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What is wire bonding?
Wire bonding is commonly used to make the electrical inter-connections from an IC to the leads on a package. There are three methods: thermal compression, ultrasonic and pulse. The wires are typically made of either aluminium or gold, but sometimes copper is used. They are usually 1.25mils (31.75?m) to 1.50mils (38.1?m) in diameter for ICs but can be as large as 15mils (381?m)in diameter for power devices.
total search156 articles
2006-09-12 Tech bonds different material-based elements without wire bonding
Oki Electric Industry announced a new interconnect technology that allows bonding of different material-based device elements without using conventional wire bonding.
2010-12-01 STATS ChipPAC ships 100 millionth copper wire bond interconnect semiconductor packages
STATS ChipPAC expects continued surge in use of copper wire as interconnect material
2012-03-30 Singapore firm crafts wire bonding tech
The process produces a high strength, ultra-fine glass coating surrounding a soft metal core and able to scale down to 4 microns, far smaller than the 16-14 microns current wire can scale
2002-02-15 Samsung Techwin wire features 80ms bonding speed
The SWB-800 gold wire bonder features a bonding speed of 80ms per 2mm, with 50?m fine-pad pitch, and an accuracy of 3.5?m, making it suitable for IC and PCB assembly.
2001-09-21 Recommended wire bonding for Excelics FETs
This application note illustrates the recommended wire bonding techniques for Excelics' FETs.
2004-07-02 Palomar wire bonder with 300-by-150mm positioner
Palomar Technologies released its Model 8000 gold ball-and-stitch thermosonic wire bonder for complex, precision gold wire bonding apps.
2001-10-01 Mixed wire-bonding technology for automotive smart power ICs
This application note describes the use of mixed gold and aluminum bonding wires for automotive smart power chips
2006-07-12 Microbonds rolls out evaluation kit for X-Wire tech
The X-wire 2.0 Head Start Kit enables users to conduct a feasibility evaluation of X-Wire Technology, for its use as an interconnect option for IC packages, Microbonds said
2003-03-14 Cadence adds wire bonding capability to packaging tool
Cadence Design Systems has added a new wire bonding capability to its Advanced Package Designer for designs using stacked packages.
2002-02-28 ASE to develop 40?m super fine pitch bonding technology
Advanced Semiconductor Engineering Inc. has disclosed its plan to develop 40?m super fine pitch bonding technology, which is slated for ramp up next year
2002-07-30 ASE develops fine pitch wire bonding technology
Advanced Semiconductor Engineering Inc. has completed the development of tri-tier wire bonding technique that will enable ICs to have smaller areas and denser I/Os.
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world
2003-08-15 Photon-probing system eyes wire bond technologies
Based on the EmiScope platform, the EmiScope-I-GP system from Optonics Inc. performs transistor-level backside analysis of advanced IC designs containing any number of metal layers.
2003-05-14 K&S to transfer wire bonder manufacturing facility
Kulicke & Soffa Ind. Inc. will relocate the manufacturing operations of its manual wire bonders from Haifa to its Yokneam, Israel facility
2002-06-18 K&S bonding wire suits fine pitch package
Kulicke and Soffa Ind. Inc. has introduced the AW-99X bonding wire suitable for advanced fine pitch packages with <505m bond pad pitch.
2012-10-24 Advances in wireless bonding LED technology
Know how this LED technology provides greater brightness, superior heat dissipation and enhanced durability, while maintaining small footprints.
2001-06-16 UltraVia thin-film substrate for advanced BGA apps
A reliable high-routing-density substrate is needed to meet future market requirements. Thin-film build-up substrates offer unique advantages.
2004-08-31 Spin-on, low-k dielectrics remain viable
The ultimate ultra-low-k material that complies with the future microelectronics industry has not yet been found. The race between spin-on and CVD-deposited materials is still ongoing.
2013-07-10 Palomar set to debut latest die bonder tech at SEMICON West
Palomar Technologies will unveil the 8000i Wire Bonder and the VisionPilot technology aimed to support automated complex microelectronics packaging and production
2011-04-15 New flip-chip techs, apps loom ahead
Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies.
2003-03-06 Nantong Fujitsu to install K&S equipment in China plant
Nantong Fujitsu Microelectronics Co. Ltd has selected Kulicke & Soffa Ind. Inc.'s Nu-Tek wire bonders to be deployed in their newest facility in Nantong City, China
2005-07-26 K&S, Microbonds form bonder alliance
Kulicke & Soffa Ind. Inc. and Microbonds Inc. announced a joint process development project.
2013-03-26 IME consortium examines reliability of copper interconnects
The Institute of Microelectronics has launched the second phase of a research project aimed at improving reliability of semiconductor devices by tackling corrosion-related problems of copper wire bonding.
2005-10-26 IC Interconnect announces Ni/Au process qualification
Wafer bumping service company, IC Interconnect has announced the qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications. The new process produces high-temperature stable bonds with a thinner gold layer. These wire bonds can be used in avionics and automotive apps, and does not require additional lead time for production
1999-11-24 Handling gallium arsenide die
Gallium arsenide die has physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding operations will result in a smooth prototype or production flow. This application note discusses handling, assembly procedures, visual inspection criteria, and electrostatic discharge precautions.
2003-06-09 Fujitsu subsidiary deploys K&S ball bonders
Nantong Fujitsu Microelectronics Co. Ltd has made an additional order of Nu-Tek ball bonders made by Kulicke & Soffa Ind. Inc.
2001-09-21 Device handling recommendations
This application note explains how to prevent ESD on GaAs FET and MMIC devices by giving proper device handling guidelines.
2006-07-10 Cookson, Microbonds to align technology roadmaps
Cookson Electronics and Microbonds partner to align the technology roadmaps of Microbonds' insulated wire bonding technology with Cookson's molding compounds.
2005-07-19 Chipmos receives SOC packaging patent from MOEA
Chipmos Technologies Inc. (Chipmos Taiwan) has been granted a patent entitled "substrate-on-chip (SOC) packaging process" (Invention No. 207525) by the Intellectual Property Office of the Ministry of Economic Affairs (MOEA) of Taiwan.
2003-01-10 Camtek selects KDC as distributor in Japan
Camtek Ltd has signed Kanematsu Devices Corp. to distribute its products for microelectronics manufacturing in Japan.
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