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2013-04-22 Android framework for energy efficient multi-core systems
The Android Multimedia Framework from CEVA claims to reduce the power consumption required for complex multimedia processing using a heterogeneous CPU and DSP system architecture.
2014-01-13 Android code, improved architecture push DSP capabilities
CEVA's TeakLite 4 DSP processor core claims to offer reduced power consumption by 20 percent and code size by 30 percent alongside an Android framework to offload performance from the CPU.
2011-11-03 ANC ICs aimed for wired/wireless headsets
austriamicrosystems' ICs tout 20 percent longer battery life and 10dB positive SNR.
2004-12-03 Analyzer checks 3G cellular video
Radcom's new software will now let users monitor and troubleshoot cellular video service in realtime.
2007-06-27 Analog ICs aid low-power handset designs
A cluster of new, analog-centric, components from National Semiconductor can help handheld designers implement the low-power tactics essential to longer operating times.
2005-12-16 Anadigics targets MIMO apps with new product offerings
Anadigics unveiled two new front-end products for wireless LAN mobile and multiple input multiple output applications.
2009-06-18 Alliance pushes HD spec for surveillance apps
A group of chip and systems companies have launched a new standard for high-definition (HD) surveillance systems.
2005-09-02 Akustica, SigmaTel team on microphones for PCs
Akustica Inc., a start-up developing acoustic components in silicon using MEMS manufacturing processes, has said it is collaborating with mixed-signal semiconductor supplier SigmaTel Inc. to promote a microphone array to computer manufacturers.
2007-05-17 Akustica HD digital mics to go on show
Akustica Inc. will introduce next month a new family of CMOS MEMS microphones for high-definition applications such as VoIP.
2004-11-12 AKM converter targets portable data terminals
AKM introduced a 16bit mono A/D and stereo D/A converter with built-in Bluetooth-Interface mono CODEC for next-gen smart portable data terminals and PDAs.
2006-12-05 Advanced HD video platform runs on TI processors
Polycom has announced that it used multiple, high-performance digital media processors from Texas Instruments to deliver the Polycom HDX 9000 platform, which promises broad flexibility and high performance to support video collaboration applications.
2006-12-05 ADI revs TD-SCDMA chipset to full 3G speeds
Analog Devices Inc. is updating its 2yr-old chipset for China's 3G standard, boosting the processing power to handle more multimedia features and revving up the data connection to full-on 3G speeds.
2008-01-21 Address power management issues in mobiles
Increasing focus towards system aspects of cellphones forces designers to take a holistic and dynamic approach to power management to effectively decrease power consumption without degrading performance.
2007-04-02 Adding mobile TV to handsets
The future of mobile TV is bright, and tuner and demodulator manufacturers with broadband experience are carefully developing the devices to ensure its success.
2012-06-25 Active noise sol'n integrates speaker driver ICs
The AS3421 and AS3422 single-chip active noise cancellation devices are designed for Bluetooth-enabled headsets, headphones and earpieces.
2014-01-14 Accelerate M2M networking with UDP
Learn how user datagram protocol provides the simplest form of data transfer between network members.
2008-04-17 ABI: Bluetooth gadget shipments up for growth in Asia
A new study from ABI Research entitled 'Bluetooth: Opportunities in Asia' indicates that Bluetooth-enabled equipment shipments in Asia will reach 982 million units in 2013, representing a CAGR of 39 percent over 2006 shipments.
2007-05-01 65nm Edge, Hedge chips launched
Broadcom Corp. has parlayed its 65nm foundry access into single-chip transceivers for Edge and HSDPA+Edge (Hedge) standards.
2008-06-12 65nm Bluetooth 2.1 chip touts up to 40% power savings
Broadcom's next-generation Bluetooth Version 2.1 + EDR single-chip solution promises significant performance upgrades and enhanced features, including lower power consumption, smaller chip size and improved radio performance.
2005-02-01 3G integration not a linear progression
The road map toward 3G integration has been set; the tough ride to progress begins.
2005-06-15 3Com to use TI's VoIP technology in IP phones
3Com Corp. has selected Texas Instruments' TNETV1050 Internet Protocol (IP) phone system-on-a-chip for its next-generation enterprise IP phones, extending a long relationship between the two companies.
2010-06-17 32bit MCU packs touch controller peripherals
Atmel Corp. has released the 32bit AVR UC3L microcontroller with picoPower technology and embedded capacitive touch controller peripherals.
2007-06-15 'Digital self' reaches out from the digital home
Today's digital home is giving way to a new 'digital self' who is all about enriching what's in the home and bringing it into the outside world.
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