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EE Times Asia - total search?1098?articles sort by date sort by relevance
NXP takes the lead in automotive chip space 2016-05-10
Strategy Analytics declared NXP Semiconductor as the king of automotive chip vendors for 2015, followed by Infineon with about $2.85 billion in sales while 2014 leader Renesas fell back to third place ?
Display market finds strong growth trajectory in AMOLEDs 2016-05-02
While LCD technology is still the dominant technology in the display industry, AMOLED display shipments will grow 40 per cent YoY to reach 395 million units in 2016, forecasted IHS. ?
7.3 quake shakes Japan's IC, auto industries 2016-04-19
Japanese manufacturing giants have suspended operations after two powerful earthquakes hit Kumamoto, Japan, last week, causing widespread damage and supply chain disruptions. ?
Renesas to appoint 3rd CEO in less than a year 2016-04-12
The Japanese chip company will hire Bunsei Kure, a former CEO of Calsonic Kansai, a large Japanese automotive component supplier, as its new president and CEO ?
NXP tops OE automotive sector with Freescale buy 2016-04-11
Semicast Research revealed that Infineon passed Renesas Electronics to become the second largest vendor, with STMicroelectronics and Texas Instruments completing the top five ?
IoT supply chain benefits from mobility expansion 2016-04-08
No longer niche markets, automotive and related "mobility" markets, have rapidly taken centre stage at leading electronics events, and hence, gained in supply chain prominence and importance. ?
Global semicon market to take a dip in 2016 2016-04-06
A three-year period of declining or stagnant revenues is predicted after weak growth marked every quarter of 2015. The market drop follows a successive two-year growth in 2013 and 2014. ?
Negative forecast for global semicon market in 2016 2016-04-06
A three-year period of declining or stagnant revenues is predicted after weak growth marked every quarter of 2015. The market drop follows a successive two-year growth in 2013 and 2014. ?
Not much fanfare about GaN at APEC 2016 2016-03-31
Talk about GaN was low key but there were still promising developments, including new applications for low-voltage GaN transistors and AlGaN driver ICs for GAN FETs. ?
Imagination focuses on secure, differentiated IP platforms 2016-03-31
EE Times China's editors met Imagination Technologies' at their summit in Shanghai to learn about the key technologies the company uses in its products. ?
Thailand semiconductor to tap into $280B car electronics space 2016-03-09
Constituting a nearly $100 billion industry, Thailand's E&E sector has played a vital role in growing the country's economy and positioning Thailand as one of the semiconductor leaders in Southeast Asia. ?
Imagination reveals application thrust with products 2016-03-02
Speaking to EE Times China at their summit in Shanghai, Imagination Technologies' executives shared their perspective of application trends and how they aim to address those trends with their products. ?
Robotics space gains from robust manufacturing spending 2016-02-29
IDC predicted that global spending on robotics and related services will grow at a CAGR of 17 per cent from more than $71 billion in 2015 to $135.4 billion in 2019. ?
TDK teams up with Qualcomm to form $3B RF joint venture 2016-01-26
RF360 Holdings will acquire the filter and module design and manufacturing assets, plus related patents, owned by TDK, with certain assets being acquired directly by Qualcomm affiliates. ?
Toshiba to sell chip business except NAND 2016-01-25
The company will consolidate its investment and business operations on flash memory and nuclear energy businesses, and has now positioned them as the two pillars to carry the company's future. ?
Samsung grabs Qualcomm's fab tech with 14nm FinFET process 2016-01-18
Samsung said Qualcomm is making its Snapdragon 820 processor on Samsung's new 14nm LPP process, and the first products will be in mobile devices in 1H16. ?
TSMC CEO expects stronger Q1 after Capex boost 2016-01-18
The world's largest foundry said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips. ?
Mixed-signal IC design: Forecasts for 2016 2016-01-08
This article will examine the key trends, challenges, and emerging solutions in mixed-signal system design enablement, focusing on mixed-signal verification. ?
Global chip market to fall by 0.6% next year 2015-12-14
TrendForce forecasted that the dropping memory average selling prices will drag down the total chip market next year and cause it to fall by 0.6 per cent to $329 billion. ?
Top 5 semiconductor M&As of 2015 2015-12-14
EE Times Asia reviewed the M&A deals that were either announced or completed this year, and came up with the top five synergies in terms of dollar value. ?
Samsung dips into autonomous driving pool 2015-12-14
The Korean company will create a new division to develop new business with a focus on autonomous driving technologies, in-vehicle entertainment and satellite navigation. ?
What can companies learn from the NXP-Freescale merger? 2015-12-04
One missing piece in NXP, after the merger with Freescale, seems to be optoelectronics, which continues to grow at a stronger steady pace than ICs and other semiconductor categories. ?
Renesas inks deal to transfer wafer fab to TDK 2015-12-02
TDK is intensely focused on efforts to expand its businesses and their profitability through a concentration on the electronic components business targeted at its core markets. ?
The curious case of the maturing MEMS market 2015-11-25
The fact that the MEMS market has not yet entered the mature phase by now, where its products become commoditised, indicates that something is preventing it from ripening. ?
Will Japan sell Renesas to foreign companies? 2015-11-24
Many Japanese industry sources hold the nationalistic view that Renesas shouldn't fall into the hands of foreign companies since Renesas supplies key components to the Japanese automotive industry ?
China's chip acquisitions send ripples across industry 2015-11-20
The technologies and IP targeted by China include disk drives, CMOS image sensors, servers, memory chips and advanced semiconductor packaging and test services. ?
A*STAR set-ups high density, low-cost packaging consortium 2015-11-12
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles. ?
Wafer fab to use swirling induction type HVAC 2015-11-09
Mie Fujitsu Semiconductor's cleanroom is equipped with SWIT from Takasago Thermal Engineering that promises to have a smaller environmental footprint than conventional systems. ?
Singapore develops super sensitive hybrid sensor 2015-11-03
A new type of hybrid sensor technology developed by researchers from the National University of Singapore is said to be more than 200 times more sensitive than commercially available sensors. ?
Terahertz imaging company to make headway in chip inspection 2015-10-26
The company, which claims to be a pioneer of the solid-state generation and detection of terahertz light for imaging and characterising materials, has received an investment of nearly $10 million. ?


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