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2005-06-03 W.L.Gore offers digital cable assemblies for high-speed backpanels
W.L. Gore and FCI announced that they have combined their technologies to offer the next generation of high data rate digital interconnect solutions
2002-03-11 W. L. Gore joins SNAP12 MSA
W. L. Gore & Associates Inc. has joined charter members EMCORE Corp. and Picolight Inc. in the SNAP12 MSA for the manufacture and supply of connectorized 12-channel parallel optical modules operating at up to 2.7Gbps per channel.
2002-01-30 Velio, Gore codevelop electrical backplane extensions
Velio Communications Inc. has partnered with cable assemblies supplier W.L. Gore & Associates Inc. to develop electrical backplane extensions for 2.5Gbps traffic that exceeds 20m.
2005-05-12 Teradyne, Gore to develop GbX cable assemblies
Teradyne Inc.'s connection systems division has signed a licensing agreement with W. L. Gore & Associates Inc. to develop and manufacture high-speed cable assembly solutions for Teradyne's GbX interconnect platform.
2003-02-04 OCP acquires Gore optical module assets
Optical Communication Products Inc. has acquired the parallel optical module assets and IP of Gore Photonics
2003-07-31 Gore rolls trackless cable assemblies
W. L. Gore & Associates has introduced its self-supported Trackless Cable Assemblies that reduce vibration and weight associated with most cable tracks.
2006-06-16 Gore Phaseflex test assemblies operate at 100GHz
W. L. Gore & Associates announced the release of new Gore Phaseflex test assemblies with performance through 110GHz.
2006-11-02 Gore intros silicone-free thermal interface material
Gore's new Polarchip SF3000 silicone-free thermal interface material is a soft thermal gap pad suited for filling the undesirable air gaps between heat generating devices on PCBs and the heat sinks, heat spreaders and metal chassis that are used to dissipate the heat
2006-12-28 Gore intros high-flex FireWire cable assemblies
Gore's FireWire High Flex Round and Flat Cable Assemblies provide motion control and vision systems with reliable flex life performance
2002-07-29 Gore introduces latest electrode assemblies
The Battery and Capacitor Technologies Group of W. L. Gore & Associates Inc. has introduced its next-generation electrode assemblies and separators for electrochemical double-layer capacitors.
2004-12-13 Gore expands electronics product operation to China
W. L. Gore & Associates Inc. has expanded their electronic products operation into their 80,000 square foot facility in Shenzhen, China.
2004-01-28 Gore cable assembly suits ZD backplane interface
W. L. Gore & Associates Inc. (GORE) has developed a cable assembly for the ZD backplane interface.
2003-08-08 DEK, Gore introduce EMI shielding solution
DEK Printing Machines and W. L. Gore & Associates have combined their technologies to deliver a lightweight removable EMI board-level shield for wireless comms devices.
2004-12-06 Interconnect system provides high density for high-speed signals
W. L. Gore & Associates introduced its new cable-to-board and cable-to-cable coaxial interconnect system.
2006-11-28 Cable assemblies triple DDR InfiniBand reach
W. L. Gore & Associates has introduced an innovation in high data rate cable assemblies that promises to more than triple the reach of DDR InfiniBand cables as well as reduce their size and weight for enhanced flexibility and ease of routing.
2011-06-15 Rugged assembly reduces RF test apps cost
Gore has added a rugged 18GHZ cable assembly to its PHASEFLEX Microwave/RF Test Assemblies line cutting the cost of high throughput production test applications in the wireless infrastructure market
2008-02-08 Active copper cables operate at 10Gbit/s over 10m
Gore's next-generation extended reach cable assemblies operate at 10Gbit/s per channel over a 10m span of AWG 28 copper cable
2007-10-10 XLoom weaves optics solution for Infiniband
XLoom Communications has rolled out a new optical module to migrate CX4 copper interconnects to 100m over standard optical fiber for a broad range of data center systems.
2007-10-03 Low-loss material, chip combine for better cables
Data center systems will benefit from cables which use a new low-loss dielectric material and a signal conditioning chip to reduce power requirement and interconnect latency.
2002-02-28 FCI board-to-board connector system rolls
FCI Electronics has expanded its BGA, high-speed MEG-Array board-to-board connector system to include an 81-position version.
2007-09-17 Connectors cope with medical apps' requirements
Despite the lack of standardized testing today for electronic components used in medical products, manufacturers are delivering connectors that meet the most demanding requirements of the medical industry.
2007-08-30 Connectors boost medical systems
As medical OEMs increasingly rely on electronics to deliver higher functionality, they also expect the connectors and cable assemblies to meet the harsher operating conditions and higher reliability requirements demanded in medical applications.
2007-11-16 Active cables extend reach, speed of data centers
As interconnect density continues to rise in high-performance computing and data centers, designers are grappling with the ensuing issues that passive cable products are inherently unable to solve.
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