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2006-12-18 Ultralow-cost handsets call for single chip
The market for ultralow-cost handsets is expected to grow quickly over the next three to four years, as more than two-thirds of new subscribers come from developing countries.
2007-09-06 NXP single-chip solution enables ultralow-cost handsets
NXP Semiconductors has released its Nexperia PNX4903 GSM/GPRS-optimized multimedia solution for the ultralow-cost segment of the mobile handset market
2007-08-23 More vendors dip in ultralow-cost handset market
ABI Research predicts that more than a dozen handset vendors will ship sub-$50 models by 2008 and almost one out of every four handsets shipping globally by 2011 will be an ultralow-cost handset.
2008-03-03 Ultralow-cost phones ring in chip opportunities
The growth of the ULC handset market is changing the dynamics of the handset business. Traditionally, a handset manufacturer would rely exclusively on one vendor to supply chips for all its phones but ULC phones are changing this model.
2008-02-12 NXP chip brings triband, Bluetooth to ULC handsets
NXP is expanding its range of fully-integrated GSM/GPRS single-chip solutions for the ULC handset market with the Nexperia PNX4902 that offers ULC+ concept with tri-band and Bluetooth support.
2007-04-16 Next-gen handsets call for balance
The one constant in cellphone design is change. This article discusses the latest handset design trends and their implications.
2007-02-01 Single-chip CMOS enables low-cost handsets
With cost being a driving force to get the unconnected connected, handsets must become available at very low pricing. The E-GOLDradio GSM/GPRS single-chip solution is the latest step toward cost-effective CMOS integration
2007-09-04 NXP single-chip solution soon to power Samsung handsets
NXP Semiconductors has disclosed that it will soon ship single-chip solution for ultra-low-cost (ULC) phones to Samsung, according to a Reuters report.
2006-07-18 Monolithic GSM phone IC rolls for low-cost handsets
Silicon Laboratories Inc. has developed a single-chip GSM phone aimed at the ultralow-cost handset market
2007-05-28 Infineon ULC platform powers ZTE handsets
Infineon Technologies announced that its second generation ultra-low cost (ULC2) platform, based on the single-chip E-GOLD voice solution, has been selected by ZTE Corp.
2007-10-08 TriQuint hits 5M mark in ULCH module shipments
TriQuint Semiconductor announced it has shipped 5 million integrated Quantum Tx Modules for use in Vodafone's ULCH models.
2007-04-13 Soon in a store near you: A $10 mobile phone
UC Berkeley's Center for Information Technology Research in the Interest of Society is reportedly reaching out to Taiwan contract manufacturers to see if a $10 mobile phone can be done.
2006-12-18 No-frills phones gain ground in China
The vision of a billion people equipped with cellphones is creeping toward reality in China, as the market for ultralow-cost handsets begins to build unexpected momentum.
2007-02-16 Motorola licenses TTPCom technology to Marvell
Marvell Technology Group Ltd has reached an agreement with Motorola to license Motorola's TTPCom cellular protocol software stack.
2008-07-16 Conquer ULC handset design challenges
Ultralow-cost (ULC) handsets have been a hot topic in the past three years. ULC today refers to handsets that can be built for $20 or less. They represent a unique segment of the cellular market and require a unique set of strategies for success.
2006-10-27 Low-cost phones soar in China
The market for ultralow-cost handsets is beginning to take off faster than expected in China.
2008-01-10 Rich features define cost-conscious phone
At an estimated total cost to manufacture of less than $45 based on a Portelligent teardown analysis, the Tianyu B811 finds itself positioned just above the ultralow-cost voice-only phones, where BOM costs have now dropped below $30
2007-10-11 NXP picks CEVA DSP core for ULCH solutions
NXP has selected the CEVA-Teak DSP core for its highly integrated ultralow-cost single-chip solutions targeting low-cost and entry-level handset designs for emerging markets
2009-01-22 New-gen ULC handset platform unveiled
Infineon Technologies has announced a new generation of its ultralow-cost (ULC) handset platform along with a highly integrated one-chip solution for this type of handsets.
2007-03-06 65nm GSM solution targets ULC handset market
Texas Instruments has announced a third-generation GSM solution for the ultralow-cost (ULC) handset market
2007-02-15 Wireless industry to face slowdown
The participants at the 3GSM World Congress may be unveiling a wide range of new mobile phone-based products, but their biggest challenge is the fact that wireless growth is poised to slow dramatically.
2007-10-30 iSuppli: Qualcomm, TI outran wireless chip market in Q2
Qualcomm and TI had outpaced the wireless semiconductor market in Q2, according to market researcher iSuppli Corp.
2007-06-15 InGaP HBT vs. CMOS for mobile handset power amps
Selecting the right type of PA is one of the key decisions that can help achieve a compelling design that delivers a competitive advantage.
2006-09-18 Freescale develops wireless push
Freescale Semiconductor is stepping up its wireless push, armed with innovations in magnetoresistive memory and packaging, and guided by a new general manager, Sandeep Chennakeshu, recruited from Ericsson's handset group.
2006-09-18 E-paper display rolls for handset markets
Tapping a new display technology, Motorola's 9mm-thick Motofone uses an electrophoretic displayan ultrathin, low-power display often referred to as electronic paper.
2007-10-25 CEVA eyes brilliant future in DSP
CEVA has announced that NXP was adopting its CEVA-Teak DSP core for its ultalow-cost cellular solutions. The move isn't too surprisingCEVA was left as the only pure-play DSP licensorat least as far as "general-purpose" DSPs are concerned.
2009-11-06 Wireless combination ICs get more popular
Growth of combination wireless ICs is forecast to increase at a CAGR of nearly 30 percent between 2008 and 2013, according to IMS Research
2007-05-01 Platform enables low-cost feature phones
Chipnuts Technology Inc. is looking to exercise soft power to elbow its way into the Chinese market for midlevel to high-end feature phones.
2009-01-20 LTE, 3G RF chips tout high data rates, cost savings
Infineon Technologies has begun sampling the SMARTi LU RF transceiver providing 2G/3G/LTE functionality with a DigRF digital baseband interface for high data rates up to 150Mbit/s in LTE networks.
2007-02-15 Chipnuts makes 'platform' for sub-$200 smartphones
Chipnuts is touting a Linux-based OS, a suite of business applications and an applications processor that are part of a reference design targeting local handset makers looking to design smart phones that would retail for less than $200.
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