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What is a wafer?
The base unit of chipmaking. A thin circular slice of a semiconducting material, such as pure silicon, on which an IC can be formed.
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2002-04-24 RVSI rolls out gold bump wafer inspection system
Designed specifically to inspect wafers that employ gold bump technology, the WS-2510 from Robotic Vision Systems Inc. contains a sensor that can inspect micron-sized gold bumps at production speeds.
2002-06-11 RVSI receives order for 3-D wafer inspection system
Robotic Vision Systems Inc. has received an order for a WS series bumped wafer inspection system from an undisclosed major supplier of materials for BGA semiconductors.
2007-06-20 Russia cooks up 300mm wafer fab plans
Russia is collaborating with a party known only as the "Kedah Group" to construct a 300mm wafer fab at the city of Nizhny Novgorod.
2006-10-09 RTP system eases shift to single-wafer processing
Mattson Tech's new 300mm rapid thermal processing (RTP) system is designed to address the industry's transition to single-wafer processing for applications currently predominantly run on furnaces.
2014-02-07 Rise of mobile devices push market for wafer-level packaging
ReportsnReports predicted that the global wafer-level packaging equipment market will grow at a CAGR of 2.9 percent over the period from 2013-2018.
2003-08-29 RFMD migrates to 6-inch wafer manufacturing
RF Micro Devices Inc. has successfully completed its first major customer qualification of its 6-inch wafer manufacturing capabilities.
2000-03-30 RF measurements on SIEGET bipolar transistors: Predicting performance straight from the wafer
Multistage measurements are intended to ensure unrestricted operation of RF transistors. Recently, RF properties could only be measured on packaged components, while DC measurements alone cannot provide reliable indication of RF performance. Not until on-wafer testing emerged did it become possible to evaluate the RF parameters of production batches right from the wafer fabrication stage. This application note cites the example of on-wafer RF testing of SIEGET transistors.
2007-11-19 Report: Foundry wafer starts fly high in Q3
A new report from SICAS found that foundry wafer starts increased 13.3 percent in Q3 from the previous quarter, and 19.1 percent compared with the same quarter in 2006.
2004-09-06 Renesas, Mitsumi agree on transfer of 200mm wafer fab
Mitsumi Electric Co. Ltd will acquire a 200mm wafer fab from Renesas Northern Japan Semiconductor Inc., a wholly-owned affiliated company of Renesas Technology Corp.
2014-01-30 Renesas to transfer wafer fab line to Sony
Renesas Electronics signed a definitive agreement to transfer the 12-inch front-end wafer fabrication line at its Tsuroka facility to Sony Semiconductor.
2015-05-26 Renesas sells wafer fab to Rohm
The acquisition of Renesas' Shiga factory is scheduled to complete in February 2016 and to be used as a manufacturing line to produce to IGBT and MOSFET power devices and piezoelectric MEMS devices.
2015-12-02 Renesas inks deal to transfer wafer fab to TDK
TDK is intensely focused on efforts to expand its businesses and their profitability through a concentration on the electronic components business targeted at its core markets.
2013-05-29 Removing field failures at wafer level (Part 1)
Here's a look at Sonoscan's new automated wafer inspection system and its advantages.
2002-06-04 Raytheon inks wafer production alliance with Taiwan foundry
Raytheon Co. has formed a compound semiconductor foundry alliance with Taiwan-based Win Semiconductors Corp.
2012-01-09 Rapid acoustic inspection for 300MM wafer generation (Part 2)
Read about a system that is touted to deliver superior precision, resolution and throughput in wafer inspection.
2011-12-30 Rapid acoustic inspection for 300MM wafer generation (Part 1)
As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield.
2012-07-02 Qualcomm explores wafer fab options
Qualcomm has explored the possibility of owning its own wafer fab along with possibly partnering with Samsung in lieu of suffering a shortage in processors from TSMC.
2003-05-19 Q1 wafer shipments down, but demand should increase
The Fabless Semiconductor Association said wafer shipments dipped 5 percent in Q1 but is expected to slowly increase from now through 2004.
2005-05-17 ProMOS to ramp up capacity at 12-inch wafer fab
ProMOS Technologies Inc. has revealed capacity expansion plans for its 12-inch wafer fab located in the Central Taiwan Science Park (CTSP).
2002-04-10 Powerchip injects $1.6B to build 12-inch wafer fab
Powerchip Semiconductor Corp. has invested $1.6 billion to establish a 12-inch wafer fab, with a proposed monthly capacity of 35,000 wafers.
2002-05-14 Powerchip 30mm wafer fab to use PRI reticle system
Taiwan memory chip maker Powerchip Semiconductor Corp. has selected PRI Automation Inc.'s Guardian Bare Reticle Stocker for its new 300mm wafer fab. The order represents PRI's first bare reticle management system in Taiwan.
2011-07-14 Polysilicon prices rebound, Si wafer faces challenges
The price of polysilicon has gone up after slumping during the global downturn. Si wafer prices, on the other hand, are expected to face more financial challenges.
2013-09-04 Polysilicon costs forces wafer makers to increase price
According to EnergyTrend the increasing price of China's polysilicon spot market has triggered price hikes in Asia's polysilicon market.
2003-10-06 PMC-Sierra CEO sees wafer shortage ahead
A severe wafer shortage is looming, according to Bob Bailey, president of PMC-Sierra Corp.
2013-05-15 Pad conditioner geared for wafer fabrication
Morgan's Phoenix Edge pad conditioners claim to produce CMP pads with significantly smaller asperities and more consistent pad texture than those using traditional diamond crystals or grit.
2007-05-11 Osram to put up LED wafer fab in Malaysia
Siemens unit Osram GmbH has announced plans to erect an LED wafer fab in addition to its existing backend facility in Penang, Malaysia.
2015-11-11 Oscillator company to raise $12.5B for memory wafer fab
China's Tsinghua Unigroup, a state-controlled conglomerate, will build a fab that is likely to be focused on the production of non-volatile memory such as NAND flash.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2010-12-01 Optical inspection system targets 2mµ wafer defects
Altatech Semiconductor S.A. launches high-throughput AltaSight EyeEdge inspection system
2007-05-29 On-wafer solution brings power devices to market faster
Cascade Microtech's Tesla system touts a complete on-wafer solution for overtemperature, low contact resistance measurements of power semiconductors of up to 60A (current in pulsed mode) and 3,000V (coaxial measurement).
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