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2004-08-04 DRAM market seen headed for recession
The booming DRAM market is expected to head toward recession next year, a market research firm said Thursday (July 29, 2004).
2007-07-18 DPOs deliver more signal information for faster design
Powered by DPX acquisition technology, the latest DPOs allow designers to capture, view and measure dynamic signal information much more quickly and easily than other oscilloscopes, to propel a serial bus design ahead to meet a tight schedule, or to solve erratic troubleshooting problems quickly.
2005-11-17 DMMs pack Web interfaces
Agilent is introducing an expanded family of digital multimeters/voltmeters replete with built-in Web servers that make them operating-system independent.
2011-04-05 Display, signages push LCD, OLED market
The growth spur in the LCD and OLED manufacturing equipment market is driven by the growing demand for larger fabs of Gen 8, Gen 8.5 and Gen 10.
2006-08-15 Digitizers allow long recordings at high sample rates
Strategic Test's three new digitizer cards have standard signal memories of 64MByte expandable to 4GBytes, allowing long recordings at high sample rates.
2013-12-26 Digital trigger system with low trigger jitter
Read about a digital trigger system in an oscilloscope that results in very low trigger jitter.
2010-02-09 Digital test console supports PCIe 3.0 speeds
Agilent's U4301A digital test console supports PCIe 3.0 speeds, up through PCIe 8GT/s (Gen 3) with x1 through x16 support on both its protocol analyzer and LTSSM exerciser.
2008-03-18 Digital instrument meets need for deeper pattern memory
Credence has developed the DD1096-32 digital instrument with 32Mbyte of reconfigurable parallel vector memory to solve test challenges facing consumer applications requiring deeper pattern memory.
2006-01-27 Development kit supports 8051 MCUs
Ramtron has begun to offer its UniVersaKit, a development kit and evaluation system that supports all Ramtron Versa product families as well as most industry-standard 8051 MCUs.
2012-10-10 Developing reset-aware OVM testbench
Learn about each verification component and the changes required in consideration of the reset conditions.
2008-03-07 Design fuel gauging for multicell Li-ion battery pack (Part 2)
This is the conclusion of the two-part article that describes how the fuel gauging technology, the Impedance Track from TI, tackles these challenges in battery design and presents a brief example of a three-series, two-parallel battery pack solution.
2009-12-10 Debugging with high-bandwidth mixed-signal oscilloscopes
This article highlights a few of the challenges and how mixed-signal oscilloscope (MSO) can overcome these challenges.
2008-04-10 Debugging real-time distributed embedded apps
This article identifies the issues of real-time distributed system development and discusses how development platforms and tools have to evolve to address this challenging new environment.
2014-04-15 DC/DC converter module delivers power up to 50W
The power module from Ericsson features an ultra-wide input voltage from 18V to 75V, an output current of 15A at 3.3V output, and a built-in functional isolation of 2250Vdc for Power-over-Ethernet applications.
2008-03-19 Data converter packs four ADCs, two FPGAs
Pentek has released its Model 7150 High-Speed Data Converter, featuring four 200MHz, 16bit ADCs and a pair of high-performance Xilinx Virtex-5 FPGAs.
2003-11-25 Cygnal to deploy Credence test systems
Cygnal Integrated Products Inc. has purchased two of Credence Systems Corp.'s Octet SoC test systems.
2005-03-07 Cross-domain protocol tester checks PCI Express, Fiber Channel
Offering multi-protocol analysis with time correlation, Agilent is debuting an enhancement to its existing E2960A series system protocol tester.
2012-01-10 Create sounds using analogue electronics (Part 4)
The fourth installment of this series tackles voltage-controlled amplifiers.
2009-03-19 Court dismisses lawsuit vs. Qualcomm
The U.S. District Court for the Southern District of California granted Qualcomm Inc.'s motion to dismiss a lawsuit brought by Broadcom Corp. seeking a declaration that Qualcomm's patents are exhausted and unenforceable.
2014-10-09 Cortus wrestles ARM in deeply embedded arena
Cortus developed a family of products based on its v2 instruction set offering increased code density that will meet the power and size requirements of new connected devices.
2015-05-14 Connecting passive components to logic gates
By adding a few passive components, you can make circuits such as level converters, frequency multipliers, phase detectors, line drivers, and pulse changers.
2006-08-09 Compliance test solution rolls for USB 2.0 designs
If you're designing-in USB 2.0, check out the busXplorer USB 2.0 compliance test solution from Yokogawa Corp. of America. to ensure your designs will meet all USB specs defined by the USB-IF.
2010-08-04 Compiler accelerates code execution by 20 percent
National Instruments has incorporated off-the-shelf compiler technologies that execute code an average of 20 percent faster in LabVIEW 2010.It also adds access to a marketplace for evaluating and purchasing add-on toolkits for integrating custom functionality into the platform.
2006-07-19 Coherent expands LAMBDA SX industrial laser series
Coherent introduced three new models to its LAMBDA SX series of high-power, industrial excimer lasers, all operating at up to 300Hz.
2014-06-11 CMOSIS upgrades imager with NIR enhancement
The near infra-red upgrade enables its 12Mpx/300fps global shutter CMOS image sensor to acquire images outside the visual wavelengths for machine vision and traffic applications/
2014-10-13 CMOS cameras focus on machine vision apps
The 8k line scan camera from Teledyne flaunts high responsivity in the visible and NIR wavelengths; multiple user coefficient and FFC calibration sets; and support of camera link cables up to 10m.
2005-05-27 Clock extraction circuitry times high-speed communications test
What you need to know when testing digital communications systems.
2007-06-28 Chipset shrinks powertrain footprint by 45%
International Rectifier has expanded its XPhase family of scalable multiphase converter chipsets with the introduction of the IR3500 control IC and IR3505 phase IC.
2007-06-11 Chips lower external part count, powertrain footprint
IR claims that its new XPhase chipset reduces external component count by 25 percent, which combined with a higher switching frequency, reduces the powertrain area by 45 percent in a five-phase design compared to previous generation technology.
2004-04-15 Chip market to stay healthy if prices don't over-inflate
The growth in worldwide IC revenues is being driven primarily by increased demand for IC units as opposed to rising ASP, a positive sign indicating this boom isn't over yet, confirmed Advanced Forecasting.
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