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2009-07-16 Novellus, Albany NanoTech team on sub-22nm R&D
The College of Nanoscale Science and Engineering at the University at Albany and Novellus Systems Inc. have formed a $20 million partnership to conduct next-generation R&D sub-22nm semiconductor manufacturing technology.
2008-01-23 IMEC, U.S. university partner on EUV litho research
EUV litho experiments will be carried out in collaboration by IMEC and the College of Nanoscale Science and Engineering of the University at Albany as a means to accelerate the introduction of the process in manufacturing.
2005-09-28 Albany NanoTech, IBM, Applied in $300 million chip research pact
Albany NanoTech, IBM, and Applied Materials have teamed on a partnership that will make more than $300 million available for research, development and economic outreach at the State University of New York's Albany NanoTech site and add over 80 research jobs.
2008-09-23 Albany NanoTech to open 22nm R&D fab
Albany NanoTech is set to open a new facility that will focus on 22nm R&D technology, post-CMOS processes and clean technology
2008-09-24 Albany NanoTech beefs up cleantech efforts
Eyeing to achieve its success in semiconductors, Albany NanoTech, together with its parent organization, is bringing its collaboration model over to clean technology
2003-02-19 EUV activity shifts to Sematech North
Developers of EUV lithography are looking north, specifically to the University at Albany, State University of New York, for their future.
2010-06-08 Sematech, AZ work on EUV resist issues
AZ Electronic Materials has joined Sematech's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
2009-11-25 Sematech expands, muses fabless push
Sematech is looking at ways to bring fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers
2010-04-07 Partners work on solar cell electroless plating
The CNSE of the University at Albany and Technic Inc. have entered in an R&D partnership designed to enable critical improvements in manufacturing processes for solar cells.
2011-01-14 Nissan Chemical, Sematech join forces for EUV research
The company joined Sematech's Resist Materials and Development Center at University at Albany's College of Nanoscale Science and Engineering to cut line edge roughness and pattern collapse in images below 22nm.
2012-01-25 IBM, Globalfoundries to jointly manufacture advanced ICs
Globalfoundries Inc. and IBM Corp. has announced that they are going to jointly manufacture advanced computer chips at both companies' semiconductor fabs in New York's "Tech Valley
2006-11-20 EUV making slow progress, reports Intel
An Intel Corp. technologist disclosed that extreme ultraviolet (EUV) lithography is making little progress, prompting the firm to look at the deployment of immersion technology at its 32nm node
2009-03-03 22nm chips to be developed by trio
IBM Corp., Applied Materials Inc. and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany have agreed to jointly develop process modeling technology for manufacturing 22nm logic and memory chips.
2013-05-10 Silver lining for Japanese fabs
The latest chatter on the streets of Tokyo is that at least one foreign company is bidding for a fab that a Japanese chip company is trying to dump
2008-08-20 IBM rolls out 'smallest' SRAM
IBM Research boasts to have fabricated the world's smallest SRAM bit cell with joint industry and university development partners. The SRAM bit cell, which was cast using 22nm design rules, measures simply 0.1?2
2008-07-21 Chip industry preps for 'More than Moore' era
Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore
2008-02-06 Will EUV litho ever cross over from R&D to production?
The procurement of an R&D EUV lithography tool from Nikon has reportedly been put off by Intel, raising more questions about the viability of EUV for mass chip production.
2009-03-03 Sematech, Asahi Glass to improve EUV mask blank yield
Sematech and Asahi Glass Co. (AGC) have entered into a joint development partnership to accelerate mask blank commercialization.
2008-08-14 Sematech reports progress on EUV litho for 22nm
Sematech has disclosed a way of using extreme ultraviolet (EUV) lithography to define silicon devices with a half-pitch resolution as small as 22nm.
2007-10-24 Quest on for next 'big thing' in semiconductor industry
The semiconductor industry may be on its last stretch, according to the consensus of researchers who are looking for the next 'big thing.'
2007-05-07 New IBM tech enables faster ICs
IBM scientists announced that they have devised a way to create vacuum spaces between copper wires in semiconductors, which will reportedly lead to chips that consume less power and run faster.
2011-06-27 KLA joins Sematech's litho defect reduction program
Upon joining the Sematech program, KLA will collaborate with the consortium's engineers on such areas as defect source identification and elimination, and EUV manufacturability and extendibility.
2009-04-15 IBM, CEA/Leti to cooperate on nanoelectronics research
CEA/Leti (the Electronics and Information Technology Laboratory of the CEA based in Grenoble) and IBM will collaborate on research in semiconductor and nanoelectronics technology.
2005-07-21 IBM, AMD, Infineon, Micron form litho club
Chip makers IBM Corp., Advanced Micro Devices Inc., Infineon Technologies AG, and Micron Technology Inc. are joining forces with ASML Holding NV and KLA-Tencor Corp. in a $600 million seven-year consortium called INVENT, according to a timesunion.com report.
2011-03-14 Hynix supports Sematech 3D interconnect program
By joining the 3D Interconnect program, Hynix hopes to help accelerate the commercialization of wide I/O DRAM and realize 3D's potential as an affordable path to IC production growth.
2011-05-24 FUJIFILM joins SEMATECH's resist center
FUJIFILM has joined SEMATECH's Resist Materials and Development Center to further enhance the technology on image development and testing imaging materials for EUV sensitivity.
2009-07-22 Fab tool collaboration: Mission impossible?
Will the day come when rival fab tool vendors will throw out the rule book and collaborate with each other on new equipment R&D projectsjust to help the industry keep pace on Moore's Law?
2003-07-08 Asahi takes part in ISMT EUV lithography project
Asahi Glass Co. Ltd and Int. SEMATECH have agreed to partner on developing advanced mask technology and materials for use in EUV lithography.
2004-07-09 Sematech to open R&D center for immersion lithography
International Sematech on Tuesday (July 6, 2004) announced the formation of an R&D center to develop and push immersion lithography into the marketplace.
2008-07-29 Nanotech research encourages Russia-U.S. partnership
Executives from Rusnanotech have concluded their first visit to four U.S. nanotech centers, with an objective of promoting collaborative research.
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