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2014-01-20 TSMC registers 10.9% revenue growth in Q4
The foundry firm attributed its Q4 growth to the accelerated demand for mobile devices late in the year and its improved margins, lifting its Q4 net income and diluted earnings per share by 7.7 percent
2012-05-02 TSMC pulls in 20nm, ups capex to $8.5B
TSMC said that it needed to increase capex because of stronger than expected demand for 28nm wafers and because it has decided to "pull in" the creation of a 20nm R&D process line.
2005-08-15 TSMC plans $7.5 billion superfab, says report
Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd has applied to build a next-generation 300mm wafer fab in Taichung, according to a Taipei Times report, which referenced a science park official and a TSMC spokesman as sources.
2007-05-22 TSMC makes IP but denies it is in IP business
TSMC is developing IP blocks and licensing them out, but it is not in the IP licensing business, according to Charles Byers, director of worldwide brand management and corporate marketing.
2001-05-16 TSMC makes deeper cut in capital spending
This news article describes how TSMC is cutting down on capital costs to accommodate its other fab operations.
2009-04-23 TSMC invests in R&D despite downturn
Taiwan Semiconductor Manufacturing Co. Ltd remains cautiously optimistic about the IC industry and vowed that it will continue to invest in R&D despite the downturn.
2016-04-19 TSMC growth forecast remains at 5-10% this year
The foundry attributed its downward revision to slower-than-expected growth in the worldwide smartphone market, and weak PC and tablet sales
2015-02-25 TSMC eyes 10nm production by 2017
Taiwan Semiconductor Manufacturing Co. will start 10nm production at its existing Taichung, Taiwan site, where the chipmaker will later embark on production at more advanced technology nodes.
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors
2007-04-11 TSMC commences 45nm process
TSMC has rolled out its 45-nm process technology for foundry customers, with plans to enter production as early as September 2007
2004-09-21 TSMC claims lead in 0.13-micron, low-k production
Taiwan Semiconductor Mfg Co. Ltd said that it has cumulatively produced and shipped more than one million 8-inch equivalent wafers with circuits made using 0.13?m processing.
2014-09-30 TSMC beats competition with 84 per cent market control
Defined as the market for nodes with 28nm and smaller geometries, pure-play foundry market is forecast to expand by 72 per cent in 2014, and TSMC to take the lead with $10.3 billion in sales
2007-10-12 TriQuint, Win Semi survive GaAs fab shakeout
In the face of the expected shakeout in the GaAs foundry business, U.S.-based TriQuint Semiconductor remains the largest player in this segment and Taiwan's Win Semiconductor is still in the game
2006-09-14 Trade group inches China capex downward again
The Semiconductor Equipment and Materials International expects sales of semiconductor equipment in China to total $6.6 billion from 2006 through 2008. The estimate is slightly lower than its estimate from several months ago.
2011-04-29 TowerJazz SiGe process enables high-speed interfaces
The SiGe process enables high-speed interfaces in communication protocols such as Thunderbolt, optical fiber and high-data rate wireless by improving performance while reducing noise and power usage.
2013-11-29 Tower to subsume three fabs from Panasonic
As an effort to stem losses and halve its workforce, Panasonic is planning to sell three Japanese wafer fabs to foundry Tower Semiconductor.
2007-11-20 Tower fortifies APAC foothold with Taiwan office
Tower Semi has opened a representative office in Hsinchu, Taiwan to support its increasing presence throughout the Asia-Pacific.
2008-03-26 TMSC unveils 40nm 'half-node' step to 32nm
TSMC has unveiled an interim, 'half-node' step toward 32nm, which the foundry giant expects to ramp starting late next year
2014-11-07 TI expands presence in China with 300mm bumping facility
The company's new 300mm wafer bumping facility will rise in a second shell that came with the Chengdu site TI purchased back in 2010. The facility is scheduled to begin production in early 2016
2007-01-26 TI exits 45nm process race
Texas Instruments Inc. (TI) has decided to drop the costly business of digital logic process development and rely on foundry partners for its processes
2010-09-03 Texas, Spansion deals completed
TI has finalized the acquisition of Spansion's two wafer fabs in Aizu-Wakamatsu, Japan, and Spansion has signed a foundry agreement for TI to produce its flash memory products in one of the fabs.
2011-05-05 Telefunken buys Renesas Electronics's U.S. fab
Telefunken has bought the semiconductor wafer fab of Renesas Electronics America in Roseville, California and is planning to use the facility to further improve their production
2005-04-11 Taiwan's major foundries reveal continued sales declines
Taiwan's top two foundries reported further sales declines for the first quarter, in line with a slowdown that's settled across the industry this year.
2001-06-16 Taiwan's design foundries thriving despite downturn
A design house merely designs an IC; a design foundry provides total solutions from embedded IPs to complex tasks of time-to-market SoC design, production and testing services
2012-06-14 Taiwan OKs TSMC's 450mm fab
The plan, approved by the Council for Economic Planning and Development, has a total investment cost estimated at between $8 billion and $10 billion.
2005-01-12 Taiwan foundries to cut chip production this quarter
The number of chips rolling out of Taiwan's foundries will continue to decline this quarter, as the demand picture turns cloudy and fables customers try to eat through excess inventory.
2006-06-19 Sumco acquires majority stake of Komatsu
Sumitomo Mitsubishi Silicon would take a 51 percent stake in silicon wafer maker rival Komatsu Electronic Metals
2008-05-30 ST's fab targets volume ramp production
STMicroelectronics NV earmarked $500 million in capital expenditure to take its Crolles2 wafer fab manufacturing target of around 5,000 wafers per week to meet its full-building capacity
2007-01-29 ST to import CMOS, change Crolles function
STMicroelectronics CEO Carlo Bozotti told analysts that the company would align with "industry leaders" to obtain a 32nm CMOS process for use in its wafer fabs
2009-07-31 ST taps GlobalFoundries for 40nm low-power devices
STMicroelectronics and GlobalFoundries have teamed up to develop products based on 40nm low-power (LP) bulk silicon technology.
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