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2006-11-17 Tundra offers tiny 32bit, 66MHz PCI-to-PCI bridge
Tundra Semiconductor Corp. is planning to sample in March a small form-factor 32bit 66MHz synchronous PCI-to-PCI bridge that costs less than $6 each in volume.
2004-11-17 TSMC's 65nm process set to arrive late 2005, cost $1 billion
By the time Taiwan Semiconductor Mfg Co. Ltd (TSMC) ramps its first 65nm manufacturing process technology into volume production, late in 2005, it will have cost about $1 billion to develop, according to company chairman Morris Chang.
2010-01-28 TSMC completes Fab 12, Phase 5 construction
TSMC held a topping ceremony for its Fab 12, Phase 5 building located in the Hsinchu Science Park and announced that volume production is expected to begin in Q3 10.
2002-03-11 Tru-Si, OSE-USA codevelop high-yield stacked die chips
Tru-Si Technologies Inc. has formed a joint development agreement with IC package provider OSE-USA to create an ultra-thin microchip die that can be stacked and interconnected with up to four die per package for volume manufacturing.
2010-06-01 Transimpedance amps handle 10/40/100G apps
GigOptix Inc. has begun high volume production of its portfolio of transimpendance amplifiers addressing 10G, 40G and 100G applications.
2003-04-29 Tower secures order from Alliance Semiconductor
Tower Semiconductor Ltd has received its first volume production order for its new Fab 2 manufacturing facility.
2007-10-23 Tower fabs image sensors for Taiwan CCTV firm
Tower Semiconductor has begun volume production of CMOS image sensor products for Vision Integration Technology (ViTi), a maker of home security products such as CCTV.
2005-06-02 Toshiba, Canon prep SED production
Toshiba Corp. will use a former CRT factory for volume production of surface-conduction electron-emitter (SED) displays beginning in January 2007
2014-02-04 Toshiba touts photorelays in industry's smallest package
Compared to equivalent Toshiba products in a USOP package, the TLP3403 and TLP3412 photorelays reduce the assembly area by half and volume by 60 percent.
2004-10-26 Toshiba to use Rambus DDR2 interface
Toshiba Corp. has selected Rambus Inc. DDR interface cells for next-generation high-volume consumer applications.
2003-08-29 Toshiba to use Applied Materials low-k films
Toshiba has selected Applied Materials' Black Diamond and BLOk low-k dielectric films to be used for volume production of its 90nm CMOS4 process.
2007-07-09 Tool speeds up development of non-volatile FPGAs
Xilinx Inc. unveils its low-cost Spartan-3AN Starter Kit, ideal for prototyping high-volume non-volatile applications where higher system integration or security is critical.
2007-07-09 Tiny, low-voltage varistor fits portable CE devices
TDK has begun volume production of a varistor with reduced voltage perfect for mobile electronic devices.
2006-09-25 TI, ADEL co-develop fingerprint ID processor
Shenzhen IDEAL Microelectronics Co. Ltd and Texas Instruments Inc. announced that they have jointly developed fingerprint identification processor ramped to volume production.
2004-12-29 TI DSPs offer substantial price/performance ratio
TI announced full volume production of its two high performance digital signal processors (DSP)the TMS320C6410 and TMS320C6413.
2008-09-11 TI brings 32bit real-time control to cost-sensitive apps
Helping bring processor intensive, real-time control to cost-sensitive applications, Texas Instruments Inc. announced a new series of 32bit TMS320F2802x/F2803x MCUs starting at less than $2 in volume.
2004-11-11 TI begins producing DSPs using 90nm technology
Texas Instruments has begun volume production on 1GHz digital signal processors using 90nm process technology.
2004-11-10 TI begins producing DSPs using 90nm technology
After months of telling the industry of its ambitious plans, Texas Instruments Inc. has begun volume production on 1GHz digital signal processors (DSPs) using 90nm process technology
2001-10-01 Thin-film process enables low-cost MCPs
This technical article describes a low-cost multi-chip packaging (MCP) technique with appropriate expansion that triples volume capacities.
2003-11-07 Texas video decoders target personal video apps
Texas Instruments Inc. has introduced two mixed signal video decoders that convert NTSC, PAL and SECAM video into digital component video in both portable and high volume in applications.
2015-02-13 Test equipment effectively manages power dissipation
Multitest said the add-on to the standard MT2168 can be mounted and demounted effortlessly and is geared for test development and high volume production.
2002-10-03 Teseda ships DFT validation system for IC testing
Teseda Corp.'s DFT-focused validation system allows engineers to rapidly validate test for prototype ICs and cut time-to-volume production.
2006-08-15 Telecom equipment makers favor FPGAs over ASICs, survey finds
Telecom equipment manufacturers are relying more on FPGAs than on ASICs for low- to medium-volume production of telecom systems according to a survey by Light Reading's Components Insider.
2003-05-21 Tek oscilloscopes to be used in China's universities
Tektronix Inc. has received a high-volume order of oscilloscopes and options from China's Ministry of Education.
2003-10-27 Taiwan's TFT-LCD panel industry shows strength in Q3
Taiwan's large size TFT-LCD panel shipment volume and value both saw strong gains in the third quarter of 2003, says the Market Intelligence Center.
2006-11-10 Taiwan's Mosel preps solar cell, RFID biz
Mosel Vitelic has shown progress in its solar cell and RFID business, with solar cell production equipment to be prepped up early next year, and RFID volume production to begin in the Q1 of 2007.
2002-07-31 Taiwan LCD sector to reach 12.2 million units, says MIC
The LCD panel industry in Taiwan is anticipated to reach 12.2 million in production volume by Q2 of 2002, according to the latest report from Market Intelligence Center.
2004-09-23 Taiwan LCD driver IC shipment to grow 10 percent
LCD driver IC makers in Taiwan, including Himax Technology Co. Ltd and Winbond Electronics Corp., are planning on increasing their volume shipment next quarter by about 5 to 10 percent.
2005-03-11 Synopsys unveils next-gen DFT synthesis solution
Synopsys announced DFT Compiler MAX, its next-gen DFT synthesis solution, offering 1-pass test data volume compression capabilities to address design and test challenges occurring in 130nm and smaller process technologies.
2004-08-13 SVA-NEC begins TFT-LCD production
Shanghai SVA-NEC Liquid Crystal Display Co. Ltd is set to kick off production of 5G TFT-LCD panels next month and plans on beginning volume production in October.
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