliance testing of the industry's first controller/transceiver solution utilizing the new UTMI+ Low Pin Interface (ULPI). |
| 2002-02-04 | TransDimension USB controllers geared for industrial, mobile apps The UHC124 embedded USB-host controller chip processes up to 16 USB-transactions, achieves transfer rates of 1.5Mbps and 12Mbps, and supports all four types of USB-transfers. |
| 2004-10-05 | TransDimension unveils single-chip USB OTG controller TransDimension released what it claims as the industry's first single-chip USB OTG controller that supports high-speed peripheral and full-speed host functionality. |
| 2002-04-12 | TransDimension to offer Agere PCI-based chip TransDimension, a developer of embedded and mobile connectivity solutions, will market and resell Agere System's PCI-based chip known as the Agere USS312TC, using the TransDimension brand name. |
| 2004-12-29 | SMSC, TransDimension achieve USB-IF OTG certification Standard Microsystems Corp. (SMSC) and TransDimension, a provider of USB connectivity solutions have completed the USB-IF On-The-Go (OTG) compliance testing for a hi-speed USB solution utilizing a stand-alone transceiver. |
| 2002-11-14 | Qualcomm licenses TransDimension USB technology Qualcomm Inc. has licensed TransDimension Inc.'s USB OTG technology. |
| 2004-01-21 | NEC licenses USB OTG tech from TransDimension TransDimension, a provider of USB connectivity solutions for embedded applications, announced that NEC Electronics Corp. has licensed its USB On-The-Go (OTG) technology to integrate into their next-generation LSI chip for 3G mobile phones. |
| 2003-02-20 | Motorola licenses Transdimension's USB technology Motorola Inc.'s Semiconductor Products Sector has licensed USB OTG technology from TransDimension Inc., in order to advance its connectivity roadmap for next-generation applications processors for portable information and wireless devices. |
| 2003-07-11 | ARM to co-market TransDimension USB technology ARM Ltd and USB connectivity solutions provider TransDimension have formed an alliance to jointly market the TransDimension USB OTG core to ARM partners. |
| 2002-07-16 | Chip vendors rally behind USB on-the-go spec USB is gaining support from different chip vendors. |
| 2004-07-06 | ARC sells USB business for $6.5 million ARC International plc, a developer of user-customizable processors and development tools, has sold its "peripheral connectivity" assets to TransDimension Inc. for ?3.6 million (about $6.5 million), the company said Thursday (July 1, 2004). |
| 2005-08-10 | ULPI interface specs support hi-speed USB transceivers The ULPI Working Group announced the first public availability of the UTMI+ low-pin interface (ULPI) industry specification for hi-speed universal serial bus (USB) and USB on-the-go (OTG) transceiver chips. |
| 2007-07-17 | Rise of mixed-signal SoCs hints at changing analog market Despite such well-reasoned doubts, market statistics show an analog IP market on the rise. The analog and mixed-signal IP market grew 34 percent in 2006, accounting for 16 percent of the overall design IP market, says Gartner. |
| 2008-05-09 | PC cards reveal cost impact of spec revision in handsets Portelligent's teardowns of two PC cards reveal the impact of higher-speed network found in the latest CDMA2000 1xEV-DO Rev. A phones. |
| 2005-02-16 | Comms, consumer electronics lead tech trends Mainland manufacturers eye on developing new products and solutions targeting communications and consumer devices. |
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