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What is a wafer?
The base unit of chipmaking. A thin circular slice of a semiconducting material, such as pure silicon, on which an IC can be formed.
total search3506 articles
2012-02-17 Wafer fab shut downs on the rise
Suppliers closed or upgraded their fabs that were manufacturing using smaller wafers and shifted operations to produce more cost-effectively on larger wafers.
2003-04-09 Wafer fab equipment market declines in 2002
Worldwide wafer fab equipment revenue in 2002 totaled $16.5 billion, a 31.6 percent decline from 2001's $24.1 billion revenue, reported Gartner Inc.
2015-07-13 Wafer fab closures projected to grow in the coming years
Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009 and more recently, ProMOS and Powerchip closed 300mm wafer fabs in 2013.
2012-08-09 Wafer discounts, rush orders from MediaTek, Nvidia
TSMC and UMC have also been offering wafer discounts to try and pull in orders for the worryingly quiet Q4 of the year, according to a Taiwan Economic News report.
2002-08-09 Wafer demand increases in Q2 2002
The quarterly Wafer Demand Survey has noted a 9 percent increase in actual wafer demand for Q2 2002 compared to the 3 percent increase forecasted in Q1 2002.
2003-07-16 Wafer coating system eyes deep-UV lithography
Dainippon Screen Mfg. Co. Ltd has released its RF3 offering that is a 300mm coating/developing system for advanced deep-UV lithography.
2001-10-09 Wafer characterization
This application note shows an example of how RF Nitro performs wafer characterization.
2003-09-22 Wafer bumping technology qualified at Chartered
Unitive Semiconductor Taiwan Corp. (UST) has announced that its electroplated wafer bumping technology has been qualified at Chartered Semiconductor.
2012-01-19 Wafer bonding machine yields 3D integrated LSI ICs
The Bond Meister MWB-12-ST can continuously bond up to five 12in wafers and can perform wafer transfer and alignment for automatic bonding.
2004-05-14 Wafer area shipments up by 9 percent: SEMI
Worldwide silicon wafer area shipments increased 9 percent sequentially in the first quarter 2004 and 29 percent from the first quarter 2003, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
2006-07-10 UV laser systems ease wafer dicing, micromachining
JPSA introduced its new IX200 series of laser systems that is available in UV diode-pumped solid-state and Excimer UV laser configurations.
2012-08-21 Utilize wafer-scale CMOS X-ray imaging for medical apps
This imaging technology can bring key advantages in terms of performance such as high resolution, high dynamic range and low noise capabilities.
2008-06-20 Unisem, FlipChip deal zeroes in on wafer technologies
Unisem and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies.
2002-06-05 UMCi jumpstarts new construction phase for 300mm wafer facility
Singapore-based UMCi, a joint venture between UMC, Infineon Technologies AG (IFX) and EDBI, has awarded major contracts for the next-phase of the construction of its 300mm facility located at the Pasir Ris Wafer Fab Park.
2003-10-24 UMC deploys August Tech wafer inspection equipment
United Microelectronics Corp. has selected August Technology's NSX Series wafer inspection system to inspect fully processed outgoing wafers.
2002-09-17 UMC denies reports of 300mm wafer capacity cuts
United Microelectronics Corp. is denying a news report that it will slice in half its 300mm wafer capacity to 5,000 wafers per month by the end of the year.
2003-04-23 UMC adopts Agilent solution for 300mm wafer testing
Semiconductor foundry United Microelectronics Corp. has selected Agilent Technologies' 4070|300 system for fully automated 300mm wafer parametric testing.
2009-01-19 Ultrathin wafer bonding system installed in Taiwan lab
EV Group (EVG) has installed an EVG 500 series wafer-bonding system at Brewer Science Inc.'s Taiwan applications lab.
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2003-12-04 TSMC to expand 300mm wafer production capacity
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2011-05-17 TSMC sees no wafer supply disruptions after March quake
Having secured the required prime wafer supply, TSMC maintains the Japan quake and tsunami will have no supply-side impact except on chipmaking equipment.
2015-12-09 TSMC plans to set-up its first 12in wafer fab in China
TSMC will join a growing list of chipmakers that have rolled out 12in fab projects in China, which, according to SEMI, has one of the world's largest semiconductor markets.
2016-03-30 TSMC inks deal for first 300mm wafer fab in China
The facility, to rise in the Pukou Economic Development Zone, will have a planned capacity of 20,000 12in wafers monthly and will include a design centre.
2005-04-05 TSMC expects higher wafer shipments next quarter
Due to the growing demand for LCD driver ICs, Taiwan Semiconductor Mfg Co. (TSMC) expects its semiconductor shipment to grow significantly next quarter.
2005-08-23 TSMC applies at CTSP to build a wafer plant
An official from the Central Taiwan Science Park (CSTP) has confirmed the application of wafer manufacturer Taiwan Semiconductor Mfg Co. (TSMC) to build a new facility at the industrial center.
2015-12-01 TowerJazz inks deal to buy Maxim's wafer fab
The agreement is expected to boost TowerJazz's global wafer manufacturing capacity, cost-effectively increasing production by nearly 28,000 wafers per month.
2002-03-14 Tower yields first 0.18?m wafer output
Israel wafer manufacturer Tower Semiconductor Ltd has produced its first 0.18?m wafer output from its Fab 2 pilot line with higher-than-expected yields.
2012-11-28 Tower offers to expand wafer fab project to Indian gov't
Tower Semiconductor had previously announced that it is in a consortium with IBM and Indian firm Jaypee, which was shortlisted by the Indian government to build and run a 300mm wafer fab.
2007-09-24 Tower bags 2008 wafer order from U.S. IDM
Tower Semiconductor Ltd has secured an order from an unnamed U.S. IDM for thousands of wafers of 130nm chips worth millions of dollars per month.
2006-11-02 Toshiba to sell stake in wafer unit
Toshiba Ceramics Co., the silicon wafer unit of Toshiba Corp., plans to conduct a management buyout in conjunction with a pair of private equity firms.
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