Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > wafer

wafer What is a wafer? Search results

?
?
What is a wafer?
The base unit of chipmaking. A thin circular slice of a semiconducting material, such as pure silicon, on which an IC can be formed.
total search3506 articles
2010-10-21 22 Europe companies join CCSL project to push LEDs
A group of 22 leading European companies and academic institutions have just announced that they are collaborating in the "Consumerizing Solid-State Lighting" (CSSL) project.
2011-04-15 2011 LED fab equipment spending to grow 40%
The latest SEMI Opto/LED Fab Forecast says soaring consumer demand for LED technology will fuel aggressive investments and push LED fab equipment spending by 40 percent in 2011.
2011-01-06 2011 forecast from Semico
Semico Research Co. reveals seven key predictions for the coming year. NAND flash, ASIC, SoCs get special mention.
2015-10-16 200mA boost converter supports 2.7V to 5V output
The AS1383 from Ams is powered by a single-cell lithium-ion battery and can be used in consumer products such as wristbands, media players, digital cameras and mobile phones.
2009-12-28 2009: Rollercoaster ride for foundries
Foundry providers took a beating along with everyone else during this tumultuous year. But the damage done by the economy was multiplied by the foundries' own foul-ups.
2005-02-01 2.5G, 3G converge in a 'world handset'
While 2.5G systems rely on GSM, the transition to W-CDMA will involve the need for combined GSM/W-CDMA handsets.
2002-03-01 1st Silicon, FTD forge joint marketing, tech support deal
1st Silicon (Malaysia) Sdn Bhd and Singapore-based FTD Technology Pte Ltd have entered into a worldwide joint marketing and technical support agreement.
2005-05-11 1st Silicon starts production of Sharp's flash technology
1st Silicon Sdn. Bhd. has completed qualification and begun production shipment of Sharp Corp.'s 0.13?m NOR flash technology.
2007-05-02 16Mbit SDRAM design cuts SiP/MCP costs
Inapac Technology is sampling a 16Mbit SDRAM design that enables SiP and MCP producers to minimize cost of ownership while achieving production quality and reliability.
2009-11-20 16bit MCUs pack dual interface, Mifare Plus S
Renesas has developed a series of dual interface MCUs built around the RS-4 16bit CPU core for contact and contactless communication.
2005-11-21 16bit MCU portfolio targets performance, cost goals
In the advent of more complex electronic design requirements from customers for increased speed, efficiency and performance, chipmakers jumped on the 32bit bandwagon for microcontroller-intensive applications.
2015-11-16 13MP quantum-dot image sensor claims to outdo silicon
InVisage Technologies developed the innovative device that uses quantum-dot material rather than silicon to capture light, and boasts potential that could make CMOS image sensors obsolete.
2012-03-26 130nm CMOS logic backend tech unleashed
SilTerra Malaysia released the CL130AL that offers single poly up to six layers of aluminum metallization, borderless contacts and via with USG inter-metal dielectric.
2015-06-16 10nm node offers lower gate costs
The expectation is that 10nm will be a high volume and long lifetime technology node. TSMC and Samsung are projecting risk production for 10nm in Q4/2015, and the customer target is Apple.
2010-02-09 100GHz RF graphene transistor trumps GaAs ICs
Fabricated on new 2-inch graphene wafers and operating at room temperature, the RF graphene transistors are said to beat the speeds of all but the fastest GaAs transistors.
2009-11-23 10 technologies to look forward to in 2010
EE Times has compiled emerging technologies that have potential to change the electronics landscape in 2010.
2010-06-15 10 reasons to remain bullish, worried for 2010
So far, the electronics industry is seeing a big upturn, giving signs of a positive year. Still, there are some concerns. Here are 10 reasons why I'm bullishand worriedabout 2010.
2012-11-20 1.2kV IGBT tech boasts ruggedness for industrial apps
IR's Gen8 IGBT technology uses the company's latest generation trench gate field stop technology that claims to offer best-in-class performance for industrial and energy saving applications.
2006-05-16 0.35m CMOS process allows voltages from 3.3V to 120V
austriamicrosystems' Full Service Foundry business unit announced its 0.35m high-voltage CMOS technology H35 with an additional set of 120V NMOS and PMOS devices.
2006-12-04 'Smallest' LDO drives LED lighting in portables
Texas Instruments Inc. has introduced a two-bank LDO, touted to be the smallest of its kind, for supporting LED lighting in portable applications such as mobile phones, navigation systems, and MP3 and media players.
2007-11-15 'Green' silicon ink prints cheaper RFID tags
Kovio claimed that RFID tags using its 'green' silicon ink will drop Kovio's price from 15 cents today to 5 cents by 2008, when Kovio begins volume production of its inkjet-printed RFID tags.
2003-11-03 'Free engineering' era nears end
The time of free engineering is over; Bob Bailey advises that OEMs partner with the best technology companies and establish stable supply lines now, before the whole industry goes into panic.
2009-03-06 'First' quarter-inch image sensors integrate EDoF
STMicroelectronics has introduced the market's first quarter-inch optical format, 3Mpixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. The image sensors offer an alternative to auto-focus camera solutions.
2009-02-09 'First' 300mm MTJ fab in U.S. unveiled
Grandis Inc. announced the first 300mm magnetic tunnel junction (MTJ) fabrication facility in the United States dedicated to spin torque transfer-RAM (STT-RAM) memory technology. The recent additions to its MTJ fab enable Grandis to incorporate STT-RAM into its customers' most advanced semiconductor processes on 300mm wafers.
2006-05-17 'First' 2-inch AlN substrates for high-power RF apps
Crystal IS announced the release of what it claims to be the first 2-inch AlN substrates for use in high power RF electronics, blue and UV optoelectronics.
2007-06-04 'Fab Club' welcomes two European members
Three companies, two of them based in Europe, join the Fab Owners Association (FOA) bringing the number of semiconductor and MEMS manufacturing facilities owned by member companies to over 60.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top