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EE Times Asia - total search?1744?articles sort by date sort by relevance
Lego-like electronic bricks redefines 'playing with blocks' 2016-05-13
The chrome-plated bricks from Brixo Smart Toys can conduct electricity, integrate active parts such as LED lights, motor blocks, and even sound, light and proximity sensors. ?
IDT ex-CEO recalls battle with hedge fund investor 2016-05-10
Ted Tewksbury, ex-CEO of IDT talked about how he fought back against hedge fund investor Starboard Value for about a year and half, as well as his take on the future of the US chip industry. ?
Hedge fund pressures Marvell board reshuffle 2016-04-29
The company said it will add four men to its board of directors and as part of an agreement with activist hedge fund Starboard Value, and is now searching for a new CEO to replace Sehat Sutardja. ?
Cypress eyes IoT market domination with Broadcom deal 2016-04-29
Cypress has acquired Broadcom's Wi-Fi, Bluetooth and Zigbee IoT product lines and intellectual property in a bid to strengthen its position in embedded and consumer IoT markets. ?
IoT security spending to hit nearly $550M by 2018 2016-04-27
Gartner forecast that IoT security spending growth will pick up significantly after 2020, as improved skills, organisational change and more scalable service options improve execution. ?
Nanoimprint lithography allows flexible transistor dev't 2016-04-26
UW-Madison engineers have pioneered a unique method that could allow makers to easily and cheaply fabricate high-performance transistors on huge rolls of flexible plastic, switching at 110GHz. ?
Royal Malaysian Navy to be equipped by ICS 2016-04-21
Test and measurement equipment manufacturer Rohde & Schwarz has been awarded a contract by BNS to enhance and modernise the Royal Malaysian Navy's communications. ?
Robotic process automation streamlines logistics 2016-04-14
Businesses who have integrated Robotic Process Automation in their operations has helped allow their business process evolve into a more efficient one, consequently noting a significant decrease in profit loss. ?
Renesas to appoint 3rd CEO in less than a year 2016-04-12
The Japanese chip company will hire Bunsei Kure, a former CEO of Calsonic Kansai, a large Japanese automotive component supplier, as its new president and CEO. ?
SuVolta: The demise of the promising start-up 2016-04-11
SuVolta said it was going after opportunities in mobile processors, DRAM and IoT but was probably not helped by the fact that the Japanese semiconductor industry was experiencing its own turmoil. ?
Moore's Law extended: Intel roadmap reveals CMOS at its core 2016-04-07
Intel's future processors at 10nm and beyond will continue to use CMOS, but the cores will be surrounded by novel circuit architectures using new materials that may extend Moore's Law indefinitely. ?
Lone ASIC vendor in Japan stands firm 2016-04-06
Owned partly by Fujitsu and Panasonic, Socionext's business units include visual systems, IoT & graphics solutions, network SoCs, high performance SoCs, custom SoCs, Milbeaut and connected imaging. ?
Marvell to use SerDes technology for multi-die products 2016-04-01
The Glasswing chip-to-chip technology from Swiss startup, Kandou, is based on the Chord signaling method, which produces an energy efficiency that enables architectural innovation. ?
HPE's hybrid DRAM/flash a first in new memory family 2016-03-31
The release of the 8 Gbyte NVDIMM-N boards with new Broadwell-based Proliant DL360 1U and 380 2U servers signify HPE's move toward a new kind of persistent memory in servers. ?
Imagination focuses on secure, differentiated IP platforms 2016-03-31
EE Times China's editors met Imagination Technologies' at their summit in Shanghai to learn about the key technologies the company uses in its products. ?
TSMC unveils silicon plans 2016-03-21
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate. ?
Imagination reveals application thrust with products 2016-03-02
Speaking to EE Times China at their summit in Shanghai, Imagination Technologies' executives shared their perspective of application trends and how they aim to address those trends with their products. ?
Connectors pave way for high-speed electronics 2016-03-01
TE Connectivity recently unveiled its connectors that claim to provide an integrated module thermal solution that allows 30 per cent better thermal performance than QSFP28 solutions. ?
Contactless magnetic gears open up new use cases 2016-02-19
A study from OIST revealed a theory that extends the possibilities and applications for smooth magnetic couplings, which can produce an even motion without any counterforce. ?
Imagination talks product differentiation at China roadshow 2016-02-18
The Imagination Summit 2015 featured speakers from Imagination Technologies, Mentor Graphics, Rightware, CSIA, Synopsys, Dolby, SMIC and Ingenic stressing new opportunities and the need for product differentiation to beat price competition. ?
Super-thin acoustic metasurface seamlessly absorbs sound 2016-02-15
Researchers from CNRS and the University of Lorraine developed a design for a coiled-up acoustic metasurface that can achieve total acoustic absorption in very low-frequency ranges. ?
Quantum dot nanotubes eliminate need for semiconductors 2016-02-11
Michigan Tech is working toward ultra-small flexible electronics that remove semiconductors in favour of the more flexible capabilities of metallic quantum dots and isoelectronic crystals. ?
Intel exec sees huge potential for Moore's Law post-CMOS 2016-02-03
William Holt, GM of Intel's technology and manufacturing group, said the industry needs to keep a focus on keeping power down and reducing cost per transistor. ?
Promising 2D material opens path for next-gen spintronics 2016-02-03
Researchers from NUS and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulphide (MoS2), an emerging 2D material that shows potential for low-power devices. ?
Enterprise breathes new life to Google Glass 2016-01-28
Google recently filed documents for its Google Glass 2 where it is reported to having healthcare, manufacturing and energy-related companies test out an improved version of Google Glass. ?
Former US vice president speaks on China, tech start-ups 2016-01-15
Mobile entrepreneurs should think altruistically because the most successful companies will be those that keep in mind the larger context in which they are making change. ?
Mixed-signal IC design: Forecasts for 2016 2016-01-08
This article will examine the key trends, challenges, and emerging solutions in mixed-signal system design enablement, focusing on mixed-signal verification. ?
NXP brings the word 'easy' to smart home set-up 2016-01-06
Included in NXP's smart home solutions are production-ready modules and reference designs for smart lighting, smoke detection, motion sensing, home gateways and many other smart home applications. ?
Intel finalises $16.7B Altera acquisition 2015-12-30
Altera would operate within Intel as a new business unit, and will be headed by Dan McNamara, an 11-year Altera veteran who most recently served as VP of Altera's embedded division. ?
Minimising risk through hardware emulation 2015-12-30
Hardware emulation can speed time-to-market by delivering thoroughly verified RTL and gate-level designs to the backend design flow, along with validated embedded software ahead of silicon availability. ?


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