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2002-09-02 TSMC signs letter of intent for China fab
TSMC has confirmed that it has signed a letter of intent with an unnamed Chinese company to build a wafer fab in the Songjiang district of Shanghai
2005-07-28 TSMC sees recovery amid strong Q2
Taiwan Semiconductor Mfg Co. Ltd (TSMC) projects a recovery in the lackluster foundry business in the second half of 2005, amid a jump in its own sales, profits and fab utilization rates for the second quarter.
2004-05-24 TSMC said to be seeking fab alliance with Macronix
Pinched for capacity, foundry giant Taiwan Semiconductor Mfg Co. is reportedly striking an alliance with memory maker Macronix International, which runs an 8-inch wafer fab and is mulling a 12-inch wafer line
2001-05-16 TSMC makes deeper cut in capital spending
This news article describes how TSMC is cutting down on capital costs to accommodate its other fab operations.
2006-09-14 Trade group inches China capex downward again
The Semiconductor Equipment and Materials International expects sales of semiconductor equipment in China to total $6.6 billion from 2006 through 2008. The estimate is slightly lower than its estimate from several months ago.
2011-12-01 Toshiba to shutdown three fabs
Toshiba is closing three manufacturing facilities and cutting down production at some of its semiconductor fabs due to a fall down in consumer product demands.
2005-08-24 Toshiba mulls 300mm expansion plan
Japan's Toshiba Corp. is considering a plan to spend around $4.2 billion to expand its 300mm wafer production by 150 percent in the 2008 time frame, according to reports
2010-04-29 TI to double 300mm analog fab capacity
Texas Instruments Inc. plans to double the manufacturing capacity in its 300mm analog fab in Richardson, bringing its revenue capability to about $2 billion.
2005-01-12 Taiwan foundries to cut chip production this quarter
The number of chips rolling out of Taiwan's foundries will continue to decline this quarter, as the demand picture turns cloudy and fables customers try to eat through excess inventory
2006-06-19 Sumco acquires majority stake of Komatsu
Sumitomo Mitsubishi Silicon would take a 51 percent stake in silicon wafer maker rival Komatsu Electronic Metals
2012-02-03 STATS ChipPAC closes Thai plant
Damages to the facility was so extensive that economic restoration is no longer possible.
2009-05-19 ST, Soitec co-develop BSI tech for CMOS image sensors
STMicroelectronics and Soitec have entered an exclusive joint cooperation to develop of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products
2012-10-29 ST's wireless slump continues, losses piling on
The net loss of $478 million came on revenue of $2.17 billion, down 11 per cent from last year's third quarter. Revenue was up slightly from Q2's $2.15 billion.
2008-05-30 ST's fab targets volume ramp production
STMicroelectronics NV earmarked $500 million in capital expenditure to take its Crolles2 wafer fab manufacturing target of around 5,000 wafers per week to meet its full-building capacity
2005-10-14 ST plans chip manufacturing in India, says report
European chipmaker STMicrolectronics is planning a "fully-fledged" chip manufacturing facility in Greater Noida near New Delhi and has put down about $35 million to acquire a 25-acre plot of land to house the facility, according to a report on Wednesday (Oct. 12) in The Economic Times from New Delhi.
2005-05-30 Spansion mulls on ordering ORNAND flash from UMC, Chartered
Spansion LLC, the joint venture of Advanced Micro Devices Inc. (AMD) and Fujitsu Ltd, is expected to order ORNAND flash memory from Chartered Semiconductor Mfg Ltd and United Microelectronics Corp. (UMC).
2012-06-27 Sony pours $1B in image sensing mfg
Sony will invest $1 billion (?80 billion) to increase stacked CMOS image sensor production in its Nagasaki Technology Center.
2010-08-27 Solar slicing shop increases capacity
First Philec Solar Corp. announces that by September 2010 it will have 87 wiresaws slicing about 220 million wafers a year, or about 540MW.
2012-01-18 Solar market stays positive after dismal year
Taiwan solar manufacturers posted negative growth for 2011 due to weak demand and limited demand boost from rush order transfers from China
2010-08-20 Solar cell spot price to grow 2.87% in Q3 2010
Spot market price of solar cell wafers continues to rise with strong demand, and it is estimated to reach $1.43 per watt in Q3 2010
2015-02-04 Singapore, India beef up semicon industry collaborations
SSIA and IESA signed a memorandum of agreement that would establish and develop trade and technical cooperation links between the electronics and semiconductor industry of Singapore and India.
2011-03-11 Singapore takes R&D initiatives to green its electronics
With increased awareness of climate change issues, green electronics will be the underlying theme for both manufacturers and consumers. Singapore is addressing these issues through R&D initiatives.
2002-05-31 Singapore fabs serve as EE training ground
Chen Shu Bian, an electrical engineering graduate from China's Chengchi University, is a senior equipment engineer in the Silicon-On-System Mfg Co. wafer fabrication facility in Singapore
2002-08-01 Singapore fabs serve as EE training ground
This news article shows the movement of Engineers to and from Singapore to find better job opportunities and advanced training.
2016-03-17 SiC ready: X-Fab offers 6in SiC from Texas foundry
X-Fab has upgraded the manufacturing process at its wafer fab in Lubbock, Texas, in order to start supplying 6in SiC wafers
2008-09-04 SIA: 300mm wafers rule IC manufacturing in July
300mm wafers for the first time account for the largest share of wafer manufacturing capacity and actual wafers processed, with 44 percent of total capacity and 47 percent of total silicon processed, according to the Semiconductor Industry Association
2006-09-27 Shin-Etsu to increase capacity to 1 million wafers/month
Shin-Etsu Chemical announced its plan to expand its monthly production of 300mm silicon wafers to 1 million by Q4 2007 to meet rapidly growing market demands.
2007-04-12 Service kicks off at Fujitsu's new 300mm fab
Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July
2010-05-27 Semico: Shift to 450mm is inevitable
The probability that the semiconductor industry will shift to 450mm silicon wafers in manufacturing has increased significantly, however, the chance of achieving volume production by the original target date of 2012 is remote.
2002-04-08 SDK yields large-diameter InP monocrystal mirror wafers
Showa Denko K.K. has developed a six-inch InP semi-insulating monocrystal mirror wafers at its Chichibu plant in Saitama, Japan.
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