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2001-08-23 Recommended land pattern for SST TSOP devices
This application note describes the advantages of the 8-by-14mm TSOP housing for board layout of SST's Flash memories and provides information to make conversion to the 8-by-14mm TSOP housing or use of either package easier.
2002-02-27 Irvine Sensors rolls out memory chips with TSOP footprint
The company's Microelectronics Products Division has announced the shipment of its "Skinny Stacks" stacked memory products that match the footprint of next-generation TSOP ICs.
2001-09-25 Dual footprint layout for 16Mb and 64Mb TSOP packages
This application note proposes support for both 16Mb and 64Mb SDRAM densities by creating board layouts for devices soldered down to the system board.
2003-09-05 Chipmos to expand FBGA, TSOP monthly outputs
Chipmos Technology will be expanding its FBGA packaging devices by 100 percent this month.
2006-03-21 UTAC, SMIC launch Chengdu joint venture
UTAC and SMIC announced at an opening ceremony for their joint assembly and test facility that the factory has already moved into the pilot production phase.
2006-12-14 UTAC, SMIC joint fab to break-even next year
The joint venture of United Test and Assembly Center and Semiconductor Manufacturing International Corp. in Chengdu, China is projected to register a break-even next year.
2003-03-25 UMD Technology to acquire interconnect supplier assets
UMD Technology Inc. has signed a definitive agreement to acquire the assets of Wells-CTI Inc., a supplier of interconnect devices, including the capital stock of Japan corporation Wells-CTI Kabushiki Kaisha.
2000-12-11 Storage and handling of Drypacked surface mounted devices (SMD)
This application note provides ON Semiconductor customers with the necessary storage and handling guidelines to preclude component package cracking during solder reflow procedures.
2008-07-02 Mobile SDRAM rolls from ISSI
Integrated Silicon Solution Inc. has introduced the first members of its PowerSaver Mobile SDRAM family with 128Mbit, 256Mbit and 512Mbit Mobile SDRAMs offered in x8, x16 and x32 configurations.
1999-10-01 Migration from 16Mb to 64Mb Flash memory devices
This document deals in creating a seamless migration path from AMD 16Mb or 32Mb low voltage (LV) Flash and simultaneous Read/Write (DL) devices to higher densities
2002-07-26 Kingston develops CSP technology for memory modules
Kingston Technology Co. Inc. has introduced the Elevated Package Over CSP (EPOC) 3D memory module technology.
2002-07-08 Fujitsu supplies Flash memory for CSR's Bluetooth solutions
Fujitsu Ltd has agreed to supply Flash memory to CSR for its Bluetooth requirements.
2002-04-15 Avnet programming center receives ISO certification
Avnet Global Services' programming center in Singapore has received an ISO 9001:2000 certification after 14 months in operation.
2005-02-25 expands Chip-Changer line expanded its Chip-Changer adapter product line, with the new Chip-Changers designed for 40-pin and 48-pin TSOP Type-I IC packages.
2003-09-11 TAEC Flash devices come in lead-free versions
Toshiba America Electronic Components Inc. has announced that all its NAND Flash memory TSOP devices are available in lead-free packaging.
2002-01-28 ICSI 4Mb SRAMs consume 25A standby current
The IC62VV25616L, IC62VV25616LL and IC62VV5128LL 4Mb low-power SRAMs are fabricated on a 0.155m CMOS process technology, and are housed in 44-pin TSOP II, 32-pin TSOP or 48-pin TFBGA package.
2013-06-14 Alliance Memory's CMOS SRAMs boast 10ns access time
The AS7C316096A and AS7C316098A CMOS SRAMs are both offered in the 48-pin, 12mm by 20mm TSOP-1 package and operate from a single power supply of 3.3V.
2013-05-07 32M CMOS SRAM offers 2.7V to 3.6V power supply
Alliance Memory's AS6C3216 operates from a single power supply of 2.7V to 3.6V, boasts a fast access time of 55ns and is offered in the 48-pin, 12mm by 20mm TSOP-I package.
2006-10-25 Winbond unrolls three SDRAM product series
Winbond has announced its latest range of SDRAM products the 64Mbyte W9864 series, the 128Mbyte W9812 series and the 256Mbyte W9825 series.
2007-03-01 Winbond unrolls parallel, serial flash devices
Winbond has announced three new parallel flash memory devices in its W19B product family and two new serial flash memory devices in its SpiFlash W25X family.
2007-07-25 Winbond tips new parallel flash memory devices
Winbond Electronics Corp. has added new products to its W19B family with the introduction of 16-, 32- and 64Mbit parallel flash memory devices.
2004-04-20 WED module targets memory system apps
The 2GB DDR SDRAM registered ECC memory module from White Electronic Designs is claimed by the company to provide maximum performance for memory system apps.
2002-01-18 UTAC teams up with M-Systems on MCPs
United Test and Assembly Center Ltd (UTAC) is collaborating with M-Systems to deliver MCP (Multi-Chip Package) leaded and array packages.
2009-05-05 Ultrasmall MOSFET touts lowest on-resistance
Vishay Intertechnology Inc. has released a new dual 20V p-channel TrenchFET Gen III power MOSFET with the lowest on-resistance ever achieved for a dual p-channel device in the thermally enhanced PowerPAK SC-70 2mm x 2mm footprint area.
2003-11-05 Transcend DIMM features advance FBGA package
Transcend Information Inc. has announced the availability of its 1GB DDR400 (PC3200) unbuffered memory modules that apply advance FBGA package and original DDR400 high-capacity DDR DRAM.
2011-04-11 Toshiba takes 24nm route for NAND flash
SmartNAND integrates NAND flash memory with a control IC that can perform error checking and correction, thereby removing the burden of ECC from the host processor and enhancing speed performance.
2004-04-13 Toshiba rolls out first 4Gb single-die MLC NAND flash unit
Toshiba has disclosed that it has introduced the semiconductor industry's first 4Gb single-die, multi-level cell, NAND flash memory.
2002-09-10 Toshiba Flash memories have larger page size
Toshiba Corp. has announced the availability of 1Gb NAND Flash memories that feature a 2,112-byte page - four times more than the page size of previous NAND devices.
2002-04-18 Toshiba Flash memories have 60ns access time
Toshiba has announced the availability of its 0.165m page-mode 64Mb and 128Mb NOR Flash memories that feature a random access time of 60ns and page access time of 20ns.
2002-01-31 Toshiba FCRAM features 25ns access time
The TC59LM806CFT and TC59LM814CFT FCRAM have a random access time of 25ns and a data transfer rate of 400Mbps at 200MHz.
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