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2004-01-19 Zarlink TDM/TSI switches suit wireless networking equipment
Zarlink Semiconductor has launched what it claims as the industry's most fully featured TDM/TSI switch family for wireless networking equipment.
2002-04-18 TSI spins-off ceramic composites into new company
Triton Systems Inc., a materials product and process development firm, has spun-off its Extreme Environment Composites group to form Ceracom Inc.
2003-01-27 TSI FPC/FFC connectors rated to 50V, 0.4A
The BL116 XXX series of FPC/FFC connectors is rated with a maximum voltage of 50V and current of 0.4A.
2008-01-11 Microsemi to buy military solutions provider TSI
Microsemi has acquired TSI Microelectronics, which supplies the U.S. Department of Defense and its OEM contractors hybrids and other special products used in mature, long-life defense and aerospace programs.
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions.
2004-01-16 Stretch TDM network to meet next-gen needs
Time-slot interchangers have morphed into a vital, low-cost means of extending TDM networks to meet increasing performance demands.
2003-03-11 Programming the Ambassador T8100, T8100A, T8102, and T8105 registers
This application note explains in detail how to program the Ambassador family of time-slot interchangers.
2011-12-07 IME, Tezzaron develop "2.5D" interposer tech
A*STAR Institute of Microelectronics and Tezzaron Semiconductor aim to refine the design and manufacture of silicon interposers and standardize the process, flows, and process design kits.
2001-06-16 Designing a next-generation voice gateway
This article explains voice gateways?now common in internetworking deployments, where speech, fax, modem and data processing functions coexist.
2003-03-11 Constant Delay Using the FME Bits and the CON Register in the Ambassador T8100A, T8102, and T8105 TSIs
This application note clarifies the uses of the FME buts and bits 0 and 1 in the CON Register of the T8100A, T8102, and T8105
2013-06-25 A*STAR IME, IC firms team up to tackle industry issues
A*STAR Institute of Microelectronics launched the 2.5D Through-Silicon Interposer Consortium to speed market adoption of TSI tech, which is driven by demands in computer infrastructure and CEs.
2002-08-12 Shanghai Bell selects IDT line for next-gen transport apps
Alcatel Shanghai Bell Co. Ltd has selected IDT octal E1 LIU, 2Kx2K TSI switch, and quad codec for its latest OADM, access network, and optical transmission system applications.
2012-12-20 A*STAR offers 2.5D through-silicon-interposer MPW service
The service is aimed at providing a cost-effective platform to do research and development prototyping and proof-of-concept in 2.5D TSI technology.
2003-11-11 Zarlink TDM family eases board-level design
The company has launched a family of mid-density TDM switching devices that simplifies board-level design.
2008-01-25 Processor eases shift from TDM to VoIP MSANs
Mindspeed Technologies has introduced a family of highly-integrated VoIP processors that enable the migration of copper loop voice access networks from traditional Class-5 TDM equipment to next-generation VoIP MSANs.
2012-12-21 Nikon, IME to open lithography R&D lab in Singapore
Nikon has teamed up with A*STAR's Institute of Microelectronics for an R&D facility in Singapore that will develop advanced optical lithography technology for IC manufacturing.
2014-11-26 Image sensor tech promises a wealth of features
GalaxyCore developed the Through-Silicon-Illumination technology that claims to boost sensitivity and signal-noise ratio with reduced thermal noise, dark current and crosstalk, and higher frame rates.
2003-05-23 IDT transceivers deliver configuration flexibility
Integrated Device Technology Inc. has released its SuperJET family of J1/E1/T1 transceivers and monolithic octal density device that is said to address next-generation universal line-card designs in communications applications.
2008-06-27 I/O controller supports Intel Eaglelake, AMD AM3
Winbond Electronics Corp. announces its next generation Super I/O controller: the W83667HG.
2014-09-29 From volume to value: Singapore electronics industry matures
The tumble Singapore's electronics manufacturing output took in the period of April to July has been a source of concern for many. With the rosy August results spelling a turn for the better, the weakened numbers may have been indicative of an industry that is moving up the value chain.
2002-11-28 Change of guards at IDT bolsters comms focus
In January 2003, when Greg Lang ascends to the CEO job at Integrated Device Technology Inc., a 1980 high-speed SRAM startup, the move will reflect the company's ongoing shift to an exclusive focus on comms space.
2012-02-13 Challenges, opportunities of the 2.5D/3D ecosystem
While opportunities abound, moving to 2.5D/3D manufacturing has posed significant challenges to designing, fabricating, assembling and testing of 2.5D/3D ICs.
2007-06-01 Build a hybrid IPTV-DTV/DVB STB
While the IPTV business is in its infancy and the terrestrial transmission of digital signals takes over from analog, there is a need for a STB that is a hybrid of the two sets of requirementsi.e., that can receive, decode and display terrestrial DTV signalsas well as provide a platform for the viewing of IPTV services.
2014-10-15 Automotive communication backbone: MOST vs Ethernet
Read about the battle between MOST, the de facto standard used as the infotainment backbone in vehicles, and Ethernet, the standard used for the IT infrastructure in the consumer/commercial world.
2002-09-26 Agere ships multi-rate, multi-channel framer IC
The TSOT1610G is claimed to be the industry's first multi-rate, multi-channel framer IC, supporting 16-channels of OC-3/STM-1, 16 channels of OC-12/STM-4, four channels of OC-48/STM-16, or a single OC-192/STM-64.
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