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2007-08-09 SanDisk, Hynix partner on 300mm fab
Against the background of rising NAND demand, SanDisk and Hynix plan to build a joint fab, reported the media in Europe
2014-10-17 Samsung to build $14.7B IC fab
In order to maintain leadership in memory IC sales and support new markets, Samsung is building a new wafer fab in South Korea, estimated at $14.7 billion
2012-06-11 Samsung invests $1.9B in logic fab
A report from the Reuters news agency says that Samsung will build a new wafer fab to run run 20nm and 14nm processes on 300mm diameter wafers to make logic chips for smartphones and tablets
2007-04-25 Samsung develops 'first' all-DRAM stacked package using TSV tech
Samsung claims to develop the 'first' all-DRAM stacked memory package using 'through silicon via' technology, which will result in memory packages that are faster, smaller and consume less power.
2006-01-18 Sales, profits climb at Shin-Etsu, says report
Japanese chemical giant Shin-Etsu Chemical Co. Ltd posted a net profit of $250 million in the October-December quarter on sales of about $2.44 billion, up 12.9 percent.
2008-03-05 RFMD completes Filtronic acquisition, gains GaAs fab
RFMD has completed the acquisition of Filtronic Compound Semiconductors, and has assumed ownership of the latter's 6-inch GaAs wafer fab
2007-06-06 Report: TSMC, Hynix in discussion over $1B fab purchase
Taiwan Semiconductor Co. Ltd is reportedly hammering a deal with Hynix Semiconductor Inc. that would see the foundry shell out almost $1 billion to purchase a 200mm wafer fab with a capacity of 129,000 wafers per month
2012-05-03 Report: Globalfoundries, Infineon, IBM, ST to join Indian fab plan
Several more companies have been added to the list being linked to the Indian government's plan to build one or more semiconductor wafer fabs
2004-06-29 Renesas to pursue 90-, 65nm push
In a move to keep up with current and future chip demand, Japan's Renesas Technology Corp. plans to more than double its production capacity within its 300mm wafer fab over the next year.
2011-06-14 Renesas moves target date for full supply restoration
Renesas is moving up the target date for full supply restoration of their fabs to the end of September, one month ahead of the previously announced goal.
2011-06-21 PV spot prices drops
The latest survey conducted by EnergyTrend shows that PV spot prices have reached new low at the Intersolar Europe, but the PV manufacturers take a positive attitude toward the market trend of 2H11.
2011-07-27 PV prices continue to grow
According to EnergyTrend, the current trading price for polysilicon stayed between $52/kg and $54/kg, but spot prices will continue to increase.
2012-07-13 PV market preferring price-performance ratio
The photovoltaic market is experiencing a shift from high efficiency products to products with a high price-performance ratio.
2013-03-07 PV market comeback needs policy, efficiency
There is still a long way before the industry achieves grid parity, there is still a long way to go before achieving this and thus a stable policy could still greatly affect the global PV industry.
2011-11-21 PV makers slash capacity to minimize loss
Polysilicon price continues to plummet leading the industry to aggressively clear inventory.
2013-12-04 PV makers rethink contract trading due to supply shortage
As a result of increased demand for high-efficiency products in 4Q13, contract trading, which has disappeared for a long time, may return to the wafer market, stated EnergyTrend.
2005-10-25 Powerchip plans $10 billion DRAM spend, says report
Powerchip Semiconductor Corp. is planning to build four DRAM wafer fabs over the next six years at a cost of about $10 billion, according to a report, which cited Powerchip vice president Eric Tang, as its source
2002-05-16 Powerchip opens 300mm DRAM fab
Amid sinking prices in the DRAM market, Powerchip Semiconductor Corp. flipped the switch on its first 300mm wafer fabrication facility on May 14
2006-12-18 Polysilicon shortage could persist
The polysilicon shortage that has plagued the solar-cell industry for two years is worse than once thought, may persist through the end of the decade, and could affect the silicon wafer industry starting next year, analysts warn
2002-11-12 Philips announces plans for Albuquerque facility shutdown
Royal Philips Electronics has announced its plans for the phased closure of its semiconductor fabrication operation in Albuquerque, New Mexico at the end of 2003.
2006-08-16 Performing yield management
Enterprise yield management systems improve access to data by continuously monitoring the global supply chain, automatically gathering information into a centralized repository and making analyzed data accessible throughout the enerprise.
2012-03-12 Panasonic opens Malaysian solar plant
The base will manufacture solar wafers, cells and modules with an estimated annual production capacity of 300MW.
2010-06-08 ON Semi dips $11M in Idaho fab expansion
ON Semiconductor plans to add $11 million in production equipment to its eight-inch Pocatello, Idaho, wafer manufacturing facility
2010-11-15 NXP increases capacity
Rick Clemmer, CEO, NXP, reported that the many capacity constraints hindering the company have been lifted and that the company would increase capacity in 2011.
2008-04-25 Novellus exec sees the silver lining
Undaunted by reported downturns in the chip industry, Andrew Goh, president of Novellus' operations in Southeast Asia, remains optimistic about the growth prospects of the semiconductor industry.
2010-03-16 New National CEO turns focus on revenue growth
Don Macleod has risen through the ranks of National Semiconductor Corp. to take on the CEO post late last November and has become the man with a missiongrowth in revenue.
2006-07-24 New fab in Taiwan not yet final, Elpida says
Elpida said it has not finalized the location of a new wafer fab after a newspaper reported that the new fab would be in Taiwan
2004-04-12 NEC Electronics plans second 300mm fab
Rapidly growing demand for digital consumer products has prompted NEC Electronics Corp. to launch construction of its second 300mm fab that will have a maximum capacity of 10,000 wafers a month
2005-05-31 NEC doubles plan at 300mm fab launch
NEC Electronics Corp. has officially celebrated the launch of its 300mm wafer fab at Yamagata and has started to ramp its manufacturing capacity towards 20,000 wafers a month
2003-01-17 Motorola pare plants, seeks 300mm partner
In 2000, Motorola Inc.'s Semiconductor Products Sector had 27 front-end and back-end manufacturing sites. By the middle of this year, the company will have reduced that number to 10.
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