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2014-05-28 Wafer-to-wafer bonding pulls off sub-micron accuracy
The sub-micron accuracy was achieved using Ziptronix's technology and EVG's equipment. This approach can be used to manufacture fine-pitch 3D ICs for stacked memory and SoCs, and image sensors.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field.
2009-04-02 Wafer-level optics tech licensed to Qtech
Q Technology Ltd has licensed Tessera Technologies Inc.'s OptiML wafer-level optics (WLO) technology for next-generation mobile electronics. China-based Qtech will integrate the technology into its compact modules for cellphone and notebook computer applications.
2005-03-18 Wafer tester monitors RF chip quality in realtime
Keithley Instruments is now introducing a third-generation on-wafer RF measurement capability with some very promising features that address the conundrum
2008-01-14 Wafer probe stations cut cost in 45nm node
Cascade Microtech has launched the next step in 300mm wafer probe stations designed to meet the need for advanced on-wafer measurements for semiconductor devices
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility
2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2003-09-22 Wafer bumping technology qualified at Chartered
Unitive Semiconductor Taiwan Corp. (UST) has announced that its electroplated wafer bumping technology has been qualified at Chartered Semiconductor
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies.
2006-09-12 Tessera, Flextronics ink wafer-level assembly deal
Tessera Technologies and Singapore's Flextronics have signed a wafer-level assembly technology licensing agreement.
2007-07-18 Tessera, Alps ink wafer level-optics license deal
Tessera Technologies Inc. and Alps Electric Co. Ltd have signed a new license agreement enabling Alps to mass produce and sell wafer-level optics based on Tessera's OptiML wafer level camera tech.
2003-04-10 SUSS MicroTec, LNL collaborate on wafer optical probing solution
SUSS MicroTec AG and LNL Technologies have agreed to jointly commercialize LNL's optical probe technology.
2003-10-09 SUSS announces new wafer bonding technology
SUSS MicroTec AG has introduced a method of surface activation and wafer-to-wafer bonding referred to as the nano PREP
2013-04-01 Suite targets automated wafer-level parameter testing
Keithley has enhanced its Automated Characterisation Suite (ACS) software that enables automated wafer-level testing of high power semiconductor devices like power MOSFETs, IGBTs, BJTs and diodes.
2014-03-13 STATS ChipPAC unveils novel wafer level manufacturing
FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications
2006-08-18 Solution enables high-speed 25m backside wafer coating
DEK announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25m in thickness.
2002-03-14 Shellcase expands Jerusalem wafer packaging facility
Israel's Shellcase, a developer of wafer level chip size packaging (WLCSP), has opened its $8 million expanded production facility in Jerusalem, Israel with 15,000-square-feet clean room space.
2002-06-20 Seiko Epson certifies Electroglas in LCD wafer inspection
Seiko Epson certifies Electroglas in LCD wafer inspection
2003-07-07 SECAP installs wafer line at Hsinchu
The Semiconductor Equipment Consortium for Advanced Packaging has installed a 300mm wafer bumping and WLP line at Unitive Semiconductor located in Hsinchu, Taiwan
2002-04-24 RVSI rolls out gold bump wafer inspection system
Designed specifically to inspect wafers that employ gold bump technology, the WS-2510 from Robotic Vision Systems Inc. contains a sensor that can inspect micron-sized gold bumps at production speeds.
2014-02-07 Rise of mobile devices push market for wafer-level packaging
ReportsnReports predicted that the global wafer-level packaging equipment market will grow at a CAGR of 2.9 percent over the period from 2013-2018.
2013-05-29 Removing field failures at wafer level (Part 1)
Here's a look at Sonoscan's new automated wafer inspection system and its advantages
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2007-05-29 On-wafer solution brings power devices to market faster
Cascade Microtech's Tesla system touts a complete on-wafer solution for overtemperature, low contact resistance measurements of power semiconductors of up to 60A (current in pulsed mode) and 3,000V (coaxial measurement
2011-07-04 OmniVision buys wafer-level lens fab
OmniVision will purchase VisEra's wafer-level lens production operations in an agreement that is expected to be complete by 2Q12.
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies.
2006-01-12 New wafer-level package tech from National
National Semiconductor announced the micro SMDxt chip package, the company's newest generation of wafer-level package technologies.
2006-07-26 New wafer bonding system targets advanced MEMS
Touted to be an industry-first, SUSS MicroTec's field upgradable load locked wafer bonding system was developed for advanced MEMS devices
2004-06-17 Microfil wafer level underfilled chip scale package
This app note presents the Microfil wafer level underfilled chip scale package.
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