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2002-07-18 RVSI ball placement system targets grid array packages
Robotic Vision Systems Inc.'s SP-6800 high-volume ball placement system that is designed to address the high throughput requirements of grid array package manufacturing.
2014-03-24 RS Components rolls PCB Quote service in APAC
RS teams up with Huaqiang and P-Ban to offer design engineers in Asia with access to quick turnaround PCB manufacturing in prototype-volume, reducing the concept-to-prototype cycle.
2014-05-13 RoHS, WEEE initiatives cultivate e-waste recycling market
The thriving activity in e-waste recycling is prompting a ripple effect across the supply chaincost fluctuations, increasing volume of e-waste, and the need for environmentally-sound recycling processes.
2004-12-06 RFMD transceivers, PA modules lower handset devices' BoM costs
RFMD announced volume production shipments of its POLARIS Total Radio GSM/GPRS transceivers and PowerStar PA modules for use in Motorola's MPx220 handset.
2004-11-11 RFMD supplies POLARIS transceivers to AT&T Wireless
RF Micro Devices Inc. (RFMD) is shipping volume quantities of its POLARIS TOTAL RADIO solution for use in the recently announced Ogo wireless device from AT&T Wireless.
2004-03-24 RFMD PA module provides -51dBc linearity
RF Micro Devices has announced that it has begun high volume production shipments of its RF3163 CDMA PA module to a CDMA handset OEM headquartered in Korea.
2008-04-18 RFMD moves all production testing to China
RFMD has announced it will consolidate its production test facilities for high volume cellular products to reduce cycle time, better serve its customer base and improve overall profitability.
2004-10-22 RFMD delivers transceivers, PAs to Motorola
RF Micro Devices Inc. (RFMD) has announced volume production shipments of POLARIS TOTAL RADIO GSM/GPRS transceivers and PowerStar power amplifier (PA) modules for use in the Motorola MPx220 handset.
2007-11-26 RF MEMS switch market to balloon in five years
Market researcher WTC sees the market for RF MEMS switches explode: While in 2006, the total market volume amounted to $5 million globally, the volume will grow to $210 million within only five years.
2007-03-29 Real-time clock module enables effective DRM
Epson Toyocom has announced plans to launch volume production of a new, ultracompact real-time clock module with a built-in ID-ROM for effective digital rights management (DRM).
2001-05-25 Quality and reliability
This application note describes the methodology used by IBM to achieve robust ASIC designs before market introduction, and to ensure high quality and reliability during volume production.
2007-04-19 Qimonda, Advantest team on GDDR5 testing
Qimonda AG is joining forces with Advantest to deliver a cost-efficient high volume test solution for GDDR5 graphics DRAM devices.
2008-08-28 Qimonda extends XDR DRAM to PlayStation 3
Qimonda has started shipping XDR DRAM in volume production for the PlayStation3 computer entertainment system.
2008-05-06 Printer subassembly designed for kiosk apps
FCA has expanded its line of thermal printers for kiosk applications with the addition of a 2-inch printer subassembly for medium-volume print output.
2011-10-11 Price challenges hinder TSV adoption
In order for chip stacks using high density through-silicon vias (TSVs) to be used in high volume devices, major price adjustments should be done.
2008-03-13 Portable audio test tools debut
NTI has stepped up volume production for its flagship Minirator MR-PRO and latest version MR2 portable signal generators.
2008-09-08 Polycrystalline supply to push thin film solar growth
During the time through 2015, the global solar cell market will exhibit a breathtaking growthfrom a market volume of 5.6 GW in 2008 to 79.5 GW in 2015.
2008-07-15 POLARIS solution powers multimedia handsets
RF Micro Devices Inc. has commenced volume shipments of its POLARIS RF solutions in support of six new feature-rich multimedia handsets that expected to be available in 2H 08.
2003-03-04 Philips standardizes on Synopsys platform
Philips Semiconductors has signed a multi-year volume purchase agreement with Synopsys Inc. for its front-end design platform which will serve as a design standard at Philips' semiconductor division.
2003-09-26 Philips MCUs offered in 8-, 14-pin packages
Royal Philips Electronics has introduced two families of 8-bit microcontrollers that are designed for cost-conscious, high volume embedded apps.
2015-07-08 Peregrine, GlobalFoundries unveil RF SOI 300mm platform
The UltraCMOS 11 uses a custom fabrication flow from GlobalFoundries' Fab 7 facility, and will be the foundation for Peregrine's high volume mobile products and SOI products for other applications.
2005-07-28 PCIe PHY IC from Genesys Logic delivers 2.5Gbps access time
Genesys Logic is offering in volume production its PCI Express GigaCourier GL9711 physical layer (PHY) IC for $5 each in quantities of 25,000.
2008-06-16 PCIe packet switches enable low-cost solutions
Pericom announced the industry's first PCIe packet switch product family designed for power, size and value-sensitive applications, such as volume motherboard, wireless access points, docking stations, SOHO printers, DTV, video surveillance, graphics and mobile applications.
2015-01-16 Patent applications to focus on quality, not quantity
Amid the rising volume of patent applications the US PTO continually receives by the buckets, a shift toward few good patents and not in terms of volume is predicted, according an anonymous IP expert.
2005-04-20 PA boosts WLAN signals
Atmel announced the availability of its new ATR7032 PA for the fast-growing high-volume WLAN market. The 2.4GHz PA meets the 802.11b/g standard and is manufactured using SiGe technology.
2012-02-21 P-cap tech opens new possibilities for ITO touch sensing
Zytronic has been able to develop a sensor series that combines the benefits of enhanced optics and volume manufacturing from ITO processing with a p-cap technology.
2011-01-21 Oxford PV creates printable, low-cost solar cell
Oxford Photovoltaics’s solid-state dye-sensitized solar cells can be manufactured at low-cost and scaled to any volume. Replacing the liquid electrolyte with a solid organic semiconductor, the new technology enables entire solar modules to be screen printed onto glass or other surfaces.
2000-05-03 Optimizing silicon for SDH applications
Recent advances in personal computing and mobile telephone technology have resulted in high performance semiconductor processes increasing in production volume and decreasing in price. This paper explains how to choose from the processes on offer to best serve the requirements when developing circuits for the fiber-optic communications marketplace.
2002-12-10 Optical components to see growth in 2003
The optical components market is seen to experience growth again in 2003, with a 30 percent year-over-year increase in dollar volume, said Strategies Unlimited.
2013-11-29 OLED inkjet printer promises dramatic yield boosts
Kateeva claims Yieldjet significantly lowers costs by boosting yields in the high-volume manufacture of flexible and large-sized OLEDs.
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