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2008-04-21 Worldwide semi equipment spending to drop 20% in '08
Gartner Inc. is forecasting a total of $47.5 billion in worldwide semiconductor capital equipment spending in 2008, reflecting a 19.8 percent decline from 2007 due to the weakening of the U.S. economy and the DRAM market
2012-12-20 Wafer fab spending to recover in 2014
Gartner projects that global spending for water fab equipment will continue to decrease next year as demand softens due to improving yields
2003-04-09 Wafer fab equipment market declines in 2002
Worldwide wafer fab equipment revenue in 2002 totaled $16.5 billion, a 31.6 percent decline from 2001's $24.1 billion revenue, reported Gartner Inc.
2006-01-10 Outlook up for ICs, equipment, says VLSI
Semiconductor revenues are expected to increase by 8.2% in 2006, while equipment for ICs and flat-panel displays should grow 6% over 2005, according to VLSI Research Inc
2007-07-13 IC equipment spending to increase this year, Gartner says
Gartner forecasts that worldwide IC equipment spending will amount to $43.1 billion in 2007, a 2.7 percent increase from 2006
2008-10-27 IC equipment markets close to 'bad cycle' of '01
Raj Seth, an analyst with Cowen and Co. LLC, said he believes the IC equipment sector is nearing a cycle as bad as 2001
2009-12-15 IC equipment market growth to climb up
Worldwide IC equipment spending will drop by 42.6 percent in 2009, but will grow 45.3 percent in 2010
2004-04-14 Global semiconductor equipment sales experienced 10% hike
The worldwide semiconductor manufacturing equipment sales totaled $22.8 billion in 2003, a 10.3 percent increase from 2002 sales, according to Gartner Inc
2013-09-23 Global IC manufacturing equipment spending to fall in 2013
Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion this year, an 8.5 per cent decline from 2012 spending of $37.8 billion, according to Gartner Inc
2011-04-11 Gartner: Semiconductor equipment market up nearly 150% in 2010
Gartner Inc. report shows strong growth in sales of semiconductor equipment after global slump
2005-10-07 Gartner: Semi equipment capex to fall 12 percent in 2005
Despite strong demand in some consumer electronics segments, global semiconductor capital equipment spending is expected to fall 11.6 percent in 2005, according to market research firm Gartner Inc
2007-10-05 Gartner: Fab tool market up in '07, down in '08
Semiconductor equipment suppliers are performing better than forecast for 2007, but will do poorly in 2008, according to Gartner
2007-04-23 Gartner trims outlook on capital equipment spending
Gartner Inc. slashed its capital equipment spending forecasts for 2007 and 2008, in the midst of a seasonal lull in the IC industry
2011-06-20 Gartner eyes 10.2% growth in semi equipment spending
Gartner raised its 2011 growth forecast for global semiconductor capital equipment spending to 10.2 percent, citing aggressive foundry spending and IDM logic capacity ramping up at the leading edge
2006-04-24 Gartner boosts '06 capital equipment forecast
Gartner raised its overall IC capital equipment forecast for 2006 to $38.8 billion, a 14.3 percent increase from 2005
2010-11-22 Fab tool outlook mixed, says Applied CEO
Mike Splinter, chairman and CEO of Applied Materials Inc., said the company has increased its sales forecast for 2010 to between $29 billion and $30 billion.
2008-01-21 Fab tool industry up for a challenging year
Fab-tool vendors at the Industry Strategy Symposium (ISS) see a mixed picture for the semiconductor equipment industry
2009-01-16 Fab tool execs brace for longer downturn
Fab tool vendor executives have warned that the current IC downturn will be long and painful, causing more consolidation in the market and stress in the supply chain
2002-07-17 Dataquest predicts rise in wafer fab equipment expenditure
Worldwide wafer fab equipment spending is showing signs of rebound.
2007-01-24 Chipmakers to curb equipment shopping spree in '07
Coming off a near-record year in 2006, the semiconductor equipment industry may be entering rougher waters in 2007, analysts said at the recent Industry Strategy Symposium
2007-10-10 Atmel sells U.K. fab to TSMC, Highbridge Business Park
Atmel Corp. has entered into separate agreements with TSMC and Highbridge Business Park for the sale of its 8-inch wafer fab equipment and related property located in the U.K.
2013-04-24 Applied Materials reclaims top spot in chip equipment market
In 2012, Applied Materials reclaimed the No. 1 spot based on its relative strength in deposition and process control, Gartner said.
2004-11-10 Wafer processing device provides quick, accurate leveling
CyberOptics announced a wireless, wafer-like device that enables quick and accurate leveling of semiconductor wafer processing and automation equipment
2005-04-05 Wafer fab, assembly facility up for sale in Thailand
The Cullen Group, a real estate and development firm, said that it has become the listing agent for a wafer fab facility and backend assembly plant in Thailand
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8
2005-09-16 U.S. consortium interested in India fab
A consortium of Indian equipment companies in the U.S. has expressed interest in putting up a wafer fab in India, with the Indian government agreeing to the proposal in principle.
2015-12-09 TSMC plans to set-up its first 12in wafer fab in China
TSMC will join a growing list of chipmakers that have rolled out 12in fab projects in China, which, according to SEMI, has one of the world's largest semiconductor markets
2016-03-30 TSMC inks deal for first 300mm wafer fab in China
The facility, to rise in the Pukou Economic Development Zone, will have a planned capacity of 20,000 12in wafers monthly and will include a design centre.
2006-08-15 Toshiba, SanDisk start construction of 300mm Yokkaichi fab
Toshiba and SanDisk recently announced that, further to definitive agreements that they entered into in July 2006, the construction of Fab 4, a 300mm wafer fab in Yokkaichi Japan, has started
2007-09-06 Toshiba, SanDisk open 300mm Yokkaichi fab
Toshiba and SanDisk have inaugurated the 300mm Fab 4 at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan
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