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2003-05-22 Winbond, TigerJet collaborate for Internet phone chipsets
Winbond Electronics Corp. America has aligned with TigerJet Network Inc. to offer a low-cost, high-quality chipset solutions for the Internet phone market.
2008-04-24 Winbond, Qimonda team up on next-gen DRAM
Qimonda this week said that it has signed a technology license and foundry agreement for its new 65nm 'buried wordline' technology with Taiwan's Winbond Electronics.
2007-06-29 Winbond, Qimonda extend memory production deal
Winbond Electronics and Qimonda AG have signed an agreement to further expand their existing cooperation for the production of memory chips.
2006-02-14 Winbond's Taichung plant to begin operations in April
Winbond Electronics was reported to be gearing up for its 12-inch fab in Taichung, which is slated to begin operations in the third week of April this year.
2008-03-18 Winbond's logic IC biz christened Nuvoton
Focusing on memory products, Winbond Electronics has spun off its logic IC business and named it Nuvoton.
2006-07-26 Winbond's 32bit solution cuts product development time
Winbond has launched the integrated general 32bit single-chip W90P710 and W90N745, and a comprehensive development proposal to reduce product development time of system houses.
2005-12-13 Winbond WLAN device receives WMM Power Save certification
Winbond announced the W89C37 as its latest member of the WinFi family of WLAN products. The W89C37 has received the WMM Power Save certification by the WiFi Alliance due to the new features of its latest generation MAC and baseband IC.
2004-10-13 Winbond unveils new image signal processor chip
Winbond Electronics Corp. has recently announced its new image signal processor (ISP) LSI for 1.3- to 3-megapixel camera modules applied to mobile handsets.
2006-10-25 Winbond unrolls three SDRAM product series
Winbond has announced its latest range of SDRAM products the 64Mbyte W9864 series, the 128Mbyte W9812 series and the 256Mbyte W9825 series.
2007-03-01 Winbond unrolls parallel, serial flash devices
Winbond has announced three new parallel flash memory devices in its W19B product family and two new serial flash memory devices in its SpiFlash W25X family.
2006-11-01 Winbond touts 'highest-density' Pseudo SRAM
Winbond Electronics has announced what it touts as the Pseudo SRAM with the largest density in the market.
2006-01-27 Winbond to sell FPD business to Cheertek
Winbond Electronics announced that the Board of Directors approved the sale of its flat panel display business to Cheertek Technology for reportedly around $125 million.
2005-06-17 Winbond to ramp up 300mm production using ESI Model 9830
Winbond Electronics Corp. has purchased multiple ESI Model 9830 semiconductor link processing systems from Electro Scientific Industries Inc. to be installed at its latest 300mm fab in Taichung, Taiwan.
2004-08-26 Winbond to output UTT DRAM
Winbond Electronics Corp. has started producing untested DRAM chips.
2007-03-02 Winbond to feature 32bit MCUs at IC and system design event
Winbond Electronics Corp. will showcase two products at the 12th International IC-China Conference & Exhibitionthe W79E8XX (8051 core) LPC series and the 32bit W90P710/W90N745 (ARM core) MCU.
2004-07-19 Winbond to commence driver IC volume production
Winbond Electronics Corp. plans to kick off volume production of driver ICs for LCD TV receivers of over 20-inches in the last quarter of the year.
2005-05-24 Winbond to clear eTT commodity DRAM memory inventory
Chip maker Winbond Electronics announced that it will first clear its inventory of effectively tested (eTT) commodity DRAMs and will not manufacture the product until capacity expansion has been achieved for 12in wafers by the end of the year.
2007-01-04 Winbond to build R&D center close to ChuPei station
The board of directors of Winbond Electronics Corp. recently approved the plan to spend about $21.6 million to get a commercial land close to the High-Speed Rail ChuPei Station.
2005-03-17 Winbond to acquire National Semi's PC Super I/O business
National Semiconductor Corp. has signed a definitive agreement to sell its PC Super I/O business to Taiwan-based Winbond Electronics Corp.
2007-07-25 Winbond tips new parallel flash memory devices
Winbond Electronics Corp. has added new products to its W19B family with the introduction of 16-, 32- and 64Mbit parallel flash memory devices.
2008-01-11 Winbond taps ESI solution for 70nm DRAM
Electro Scientific Industries announced that Winbond Electronics has adopted its UV laser link processing to enable the latter's move to 70nm advanced DRAM production.
2003-04-30 Winbond single-channel voice codec aimed at ISDN equipment
The W681511 single-channel voice codec from Winbond Electronics Corp. is aimed at Voice Over Networks and telephony equipment manufacturers.
2002-08-26 Winbond ships single-channel voice codec
The W6810 single-channel voice codec is aimed at telephony, communications, and consumer applications requiring analog-to-digital or digital-to-analog conversion.
2003-04-11 Winbond ships I/O chip for latest Intel offerings
Winbond Electronics has launched the W83627THF I/O chip that supports Intel's recently launched Springdale 865 and Canterwood 875 devices.
2008-05-05 Winbond shareholders approve logic IC biz spinoff
Winbond Electronics shareholders' have approved Apr. 30 the carve-out of its logic IC business group, dubbed Nuvoton.
2007-03-26 Winbond sells 200mm fab for $251M
Winbond Electronics Corp. Board of Directors has approved the deal to sell the 200mm fab in Hsinchu Science Park to Vanguard International Semiconductor Corporation (VIS) for about $251 million.
2003-03-10 Winbond rolls Intel-compliant DDR400 SDRAM
Winbond Electronics Corp. has introduced a 256Mb DDR400 SDRAM that supports Intel Corp.'s 865 chipsets.
2006-09-13 Winbond reports $95M revenue for August
Taiwan's Winbond Electronics reported revenue of $94.62 million for the month of August, an increase of 4.85 percent compared to the previous month's $90.37 million.
2007-12-26 Winbond renews patent license deal with Mosaid
Mosaid has renewed signed a seven-year, royalty-bearing patent portfolio license agreement with Taiwan's Winbond Electronics.
2006-11-03 Winbond releases 256Mb low power DRAM
Winbond has launched a range of low power DRAM memory components designed to meet the needs of mobile devices.
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