Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > wafer processing

wafer processing Search results

total search559 articles
2004-11-10 Wafer processing device provides quick, accurate leveling
CyberOptics announced a wireless, wafer-like device that enables quick and accurate leveling of semiconductor wafer processing and automation equipment.
2005-10-11 U.S. suppliers to grab half of semi processing market in '05
U.S.-based manufacturers will account for 50 percent of the global front-end wafer processing market this year, according to just published data from market research group The Information Network.
2002-08-23 TI uses Ultratech technology for improved wafer yield
Ultratech Stepper Inc. has received an order for its latest bump stepper, the Saturn Spectrum 300e2, from Texas Instruments.
2003-04-10 SUSS MicroTec, LNL collaborate on wafer optical probing solution
SUSS MicroTec AG and LNL Technologies have agreed to jointly commercialize LNL's optical probe technology.
2004-03-24 SEZ receives wafer tool order from DongbuAnam
SEZ Group has received a follow-on order from wafer foundry DongbuAnam Semiconductor
2003-03-05 Samsung to deploy KDNS cleaning, wafer processing tools
DNS Korea Co. Ltd has announced that it will deliver three of its cleaning and wafer processing equipment to Samsung.
2006-10-09 RTP system eases shift to single-wafer processing
Mattson Tech's new 300mm rapid thermal processing (RTP) system is designed to address the industry's transition to single-wafer processing for applications currently predominantly run on furnaces.
2007-05-11 Osram to put up LED wafer fab in Malaysia
Siemens unit Osram GmbH has announced plans to erect an LED wafer fab in addition to its existing backend facility in Penang, Malaysia
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging
2002-01-24 Nanya to proceed with 12-inch wafer fab
Memory chip maker Nanya Technology Corp. intends to proceed with plans to build a $2 billion 12-inch wafer processing plant starting in March.
2002-06-26 Nanometrics rolls out 300mm wafer inspection technology
Nanometrics Inc. has launched the NanoUDI technology for 300mm wafer processing, which meets requirements for yield management.
2004-08-23 Hynix signs contract to build Wuxi wafer fab
South Korean memory maker Hynix Semiconductor Inc. has signed a contract with authorities in Wuxi City in China's Jiangsu Province to build a wafer fab there, the company said on August 18, 2004
2002-06-03 FSI receives $15M order for wafer processing equipment
FSI Int. Inc. has received follow-on orders of about $15 million for its ZETA 300mm surface conditioning systems and POLARIS 3500 microlithography clusters.
2014-02-13 EVG outs high-volume-mfg photoresist processing system
The EVG150XT is optimized for ultra-high throughput and productivity and is aimed at logic and memory high-volume manufacturing.
2012-11-23 ENIAC JU proposes three pilot wafer fabs
The ENIAC joint undertaking is seeking more than $1 billion towards projects for 2012, the majority of which would be for the pilot line project proposals.
2005-12-05 Elpida beefs up 300mm wafer fab in Hiroshima
Elpida Memory and Hiroshima Elpida Memory announced the completion of its new 300mm production line at its 300mm wafer fabrication facility in Hiroshima, Japan
2014-01-29 Cost-efficient 3D IC wafer processing without adhesives
AML showcased a unique solution to get rid of the adhesive and to allow for a vacuum to be created between the carrier and the wafer to be processed in 3D IC production
2012-05-08 Chinese firm builds MEMS wafer fab
Construction of the wafer fab started in March 2012 and the buildings will sit in the Hanking MEMS Industrial Park, which occupies about 647,497 square meters in Fushun Economic Development Zone
2003-12-04 ASE deploys multiple 300mm wafer bumping system
SUSS MicroTec AG announced that Advanced Semiconductor Engineering Inc. (ASE) has recently purchased and installed multiple 300mm SUSS lithography systems.
2003-05-30 ANADIGICS obtains patents for wafer processing innovation
ANADIGICS Inc., a supplier of wireless and broadband communications solutions, has received two new patents relating to the improvement of its semiconductor manufacturing processes.
2014-02-10 300mm wafer processing dominates, 200mm capacity stays relevant
IC Insights indicated that nearly all fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs.
2014-05-28 Wafer-to-wafer bonding pulls off sub-micron accuracy
The sub-micron accuracy was achieved using Ziptronix's technology and EVG's equipment. This approach can be used to manufacture fine-pitch 3D ICs for stacked memory and SoCs, and image sensors.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field
2005-03-18 Wafer tester monitors RF chip quality in realtime
Keithley Instruments is now introducing a third-generation on-wafer RF measurement capability with some very promising features that address the conundrum
2008-07-15 Wafer tech cuts costs in PV manufacturing
Silicon Genesi has successfully produced solar substrates for the PV industry using a revolutionary "kerf-free" wafering process technology developed by SiGen called PolyMax.
2011-08-09 Wafer reader reduces reading time by 40
Cognex has released a wafer reader that claims to have faster processing power, internal illumination system and total backward compatibility.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface
2014-03-13 STATS ChipPAC unveils novel wafer level manufacturing
FlexLine claims to provide freedom from wafer diameter constraints while enabling supply chain simplification and cost reductions that are not possible with a conventional manufacturing flow
2011-09-26 Specialized foundry processing yields high-performance analog IC
Learn about the impact of foundry process on achievable specifications.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top