| Fairchild takes on MEMS space with 6-axis IMU
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2015-06-22 |
| The FIS1100 includes tri-axis accelerometer and tri-axis gyroscope, AttitudeEngine DSP and XKF3 sensor fusion software. |
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| SMIC, start-up group manufacture CMOS image sensors
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2015-03-03 |
| Shanghai-based start-up company Cista System teams up with Semiconductor Manufacturing International for mass production of two CMOS image sensors, which both sport back-side illumination. |
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| Ionised PVD system facilitates void-free fill for TSVs
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2014-05-30 |
| The system from Applied Materials employs improved ion density, directionality, and tunable energy to deposit barrier and copper seed layers inside high aspect ratio TSVs. |
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| EVG outs high-volume-mfg photoresist processing system
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2014-02-13 |
| The EVG150XT is optimized for ultra-high throughput and productivity and is aimed at logic and memory high-volume manufacturing. |
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| CMOS image sensor for automotive view cameras
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2013-11-13 |
| Toshiba's TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights. |
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| Metrology system configured for advanced packaging
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2013-07-26 |
| Rudolph Technologies' metrology suite includes specially-designed configurations for wafer level packaging, 2.5D (interposer) and 3D ICs using through-silicon via (TSV) as interconnects. |
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| Open ecosystem team up spawns 3D IC
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2013-01-31 |
| STATS ChipPAC and UMC unveiled a 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, which boasts package-level reliability success. |
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| Embedded die tech-based 3D package unveiled
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2011-11-16 |
| ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed. |
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| MEMS production uses TSV
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2011-10-14 |
| The ST-patented TSV technology claims to offer space savings and higher interconnect density than wire bonding or flip chip stacking. |
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| eWLB tech aimed for mobile, cloud apps
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2011-10-10 |
| STATS ChipPAC's FO-WLP technology platform combines eWLB, TSV and IPD to enhance packaging solutions. |
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| 32Gb DDR3 offers up to 1,333Mbit/s
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2011-08-19 |
| Samsung's new RDIMM with 3D TSV technology based on the company's 30nm 4Gb DDR3 promises high performance and energy efficiency. |
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| FEI ion beam cuts imaging time for MEMs, 3D chips
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2011-06-16 |
| The Vion PFIB tool can cut the time to image MEMS and 3D chip features by 20x, from more than 10hrs to under 40mins for TSVs, revealing in minutes chip features ranging in size from 30nm to 1mm. |
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| Test solution automates 3D IC deployment
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2011-06-09 |
| Imec and Cadence has released a test solution that automates 3D stacked ICs deployment. |
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| Cadence introduces wide I/O IP
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2011-04-05 |
| Cadence claims to be the first to market a licensable, wide I/O memory controller core. |
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| Flip chip packaging boasts 40% lower cost
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2011-03-10 |
| STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes. |
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| Solutions model to latest 28-nm parasitic effects ratified
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2011-02-03 |
| Synopsys collaborates with IMTAB members of IEEE-ISTO to ratify extensions to its Interconnect Technology Format, enabling parasitic extraction tools at 28nm and below process technologies. |
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| 30nm-process 2-Gb DDR3 SDRAM yields 45% more chips per wafer
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2010-10-12 |
| Elpida Memory Inc. announced completion of a 30nm process 2-gigabit DDR3 SDRAM. |
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| CMOS image sensors increase design flexibility
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2009-10-21 |
| STMicroelectronics' new sensors offer design options such as Bayer or SoC sensors, support for EdoF and autofocus. |
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| 'First' quarter-inch image sensors integrate EDoF
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2009-03-06 |
| STMicroelectronics has introduced the market's first quarter-inch optical format, 3Mpixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. The image sensors offer an alternative to auto-focus camera solutions. |
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| Battle commences in 50nm DRAM arena
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2009-02-13 |
| Samsung and Hynix, two of the industry's DRAM leaders, have already begun migrating their production of major products to the 50nm class process node. Latest analysis on both 1Gbit DDR2 SDRAM parts from Samsung and Hynix revealed very interesting trends from the two Korean rivals. |
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| Camera phones get smarter with ST's image sensor
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2008-02-13 |
| ST's latest technologies in pixel-defect correction, adaptive-noise reduction and sharpness enhancement ensure that its new camera sensor delivers outstanding image quality. |
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