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What is a wafer?
The base unit of chipmaking. A thin circular slice of a semiconducting material, such as pure silicon, on which an IC can be formed.
total search1825 articles
2003-10-16 Yamato Works reflow oven suits 300mm wafers
The N2 reflow oven for solder bump forming from Yamato Works Co. Ltd features hot plate and upper far-infrared rays that can be used for heating.
2006-05-31 Yamato unveils N2 reflow oven for 200-300mm wafers
Yamato Works rolled out a nitrogen relfow oven for solder bump forming for 200-300mm wafers.
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors.
2016-05-05 Warped wafers no longer a problem for acoustic scanner
Sonoscan announced the C-SAM systems with its Quantitative Dynamic Z (Q-DZ) surface tracking feature for scanning warped wafers for defect detection or for measurement.
2005-03-24 UMC helps Scotland's MED on microdisplay wafers
Taiwan foundry United Microelectronics Corp. has started processing wafers for MicroEmissive Displays Group plc, a vendor of low-power microdisplays using organic light emitting polymers, MED said.
2014-11-19 Ultratech outs in-line inspection system for patterned wafers
The Superfast 4G promises a high degree of flexibility enabling the use of a single type of wafer inspection tool to measure the front side of patterned wafers across the entire fab line at the lowest cost.
2004-09-22 TSMC to use 193nm immersion lithography for 12-inch wafers
Taiwan Semiconductor Mfg Corp. (TSMC) will begin producing 12-inch wafers using 193nm immersion lithography by October after adopting the process to its Fab 12.
2004-09-24 TSMC registers 1 million wafers using 0.13?m tech
Taiwan Semiconductor Mfg Co. (TSMC) has reached the one millionth mark in its shipment of 8-inch equivalent wafers made with the company's 0.13?m technology.
2002-04-19 TRONIC'S to use Soitec SOI wafers for MEMS technology
MEMS contract manufacturer TRONIC'S Microsystems SA has selected Soitec's Smart Cut UNIBOND silicon-on-insulator wafers as the starting material for its SOI-based MEMS technology.
2003-04-23 Toshiba to manufacture 300mm wafers at new fab
Toshiba Corp. will start in June the construction of an advanced 300mm-wafer cleanroom for system LSIs at its Oita Operations plant in Oita prefecture, Kyushu, Japan.
2002-07-16 TEL to roll out next-gen processing systems for 300mm wafers
Tokyo Electron Ltd is developing a next-generation process coater/developer for use in 300mm wafers.
2011-05-31 SPTS, Griffith University to develop SiC-on-Si wafers
A joint agreement has been forged between SPTS and Griffith University for the commercial development of SiC-on-silicon wafers as viable semiconductor material for LED, power and MEMS devices.
2012-01-26 Soitec, Sumitomo demo 'smart-cut' GaN wafers
The substrates are produced by transferring ultra-thin high quality GaN layers from a single GaN wafer to produce multiple engineered GaN substrates.
2005-01-19 Soitec supplies AMD with UNIBOND SOI wafers
Soitec Group has inked an agreement with AMD for a long-term supply of UNIBOND silicon-on-insulator (SOI) wafers.
2002-08-26 SMIC launches 8-inch wafers using 0.185m process
Semiconductor Mfg Int. Corp. has commenced production of its 8-inch wafers using 0.185m process.
2010-08-05 SMIC churns out 65nm wafers in Beijing
Semiconductor Manufacturing International Corp. (SMIC) has moved its low-leakage 65nm process technology into volume production at its 300mm facility in Beijing, the company said. It is also working on the transition to 55nm technology.
2006-01-13 Silicon wafers, SOI see strong growth
Driven by 300mm technologies, the worldwide silicon wafer market is projected to see strong growth over the next few years.
2005-10-12 Silicon wafers see growth through '08
Worldwide silicon wafer shipments are expected to grow over the next few years after flat sales in 2005.
2008-09-04 SIA: 300mm wafers rule IC manufacturing in July
300mm wafers for the first time account for the largest share of wafer manufacturing capacity and actual wafers processed, with 44 percent of total capacity and 47 percent of total silicon processed, according to the Semiconductor Industry Association.
2006-09-27 Shin-Etsu to increase capacity to 1 million wafers/month
Shin-Etsu Chemical announced its plan to expand its monthly production of 300mm silicon wafers to 1 million by Q4 2007 to meet rapidly growing market demands.
2002-04-08 SDK yields large-diameter InP monocrystal mirror wafers
Showa Denko K.K. has developed a six-inch InP semi-insulating monocrystal mirror wafers at its Chichibu plant in Saitama, Japan.
2002-04-23 SDK develops 150mm InP monocrystal mirror wafers
Showa Denko K.K. has developed what it claims to be the world's first 150 mm InP semi-insulating monocrystal mirror wafers for use in the production of photodiodes and next-generation mobile phones.
2002-06-13 Samsung Corning begins pilot production of GaN wafers
Samsung Corning Co. Ltd has commenced pilot production of GaN wafers in its Suwon, South Korea, plant.
2013-07-12 RF SOI wafers from Soitec receive mainstream attention
Soitec's technology enables highly tunable amplifiers to address multi-region requirements on a single platform while also reducing noise and interference.
2012-03-19 Production system yields ultrathin monocrystalline wafers
The Hyperion from Twin Creeks uses the Proton Induced Exfoliation technology that claims to create monocrystalline wafers that are less than 1/10th the thickness of conventional wafers.
2002-05-15 PLD moves toward 300mm wafers, 0.135m process
The move towards 300mm wafers is proving to be advantageous to PLDs as compared to ASICs, said Wim Roelandts, president and CEO of Xilinx, because PLDs need bigger dies than ASICs.
2006-04-27 Platform used for measuring wafers, PCBs
Cascade Microtech introduced the M150 measurement platform, which is used for semiconductor wafers, ICs, PCBs, MEMS and bioscience devices.
2005-01-10 Owens unveils new module for 200/300mm wafers
Owens Design announced that it has introduced a wafer heating and cooling module to its family of custom wafer handling solutions.
2004-08-26 Nvidia delays delivery of 20,000 processed uncut wafers
Nvidia Corp. has delayed the delivery of about 20,000 processed uncut wafers of its GeForce FX5200 from Taiwan Semiconductor Mfg Co. Ltd (TSMC).
2012-06-29 Multi-Si wafer improving, poised to replace mono-Si wafers
EnergyTrend's study shows high efficiency multiSi wafer products eventually cannibalizing the p-type mono-wafer market.
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