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2012-10-04 Globalfoundries partners up with timing product specialist
Sand 9's micro-electromechanical systems (MEMS) timing devices provide an alternative with performance and quality improvements over legacy quartz crystal solutions.
2010-05-12 GlobalFoundries looks into more expansions
GlobalFoundries Inc. appears to be getting ready to announce further expansion plans to help it profit from strong demand for foundry manufacturing services
2010-06-04 GlobalFoundries details $3B expansion plan
GlobalFoundries Inc. plans to expand its global semiconductor manufacturing operations with an additional spend of $3 billion over the next couple of years.
2011-04-11 Gartner: Semiconductor equipment market up nearly 150% in 2010
Gartner Inc. report shows strong growth in sales of semiconductor equipment after global slump
2002-07-23 GaAs substrates market down in 2001
The merchant market for semi-insulating GaAs substrates has experienced a 40 percent decline in 2001, according to a report from Strategy Analytics.
2009-02-03 Fujitsu streamlines fab operations
Fujitsu has consolidated its fabs amid losses in its chip unit, combining three its six-inch wafer facilities, into one line and four eight-inch wafer lines into three
2004-03-24 Fujitsu plans 300mm fab
Fujitsu Ltd confirmed that it will build a 300mm fab, with a total investment of ?160 billion yen (about $1.5 billion) and volume production reaching 13,000 wafers a month - a bit larger than expected.
2008-02-22 Frost & Sullivan: Polysilicon shortage over
Polysilicon supply for the solar cell sector should catch up with demand this year, after years of shortages, according to Frost & Sullivan
2007-10-18 Foundry service market to double by 2011, says CCID
The global wafer foundry service market will hit $40.48 billion by 2011 as it continues to grow rapidly at an annual growth rate of 12.4 percent, forecasts market analyst CCID Consulting
2009-07-17 Foundry panel: 450mm can wait
With chip companies and their suppliers fighting for their lives amidst a brutal industry downturn, the migration to 450mm wafersand the enormous R&D costs it will take to get therecan wait, according to executives from several foundries speaking at Semicon West.
2004-05-06 Foundries surge, the fabless fret
Asian foundries are running flat out to keep up with strong demand, and with orders looking good for the current quarter, small fabless companies should gird for a Darwinian struggle to lock in wafer supply.
2002-03-15 Foundries poised as Taiwan nears OK on China fab investments
After months of delays and acrimonious debate, the Taiwan government is expected to ease restrictions this month on local investment in 200mm wafer fabs in China
2004-10-14 Foundries face inventory correction, then downturn
Prospects for a long upturn in the silicon foundry business have been cut short by the sudden IC inventory correction phenomenon followed by a possible downturn in 2005.
2010-08-19 Film deposition technology for sub-32nm
Novellus Systems has announced its development of conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1, a solution to sub-32nm requirements.
2012-08-21 Falling cell prices, utilization rate push makers to terminate contracts
According to EnergyTrend, recently cell makers' utilization rates ranged between 50 percent and 70 percent, with some stronger companies' utilization rates reaching 70-80 percent.
2014-08-28 Fairchild to shut down Penang, Bucheon fab lines
The company is planning to close manufacturing and assembly sites in Malaysia as well as South Korea. The ceasing of operations of its 5-inch lines and reduction in 6-inch facilities will impact about 9,000 employees worldwide.
2003-12-16 Exec predicts China's fab growth will slow in 2006
China's booming fab construction industry will begin to level off in 2006, predicts a spokesman of China's leading pure-play semiconductor foundries SMIC.
2004-10-28 Epson begins pilot production of HTPS TFT-LCD
Seiko Epson Corp. (Epson) has commenced pilot fabrication of high-temperature polysilicon (HTPS) TFT-LCDs at its newly built plant in the Chitose Bibi in Hokkaido, Japan.
2006-02-03 Epson announces 'smallest' gate array
Seiko Epson Corp. has developed what it claims to be the world's smallest gate array.
2002-07-18 EMCORE receives patent for semiconductor separation technique
EMCORE Corp. has received a patent for its semiconductor device separation technique for GaN-based and other materials grown on sapphire substrates.
2006-07-10 Elpida to increase production at 300mm fab
Elpida plans to increase the manufacturing capacity of its 300mm wafer facility (E300 Fab) in Hiroshima Prefecture, Japan
2008-08-08 Elpida to build 300mm fab in China
After separating from its foundry partner in China, Elpida Memory Inc. plans to create a 300mm fab venture in the country. Its total capital expenditure for the new fab in China reaches $5 billion.
2008-11-03 Electronics follow curves
There are many applications in which it would be useful for electronics to conform to curvilinear surfaces or to deform with use, especially in sensing.
2011-03-15 DRAM shortage, price spike predicted
Analyst says DRAM prices set for increase as manufacturers shift production to voracious mobile DRAM market.
2005-10-07 DongbuAnam expands fab, devises 110nm process
Preparing for a new crop of customers at home and abroad, Korean silicon foundry specialist DongbuAnam Semiconductor Inc. said that it plans to expand its wafer capacity and will also develop a new 110-nm process technology
2005-04-15 Cypress, American Semi forge SOI foundry deal
Silicon-on-insulator (SOI) specialist American Semiconductor Inc. (ASI) disclosed a foundry deal with the Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp.
2011-11-11 CVBGA dummy designed for SMT mounting
Practical Components' mechanical sample of Amkor's CVBGA is a two-layer thin core substrate with Ni/Au BGA finish.
2002-11-19 Cisco to ask fabs to slash cycle times
Chipmakers need to slash their fab cycle times in half and more aggressively take on new specialty memory parts, said a senior Cisco Systems Inc. executive.
2009-03-31 Circuit stacking handles complex 3D designs
Soitec SA has announced that its circuit stacking technology is ready for technology transfer and manufacturing.
2002-04-01 ChipPAC, GSMC to deliver end-to-end products in China
ChipPAC Inc. and China-based Grace Semiconductor Mfg Corp. have entered into a non-exclusive alliance to create end-to-end products for their customers.
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