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2011-08-11 Tri-gate rouses Intel-ARM rivalry
Intel's announcement of its low-power tri-gate transistor triggers anew its competition with ARM.
2012-12-12 Intel tweaks 22nm tri-gate SoC for ultra-low leakage
Intel goes into the nitty-gritty of the latest modification to its 22nm tri-gate (FinFET) SoC technology.
2013-02-27 Intel to produce Altera FPGAs via 14nm tri-gate tech
Altera has entered into an agreement with Intel wherein its FPGAs will be manufactured using the chip maker's 14nm tri-gate transistor technology.
2014-04-24 Altera samples FPGA tech on 14nm Tri-Gate process
The resulting 14nm devices returned positive results in the high-speed transceiver circuitry, digital logic, and hard-IP blocks that will be used in Stratix 10 FPGAs and SoCs. They are also capable of up to 1GHz operating performance and up to 70 per cent reduction in power consumption.
2012-06-15 TI describes 28nm CMOS TSV integration
A paper by TI researchers showed results indicating minimal effect on transistors within 4 microns of TSV placement.
2011-07-07 TAITRA: TSMC, Intel to battle over 3D chips
TSMC is challenging Intel in the 3D arena as it plans to release 3D chips by the end of 2011.
2012-12-17 Panel: No single approach in future of ICs
A group of experts at IEDM debated about the various technologies in semiconductor miniaturisation, with FinFETs being just one of many approaches.
2012-05-04 Kontron rolls Intel Core i7-based embedded computing platforms
Based on Intel's 22nm 3D tri-gate transistor technology, the processor-based boards offer up to 20 percent enhanced computing power and up to 40 percent higher performance/W compared to the previous generation.
2012-02-23 Intel to make Tabula's 22nm devices
For years, Intel only dabbled in ASIC and foundry sector. Since the Achronix deal was announced, some analysts saw that the chip giant was set to increase its presence it the foundry space dominated by TSMC.
2012-02-23 Intel showcases Ivy Bridge
Ivy Bridge packs 1.4 billion transistors into 160mm2 in its largest version. According to Intel, they plan to release at least four major variants of the chip.
2012-09-17 Intel showcased technologies for a wireless future
Intel's CTO Justin Rattner sees a future heavily geared towards wireless connectivity, debuting technologies such as an all-digital Wi-Fi radio, Cloud Radio Access Network and Video Aware Wireless Network.
2002-09-27 Intel develops 3D transistor design
Intel researchers have developed a 3D "tri-gate" transistor design that is expected to perform better than traditional planar (flat) transistors.
2011-09-16 Intel details its first 22nm processor
The company gave its first public disclosure of Ivy Bridge, which features improvements in on-board graphics and advances in power management and security.
2011-05-12 IHS: Intel's tri-gates impede ARM's dominance
A market research report by IHS cites low-power consumption of Intel's 22nm tri-gate transistor as an advantage of the company over other competitors.
2012-05-23 Analysis reveal Intel finFETs' triangular structure
The triangular section is markedly different to the idealized rectangular section that Intel had shown previously in 2011.
2011-05-09 Intel transistor uses 3D structure
Intel has released a 3D transistor design called Tri-Gate into high-volume manufacturing at the 22nm node in an Intel chip codenamed 'Ivy Bridge.'
2014-09-10 Intel delivers third-gen Xeon processors
In benchmarking the new 22nm, 3D Tri-Gate technology, Intel claimed its new Xeon processors had already broken world performance records with up to threefold increases over generation two.
2015-06-10 Altera touts next-gen high-end programmable logic devices
The Stratix 10 FPGAs and SoCs leverage Altera's HyperFlex FPGA fabric architecture built on the Intel 14nm Tri-Gate process to provide 2X higher core performance over previous generation FPGAs.
2012-07-03 UMC looks to catch up with competitors with IBM deal
UMC looks to drastically improve its position with 20nm low power process with FinFET development license from IBM.
2011-06-29 U.S. Congress' patent reforms draw mixed reactions
While large electronics firms hailed the patent reforms, particularly the minimization of unjustifiable patents, individual investors called them a bill about influence, ignorance and indifference.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2005-06-17 TI outlines further CMOS scaling
Texas Instruments Inc. (TI) is presenting papers that describe key accomplishments on advanced materials and manufacturing process development at the 2005 Symposium on VLSI Technology.
2014-08-06 Things unsaid about the new Fujitsu-Panasonic Co.
The announcement last week revealed a few details of the new fabless chip companyincluding its CEO, its ratio of voting rights, and the number of employees.
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2011-12-14 SRAM boasts operation as low as 0.425V
Fujitsu Semiconductor and SuVolta have cut the power consumption of SRAM blocks by cutting CMOS transistor threshold voltage variation by half.
2005-01-05 Soitec, ADF to develop MuGFETs for 45nm technology
In an effort to accelerate the development of new-generation transistors, Soitec Group has disclosed its participation as the SOI substrate supplier in a development program led by Advanced Technology Development Facility (ATDF), the new independent subsidiary of Sematech for advanced semiconductor R&D.
2012-07-31 Simulation reveals double battery life thru FinFETs-on-SOI
Gold Standard Simulations performed TCAD simulations where fully depleted FinFET style transistors made on SOI wafers allowed between half and one-third the leakage current of FinFETs made on bulk silicon.
2013-11-19 ROHM offers PMICs aimed at Intel Bay Trail I platform
The BD9596MWV, based on the Intel Atom processor E3800 family, targets industrial and commercial equipment markets, which includes car infotainment, industrial robotics and POS systems.
2014-02-07 Rise of mobile devices push market for wafer-level packaging
ReportsnReports predicted that the global wafer-level packaging equipment market will grow at a CAGR of 2.9 percent over the period from 2013-2018.
2014-03-26 New SerDes chip shines spotlight on Intel's 14nm process
The 14nm version of the SerDes chips gives Intel a chance to reinforce its message of technical superiority, even in the absence of much of its other 14nm processor products.
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