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2005-05-04 DongbuAnam offers 130nm process on multi-project wafers
DongbuAnam Semiconductor Inc. is offering access to a 130nm manufacturing process with up to eight layers of copper interconnect through a multi-project wafer service, the foundry said.
2002-02-08 AMS extends multi project wafer services
austriamicrosystems AG has extended multi project wafer services in its 200mm waferfab in Unterpremstaetten, Austria.
2008-12-09 austriamicrosystems brisks up ASIC prototyping
austriamicrosystems AG has announced to enhance its ASIC prototyping service. The company increases the number of wafer starts for multi-project wafers.
2006-01-18 UMC offers 90nm MPW service via Europractice
The Europractice IC service operated by the Interuniversities Microelectronics Center is now offering access to 90nm CMOS manufacturing on multiproject wafers from UMC.
2002-09-13 Tachyonics develops low noise RF transistor
Tachyonics Co. Ltd has announced that it has developed an RF transistor that features a NF <1dB at 2GHz, 2V.
2012-12-04 Globalfoundries ready to roll out FinFET wafers
The chip making giant's first multi-project wafer runs, which are aimed at customers testing their 14nm FinFET manufacturing process technology, could start as soon as the first quarter of 2013
2015-06-12 FD-SOI development programme targets low-power apps
The collaborative design platform aims to give participants a comprehensive IC technology platform complete with IC design, advanced IP, emulator and test services along with industrial MPW shuttles.
2014-02-03 Europractice MPW service features high voltage process
X-Fab, an analog and mixed-signal foundry, teamed with Imec to allow its Europractice IC service to offer a couple of high-voltage processes for manufacture using multi-project wafer runs.
2005-10-07 DongbuAnam expands fab, devises 110nm process
Preparing for a new crop of customers at home and abroad, Korean silicon foundry specialist DongbuAnam Semiconductor Inc. said that it plans to expand its wafer capacity and will also develop a new 110-nm process technology
2014-01-29 China foundry announces 28nm-process readiness
SMIC said it successfully entered Multi Project Wafer (MPW) stage to support customer's requirements on both 28nm PolySiON and 28nm high-k dielectrics metal gate processes.
2014-04-01 CEO of China's SMIC talks about global expansion
EE Times correspondent Junko Yoshida sat down with SMIC CEO Tzu-Yin Chiu in a one-on-one interview that revealed the company's interest to expand globally.
2005-03-03 Chartered delivers 65nm design manual and Spice models
Singaporean foundry Chartered Semiconductor Mfg Ltd said it has made the initial deliveries to customers of items to support design in a 65nm manufacturing process developed with IBM Corp., Infineon Technologies AG and Samsung Electronics Co. Ltd.
2007-02-19 HeJian partners with Beijing IC Design Park on 0.18?m service
HeJian Technology (Suzhou) Co. Ltd will team up with Beijing IC Design Park to unveil multi-project wafer service.
2013-11-15 Ams offers cost-efficient IC prototyping service
The prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, claims to deliver significant cost advantages for foundry customers.
2002-12-19 Zarlink offers high-voltage process for foundry work
Zarlink Semiconductor Inc. has introduced a commercial foundry service for producing analog chips based on its high-performance, high-voltage process.
2010-11-17 TSMC, IMEC, GSA award urges mixed-signal RF design
TSMC, IMEC and the Global Semiconductor Alliance are coming together to support an annual award that highlights how engineering is an exciting and rewarding high-status profession.
2010-03-04 TowerJazz helps boost Korea IC design
TowerJazz has signed an agreement with Korea's IC Design Education Center (IDEC) to accelerate the country's specialty IC design expertise.
2012-10-23 ST, Soitec roll 28nm FD-SOI CMOS process thru CMP
ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process that uses silicon substrates from Soitec is available for prototyping to universities, research labs and design firms.
2013-03-12 ST, CMP team up to deliver 130nm CMOS process
The H9A CMOS process is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
2004-08-31 Shifting gear to survive downturn
CEO Roland Pudelko narrates how Dialog Semiconductor shifted its focus and survived the downturn.
2013-10-03 Online quoting service drastically cuts MPW quote time
eSilicon's automated, instant, online quoting service for MPW Shuttle Services takes only around 15 minutes, a vast improvement from the usual process that takes 40 hours.
2012-12-21 Nikon, IME to open lithography R&D lab in Singapore
Nikon has teamed up with A*STAR's Institute of Microelectronics for an R&D facility in Singapore that will develop advanced optical lithography technology for IC manufacturing.
2002-10-22 IMEC, UMC enter foundry service agreement
IMEC and United Microelectronics Ltd have signed a three-year foundry service agreement which concerns IMEC's Europractice IC Service.
2013-10-10 Imec unveils 25Gb/s silicon photonics platform
Imec's portfolio includes low loss strip waveguides, highly efficient grating couplers, high-speed Germanium waveguide photodiodes, 25Gb/s Mach-Zhender and micro-ring modulators.
2013-03-18 Imec offers fully integrated silicon photonics platform
The platform claims to enable cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) and optical sensing and life science applications.
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions.
2007-07-18 IBM, HKSTP team to promote IC foundry services in APAC
IBM and Hong Kong Science and Technology Parks Corp. have partnered to promote semiconductor foundry services in the Asia Pacific region.
2009-04-20 IBM 'fab club' tips 28nm high-k process
Despite the downturn, the silicon foundry business is heating up as IBM Corp.'s "fab club" has officially rolled out its 28nm process based on high-k dielectrics and metal gates.
2008-07-23 HKSTP-IBM partnership sees extension
A new chapter awaits the Hong Kong Science and Technology Parks Corp. (HKSTP)-IBM partnership.
2015-07-14 GlobalFoundries rolls out FD-SOI platform
GlobalFoundries' FDX platform, using an advanced FD-SOI transistor architecture, confirms the momentum of this technology by expanding the ecosystem and assuring a source of high-volume supply.
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