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2010-01-07 Through-hole LEDs help improve readability in sunlight
Avago Technologies debuts a series of 5mm green and blue high brightness, high performance through-hole LEDs for use in electronic sign and signal applications.
2014-06-23 The lowdown on batteries: Zinc/silver-oxide
This battery is known for its high energy density and flat discharge curve. It has found use as a backup power source in the space industry, as well as for the military in some specialty areas.
2005-09-01 The basics of implementing DSP functions on low-cost FPGAs
For cutting-edge designs where cycles are tight, requirements are fluid, and expected volumes are uncertain, system companies implement most core functionality and DSP in low-cost FPGAs.
2012-06-29 Testing broadband CATV amps with true wideband channel rasters
Learn about the process of estimating a wideband amplifier's performance.
2008-01-21 Tested, effective methods for optimizing DSP algorithms
This article describes the optimization process basics and various practical 'C' level skills needed to accelerate an algorithm. Processor and complier specific options are excluded as they are typically found in the respective vendor documents.
2007-06-15 Test your blood in a Breeze
Unlike traditional meters, Bayer's Ascensia Breeze brings a level of convenience to glucose monitoring by the use of a disk containing the chemistry needed for measurements.
2010-11-05 Test solution validates LTE performance
Agilent Technologies and Nomor Research are cooperating to provide a way to generate real-world cellular interference signal conditions for validating LTE system performance.
2006-06-27 Test solution measures battery life of mobile apps
Azimuth has announced a test solution that accurately measures power consumption of mobile platforms.
2005-03-14 Termination system protects MLCCs
AVX developed a soft termination system for its line of MLCCs that allows nearly three times the amount of board flexure when compared to standard termination systems.
2010-02-15 Temp sensor monitors two app processor ASICs
The SX8733 temp sensor combines integrated temperature sensor with monitoring electronics to directly connect up to two temperature diodes and monitors one or two application processor ASICs
2009-05-20 Tektronix rolls low-cost mixed-signal oscilloscopes
Tektronix is offering a lower-cost version of the MSO series of mixed-signal oscilloscopes combining two or four analog channels with 16 digital channels.
2006-08-23 Tektronix expands differential oscilloscope probe line
Scope maker Tektronix is extending its existing Z-Active family of differential oscilloscope probes with the immediate availability of its 6GHz P7360 Active Differential Probe.
2006-10-17 Tektronix adds new test capabilities to spectrum analyzers
Tektronix unveiled new software measurement capabilities for digital RF tests that support 3G mobile phone technology, HSUPA and Project 25 - Mobile Land Radio standard.
2014-06-11 Techniques for enabling dimmable LED bulbs
Many LED lamps are advertised as dimmable, however in reality the performance of many of them is unimpressive with varying results depending on the dimmer used and loading of the circuit.
2003-01-09 Tech collaboration form strategic outsourcing contracts
IBM has inked separate agreements with Sanmina-SCI Corp. and Solectron Corp., to provide a range of additional manufacturing services in North America and Europe.
2008-03-03 Team up to win the yield game in the nm era
Designers and manufacturers are two sides of the same team, sharing a common goalyield. To win out, they need to align their strategies, their skills and their knowledge, and work together to overcome the challenges. That's the way the game is played in the nanometer era, says Anthony Nicoli of Mentor Graphics.
2005-06-14 TDR instrumentation uses USB
Hyperlabs' TDR instrumentation line now includes a Model USBTDR Family of so-called TDR heads that are powered by USB.
2005-05-05 TDK starts dc-dc converter production
TDK disclosed that it has started mass production of its CC-E series of compact, insulated dc-dc converters targeted at communications devices and industrial equipment.
2009-07-28 TDD: Paving the future of wireless comms
Despite some lingering complexity in the market over which wireless standard will next prevail, it is very clear that time division duplex (TDD) is one of the most flexible schemes to meet the bandwidth demands of today's and tomorrow's networks.
2005-09-22 TD-SCDMA serves as a new battleground for 3G
The technology, which relies on a combination of TDD and synchronous CDMA, offers some key advantages.
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2005-05-25 Taming power inductors for SoC integration
How can we discard power inductors from our designs?
2015-06-15 Taking apart the iPhone 6 Plus battery
TechInsights looked into the iPhone 6 Plus battery, weighing in at 43g, which initially is not standing out from the trend line and does not seem to be special, but being Apple it is nonetheless interesting.
2011-09-01 Taking advantage of ambient energy
Know how to convert ambient energy sources into electrical energy by utilizing an appropriate transducer, such as thermoelectric generator for heat, a piezoelectric element for vibration, or a photovoltaic cell for sunlight.
2008-02-18 Take a holistic approach to power management for mobile devices
Power management no longer remains a hardware-only problem; rather it has become a system problem that is being addressed by all engineers involved in the system design process. Power management decisions are being taken at both hardware and software level. Increasing focus towards system aspects of cellular phones compels designers to take a holistic and dynamic approach to power management to effectively decrease power consumption without degrading performance.
2002-08-12 Taiwan prepares for MEMS technology battle
Taiwan is looking to repeat its success with semiconductors by tackling both the design and manufacture of microelectromechanical systems.
2003-09-29 TAEC expands FCRAM II family
Expanding its portfolio of DRAM technology, Toshiba America Electronic Components has released what it claims is the industry's first x36 FCRAM II.
2007-05-07 Tactile switches offer square stem
BI Technologies has expanded its line of tactile switches to include a new series of devices with a square stem, and added three additional styles to the sealed product offering.
2015-10-06 Tackling power concerns in the digital age
A shared responsibility among various parties and a united approach are requisites in order to minimise problems and ensure smooth, consistent power quality.
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
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