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CAD tool for capacitance extraction in image sensor designs 2016-04-05
Silicon Frontline Technology released the F3D field solver that allows capacitance extraction of complex 3D large-area structures such as pixels, arrays and precision analogue circuits ?
Bluetooth module enables compact, low-power wireless designs 2016-03-31
The Blue Gecko BGM113 from Silicon Labs combines a 2.4 GHz Blue Gecko wireless SoC and a high-efficiency chip antenna into a complete, ready-to-use system ?
IDT sol'ns to streamline network synchronisation compliance 2015-10-29
The 82P339xx-1 products are composed of IEEE 1588-compliant software and SMU chips that offer a complete telecom network synchronisation solution for IEEE 1588 and synchronous Ethernet. ?
MIPI D-PHY IP works at 2.5Gb/s per Lane on TSMC 16nm FinFET+ 2015-10-26
The DesignWare MIPI D-PHY from Synopsys enables designers to meet their power and performance requirements while ensuring interoperability with the latest image sensors and displays ?
Synopsys debuts PHY IPs for TSMC's 16nm FinFET Plus process 2015-04-09
The DesignWare PHY IP portfolio enables designers to integrate required functionality in mobile and enterprise SoCs with less risk, while accelerating the development of SoCs. ?
13MP image sensor boasts remarkable sensitivity 2015-01-09
Aimed at smartphone camera applications, the AR1335 from ON Semi promises to deliver near-digital-still-camera quality with power consumption and footprint optimised for mobile devices. ?
Cadence platform boasts notable increase in SoC verification 2014-12-15
The Perspec System Verifier platform automates system-level coverage-driven test development using constraint-solving technology, increasing productivity in SoC verification. ?
Image sensor tech promises a wealth of features 2014-11-26
GalaxyCore developed the Through-Silicon-Illumination technology that claims to boost sensitivity and signal-noise ratio with reduced thermal noise, dark current and crosstalk, and higher frame rates ?
BSI sensor chip minimises reflection losses 2014-11-05
The chip features new anti-reflective coating that targets the UV range, claiming to show excellent performance at near UV wavelengths, with quantum efficiency values above 50 per cent. ?
Synopsys D-PHY slashes PCB area, power consumption by half 2014-09-18
The solution boasts being the first D-PHY that is compliant to the MIPI Alliance D-PHY v1.2 specification, enabling operation speeds up to 2.5Gbit/s per lane. ?
RF antenna switch for smartphones offers LTE-A support 2014-09-12
With TI's TaRF6 process, MOSFETs customised for RF switch applications have been developed and used in the SP12T RF antenna switch IC, leading to a performance of 0.42dB in insertion loss. ?
AMD processor sets new frequency record 2014-09-03
The 125W AMD FX-8370 CPU and 95W AMD FX-8370E and FX-8320E processors all feature eight native CPU cores for productivity at superior price points. ?
25V dual-power MOSFET trims power losses by 5 per cent 2014-08-12
The IRFHE4250D is housed in a 6x6 PQFN package, which boasts excellent thermal performance, low on-state resistance and gate charge. ?
Timing IC integrates clock generators, jitter attenuators 2014-07-31
The chips provide an I2C-configurable platform featuring a combination of frequency translation capabilities and ?
Android open source project port targets ARMv8 architecture 2014-07-11
The Linaro ARMv8-A reference software stack combined with the ARM Development Platform (ADP) provides the ARM ecosystem with a foundation to accelerate 64bit Android availability on silicon ?
Emulator runs pre-silicon verification of memory SoCs 2014-07-10
The Veloce2 from Mentor Graphics is enables verification engineers to develop and stress test software and hardware on SoCs using HMC, LPDDR4, and eMMC 5.0. ?
RAONTECH boosts resolution in HMDs with 720 chipset 2014-06-25
The LCoS module and controller from build on the company's low power and high integration technology, delivering 3D HD video data for mobile HMDs and smart glasses. ?
FPGA breaks high-density, power-hungry barrier 2014-04-15
The ECP5 FPGAs from Lattice Semiconductor feature a very compact form factor with high functional density, offering up to 85K LUTs in 10mmx10 mm, 0.5mm pitch package with SERDES. ?
dotLEDs feature the smallest profile fit for wearables 2014-03-28
The dotLEDs from Plessey come in the standard 1005 size, with a 0.2mg weight and 0.2mm profile, and are manufactured with the company's proprietary GaN-on-Si technology. ?
Active-Semi rolls wireless mobile charging SoC sol'n 2014-03-12
The PAC5220WP claims to offer a unique configurable architecture that integrates all the functionality required to implement the most sophisticated wireless power applications into a single SoC. ?
Smart TV SoC supports 4K content 2014-02-17
Realtek teamed up with UMC and Synopsys to design a smart TV SoC in the 40nm process that addresses the issue of large pixels found in super-sized displays. ?
EVG outs high-volume-mfg photoresist processing system 2014-02-13
The EVG150XT is optimized for ultra-high throughput and productivity and is aimed at logic and memory high-volume manufacturing. ?
Imagination's GPU cores aimed at mass-market apps 2014-01-09
The PowerVR Series6XE Rogue GPU IP cores are designed to enable high-quality graphics for products such as entry-level mobile devices and tablets, as well as wearables, DTVs and STBs. ?
Freescale wearable design platform targets triad of concerns 2014-01-08
Many companies are still apprehensive regarding their foray towards the wearable device market because for them, it is still uncharted territory for both incumbents and non-branded OEMs. ?
OLED inkjet printer promises dramatic yield boosts 2013-11-29
Kateeva claims Yieldjet significantly lowers costs by boosting yields in the high-volume manufacture of flexible and large-sized OLEDs. ?
Xilinx offers speedier design for machine vision apps 2013-11-27
The firm made use of HALCON and VisualApplets development platforms to create an end-to-end Smarter Vision development environment for the Zynq-7000 All Programmable SoC. ?
Five MEMS devices unveiled at MEMS Exec Congress 2013-11-20
Bosch released two MEMS chips geared for the connected Internet of Things (IoT) applications while Merit Sensor's temperature-compensated pressure sensors are aimed at medical and industrial markets. ?
CMOS image sensor for automotive view cameras 2013-11-13
Toshiba's TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights. ?
Richardson reveals 1.7kV SiC MOSFET from Cree 2013-11-07
The C2M1000170D is geared for power supplies to 200W operating from DC inputs from 200V to 1kV, and it replaces silicon MOSFETs in auxiliary power supplies ?
ARMv8-R geared for automotive, industrial control apps 2013-10-28
The ARMv8-R architecture is intended for real-time embedded processors for use in automotive electronics and other integrated safety and control applications. ?


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