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2005-03-16 Vertical integration dij` vu in Japan
Japanese electronics giants never dismantled their vast empires completely; they may have moved them out of Japan to lower-cost areas, but they still control majority of operations.
2015-01-09 CEA-Leti describes true 3D monolithic integration
According to the research institute, the CoolCube technology no longer relies on tall through silicon vias (TSVs) and coarse redistribution layers typically used for wafer-on-wafer die stacking.
2003-01-02 Wireless ICs call on integration
Makers of ICs for Bluetooth and 802.11, or Wi-Fi, WLAN connectivity are readying a new generation of chips for volume delivery in Q1 of 2003.
2013-06-13 SemiLEDs rolls out vertical 10W, 0.17-0.50W UV-LEDs
SemiLEDs' 10W high-power N9 series and 0.17 to 0.50W mid-power P50N series use the company's patented vertical LED structure for directional industrial applications, such as printing, and curing
2011-10-19 Recent developments in 3D integration
Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed.
2013-06-07 Maxim CEO talks analogue, strategic integration
Maxim Integrated's Tunc Doluca discusses his new 90nm analogue process, his integration strategy, Intel, Samsung and China
2007-07-09 Logic module simplifies system integration
Advanced Knowledge Associates has designed a new logic module that can facilitate accelerated advanced embedded system design.
2005-03-10 CMOS process offers high integration
Jazz Semiconductor announced the availability of a 17GHz vertical PNP (VPNP) module on its 0.18?m RFCMOS platform
2014-10-08 Smart DIY: Why do companies design their own sensors?
There are many reasons why several big companies brew their own sensors and sensor hubs. For some, especially in Asia, it's about vertical integration, while others want to add products to their catalogue.
2015-03-11 Power electronics companies take diverse roads to success
The power electronics market is changing. Chinese companies' vertical integration is challenging diverse historical market leaders, while Europe and U.S. companies are pushing horizontal integration.
2008-09-01 3D-TSVs spark packaging revolution
Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. 3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model
2004-01-01 3D SoCs perform for future
3D integration allows individual functional blocks of an SoC to be built in the process technology that optimizes individual cost and performance
2003-08-29 Wind River offers new board support service
Wind River Systems Inc. has launched a new embedded marketing strategy, unveiling a services program designed to help OEM engineers integrate the company's embedded software into their product platforms.
2007-07-09 Verification tool for ARM-based wireless systems debuts
Mentor Graphics Corp. today extends support of iSolve emulation-based IP products for ARM processors to enable the high-speed verification of wireless and multimedia applications and reduce time to market.
2005-01-07 VCSEL sub-assembly achieves 2.5Gbps data rate
Optek Technology has developed an 850nm VCSEL packaged in an FC style receptacle capable of data transmission rates up to 2.5Gbps.
2011-05-23 Four transactors expand verification family
EVE introduces four vertical solutions, further expanding its ZeBu hardware-assisted verification family into computer/peripherals, embedded processors, networking and video markets
2006-03-01 Converters heed call of 'real world'
Intimacy with the real world has radically changed the focus of IC development among analog manufacturers.
2004-05-07 BinOptics laser combines edge-emitting laser reliability, VCSEL benefits
The new class of surface-emitting lasers from BinOptics combines the power and reliability of an edge-emitting laser with the low cost and ease of packaging of a VCSEL.
2004-03-24 Arrayed Fiberoptics launches revolutionary platform
Arrayed Fiberoptics has unveiled its patented technology platform that claims to revolutionize the fiber-optic components industry.
2010-04-26 Additional IBIS5A-1300 camera recommendations
After extensive evaluation, we found a relation between the position of the Y-read out pointer after read out and vertical column non-uniformities in the next frame visible at higher gain settings
2009-12-14 TSMC buys stake in solar cell provider
Motech pursues a vertical integration strategy and has in-house ingot and wafer capabilities in Taiwan and China fabs.
2007-03-09 Taiwan company to set up PCB plant in China
Sinbon Electronics Co. Ltd, Taiwanese provider of electronic component integration design and manufacturing, announced plans to invest $2 million in the construction of a PCB plant in mainland China
2009-07-16 Soitec, IBM pioneer 22nm for 3D ICs
Soitec Group and IBM Corp. have teamed up to pioneer 22nm node silicon wafer substrate and bonding techniques that will enable wafer-level, 3D integration technology for next-generation ICs
2010-08-10 Ramp-up in blue LEDs seen
Vertical integration among leading suppliers and growth in related equipments and semiconductors are pushing up production forecasts for blue LEDs in the coming months, reports analysts.
2013-08-02 Micron zones in on Asia with Elpida buyout
New Micron group will centralise main production in Asia through vertical integration to organise duties in its various divisions more effectively.
2008-05-06 Leading IMI to a billion by 2011
Arthur Tan, president and CEO of IMI, talks to EE Times-Asia about the company's vertical integration and other strategies to reach its goal of becoming a $1-billion company by 2011.
2005-01-04 Japanese companies look to integrate, not outsource
Outsourcing and fabless foundry business strategies are common in the semiconductor industry, but Rohm, Sony and Renesas are seeking more integration
2005-04-18 'Synergy' plan in play at Sony
Sony's recent executive shuffle has raised questions about the company's synergy and vertical integration.
2010-04-14 Waveform generator boasts high resolution at 4.2GSps
The Agilent 81180A AWG pushes the waveform envelope further into generator territory, with a sample clock ranging from 10MSps to 4.2GSps and with up to 12bit vertical resolution
2014-03-17 Silicon photonics evolve into 1.3m quantum dot lasers
The quantum dot lasers developed by UCSB researchers are expected to facilitate the integration of low-cost, multi-channel laser devices with CMOS driver circuits
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